ATE534914T1 - Halbleitersensor - Google Patents

Halbleitersensor

Info

Publication number
ATE534914T1
ATE534914T1 AT05766267T AT05766267T ATE534914T1 AT E534914 T1 ATE534914 T1 AT E534914T1 AT 05766267 T AT05766267 T AT 05766267T AT 05766267 T AT05766267 T AT 05766267T AT E534914 T1 ATE534914 T1 AT E534914T1
Authority
AT
Austria
Prior art keywords
semiconductor sensor
semiconductor
sensor
preventing
present
Prior art date
Application number
AT05766267T
Other languages
English (en)
Inventor
Masahide Tamura
Masato Ando
Yuichi Ishikuro
Original Assignee
Hokuriku Elect Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokuriku Elect Ind filed Critical Hokuriku Elect Ind
Application granted granted Critical
Publication of ATE534914T1 publication Critical patent/ATE534914T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/02—Arrangements for preventing, or for compensating for, effects of inclination or acceleration of the measuring device; Zero-setting means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
AT05766267T 2004-07-21 2005-07-21 Halbleitersensor ATE534914T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004212891 2004-07-21
PCT/JP2005/013362 WO2006009194A1 (ja) 2004-07-21 2005-07-21 半導体センサ

Publications (1)

Publication Number Publication Date
ATE534914T1 true ATE534914T1 (de) 2011-12-15

Family

ID=35785301

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05766267T ATE534914T1 (de) 2004-07-21 2005-07-21 Halbleitersensor

Country Status (5)

Country Link
US (1) US7640807B2 (de)
EP (1) EP1777528B1 (de)
JP (1) JPWO2006009194A1 (de)
AT (1) ATE534914T1 (de)
WO (1) WO2006009194A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7562575B2 (en) * 2005-08-05 2009-07-21 Hitachi Metals, Ltd. Impact-resistant acceleration sensor
US7845229B2 (en) * 2006-08-11 2010-12-07 Rohm Co., Ltd. Acceleration sensor
WO2009031285A1 (ja) 2007-09-03 2009-03-12 Panasonic Corporation 慣性力センサ
JP4973443B2 (ja) * 2007-10-22 2012-07-11 株式会社デンソー センサ装置
JP2011112392A (ja) * 2009-11-24 2011-06-09 Panasonic Electric Works Co Ltd 加速度センサ
JP5789737B2 (ja) * 2009-11-24 2015-10-07 パナソニックＩｐマネジメント株式会社 加速度センサ
CN102667497B (zh) 2009-11-24 2014-06-18 松下电器产业株式会社 加速度传感器
JP2011112389A (ja) * 2009-11-24 2011-06-09 Panasonic Electric Works Co Ltd 加速度センサ
JP5716149B2 (ja) * 2009-11-24 2015-05-13 パナソニックＩｐマネジメント株式会社 加速度センサ
JP2011112390A (ja) * 2009-11-24 2011-06-09 Panasonic Electric Works Co Ltd 加速度センサ
JP5742170B2 (ja) * 2010-10-22 2015-07-01 大日本印刷株式会社 Ｍｅｍｓデバイス、その製造方法、及びそれを有する半導体装置
JP5742172B2 (ja) * 2010-10-25 2015-07-01 大日本印刷株式会社 Ｍｅｍｓデバイス及びその製造方法
JP6214433B2 (ja) * 2013-10-04 2017-10-18 株式会社フジクラ 半導体圧力センサ
JP6346279B2 (ja) * 2014-06-27 2018-06-20 北陸電気工業株式会社 力検出器
TWI633290B (zh) * 2015-11-26 2018-08-21 李美燕 微型回饋腔感測器及其製造方法
CN116368625B (zh) * 2020-10-12 2026-01-13 株式会社村田制作所 压力传感器装置
CN113030221B (zh) * 2021-04-14 2023-03-10 武汉理工大学 一种氢气传感器及其应用
JP7760874B2 (ja) * 2021-09-14 2025-10-28 セイコーエプソン株式会社 慣性センサーモジュール

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02151770A (ja) 1988-12-05 1990-06-11 Hitachi Ltd 磁気式加速度センサおよびその製造方法
JPH0499964A (ja) 1990-08-18 1992-03-31 Mitsubishi Electric Corp 半導体加速度センサ
DE4129218A1 (de) * 1991-09-03 1993-03-04 Deutsche Aerospace Beschleunigungssensor, auf mikromechanischem wege hergestellt
JPH05256869A (ja) 1992-03-12 1993-10-08 Murata Mfg Co Ltd 半導体式加速度センサおよびその製造方法
JP3278926B2 (ja) 1992-09-29 2002-04-30 株式会社デンソー 半導体圧力センサ
FR2710741B1 (fr) * 1993-09-30 1995-10-27 Commissariat Energie Atomique Capteur électronique destiné à la caractérisation de grandeurs physiques et procédé de réalisation d'un tel capteur.
JPH08110351A (ja) * 1994-10-12 1996-04-30 Nippondenso Co Ltd 半導体力学センサ装置
JP3346118B2 (ja) 1995-09-21 2002-11-18 富士電機株式会社 半導体加速度センサ
JPH1026634A (ja) * 1996-07-11 1998-01-27 Fujikura Ltd ダイヤフラム型加速度センサの製造方法
JP3223849B2 (ja) * 1996-08-09 2001-10-29 株式会社デンソー 半導体加速度センサ
JP2000066257A (ja) * 1998-08-19 2000-03-03 Nikon Corp ブレ補正装置、ブレ補正カメラ及び交換レンズ
JP2000187041A (ja) * 1998-12-24 2000-07-04 Mitsubishi Electric Corp 容量式加速度センサ及びその製造方法
KR20050121761A (ko) * 2000-01-19 2005-12-27 히다치 가세고교 가부시끼가이샤 반도체용 접착필름, 반도체용 접착필름 부착 리드프레임 및이것을 사용한 반도체장치
JP2002005951A (ja) * 2000-06-26 2002-01-09 Denso Corp 半導体力学量センサ及びその製造方法
JP2003021647A (ja) * 2001-07-06 2003-01-24 Denso Corp 電子装置
JP2003166998A (ja) 2001-12-03 2003-06-13 Matsushita Electric Works Ltd 半導体加速度センサ
US7004030B2 (en) * 2002-09-27 2006-02-28 Oki Electric Industry Co., Ltd. Acceleration sensor
US6892578B2 (en) * 2002-11-29 2005-05-17 Hitachi Metals Ltd. Acceleration sensor
JP4578087B2 (ja) * 2003-11-10 2010-11-10 Ｏｋｉセミコンダクタ株式会社 加速度センサ

Also Published As

Publication number Publication date
EP1777528A4 (de) 2010-08-18
EP1777528B1 (de) 2011-11-23
EP1777528A1 (de) 2007-04-25
WO2006009194A1 (ja) 2006-01-26
JPWO2006009194A1 (ja) 2008-05-01
US20070234804A1 (en) 2007-10-11
US7640807B2 (en) 2010-01-05

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