ATE529237T1 - Kapillarbedrucktechnik - Google Patents

Kapillarbedrucktechnik

Info

Publication number
ATE529237T1
ATE529237T1 AT04781082T AT04781082T ATE529237T1 AT E529237 T1 ATE529237 T1 AT E529237T1 AT 04781082 T AT04781082 T AT 04781082T AT 04781082 T AT04781082 T AT 04781082T AT E529237 T1 ATE529237 T1 AT E529237T1
Authority
AT
Austria
Prior art keywords
mold
substrate
conformable material
printing technology
capillary
Prior art date
Application number
AT04781082T
Other languages
English (en)
Inventor
Byung-Lin Choi
Sidglata Sreenivasan
Michael Watts
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Application granted granted Critical
Publication of ATE529237T1 publication Critical patent/ATE529237T1/de

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/08Apparatus, e.g. for photomechanical printing surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Micromachines (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Printing Methods (AREA)
AT04781082T 2003-08-21 2004-08-13 Kapillarbedrucktechnik ATE529237T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/645,306 US7442336B2 (en) 2003-08-21 2003-08-21 Capillary imprinting technique
PCT/US2004/026337 WO2005021156A2 (en) 2003-08-21 2004-08-13 Capillary imprinting technique

Publications (1)

Publication Number Publication Date
ATE529237T1 true ATE529237T1 (de) 2011-11-15

Family

ID=34273282

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04781082T ATE529237T1 (de) 2003-08-21 2004-08-13 Kapillarbedrucktechnik

Country Status (9)

Country Link
US (4) US7442336B2 (de)
EP (1) EP1656242B1 (de)
JP (1) JP4514754B2 (de)
KR (2) KR101108496B1 (de)
CN (1) CN100532055C (de)
AT (1) ATE529237T1 (de)
MY (1) MY138554A (de)
TW (1) TWI319746B (de)
WO (1) WO2005021156A2 (de)

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US8211214B2 (en) * 2003-10-02 2012-07-03 Molecular Imprints, Inc. Single phase fluid imprint lithography method
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US9040090B2 (en) * 2003-12-19 2015-05-26 The University Of North Carolina At Chapel Hill Isolated and fixed micro and nano structures and methods thereof
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JP2015088667A (ja) * 2013-10-31 2015-05-07 株式会社東芝 微細加工システム、微細加工装置、および微細加工方法
WO2016048053A1 (ko) * 2014-09-26 2016-03-31 한국기계연구원 복수의 나노갭이 형성된 기판 및 이의 제조방법
WO2016070869A2 (de) * 2014-11-03 2016-05-12 Universität Osnabrück Vorrichtung zur durchführung eines kapillar-nanodruck-verfahrens, ein verfahren zur durchführung eines kapillar-nanodrucks unter verwendung der vorrichtung, produkte erhältlich nach dem verfahren sowie die verwendung der vorrichtung
JP6938024B2 (ja) * 2015-10-22 2021-09-22 国立研究開発法人産業技術総合研究所 被印刷基材の表面構造及びその製造方法
JP2017152673A (ja) * 2015-11-05 2017-08-31 ボード・オブ・リージェンツ, ジ・ユニバーシティー・オブ・テキサス・システム ジェット・アンド・フラッシュ・インプリントリソグラフィにおけるマルチフィールドオーバーレイ制御
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TWI319746B (en) 2010-01-21
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US20100140841A1 (en) 2010-06-10
US8057725B2 (en) 2011-11-15
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US20110140302A1 (en) 2011-06-16
US20080174046A1 (en) 2008-07-24
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KR101108496B1 (ko) 2012-01-31
US7442336B2 (en) 2008-10-28
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WO2005021156A2 (en) 2005-03-10
US20050061773A1 (en) 2005-03-24

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