ATE538188T1 - Polierzusammensetzung - Google Patents

Polierzusammensetzung

Info

Publication number
ATE538188T1
ATE538188T1 AT04023363T AT04023363T ATE538188T1 AT E538188 T1 ATE538188 T1 AT E538188T1 AT 04023363 T AT04023363 T AT 04023363T AT 04023363 T AT04023363 T AT 04023363T AT E538188 T1 ATE538188 T1 AT E538188T1
Authority
AT
Austria
Prior art keywords
polishing composition
measured
particle diameter
silicon oxide
laser diffraction
Prior art date
Application number
AT04023363T
Other languages
English (en)
Inventor
Tsuyoshi Matsuda
Tatsuhiko Hirano
Junhui Oh
Atsunori Kawamura
Kenji Sakai
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003342530A external-priority patent/JP4608196B2/ja
Priority claimed from JP2003352952A external-priority patent/JP2005116987A/ja
Priority claimed from JP2003394593A external-priority patent/JP4759219B2/ja
Priority claimed from JP2003396171A external-priority patent/JP4406554B2/ja
Application filed by Fujimi Inc filed Critical Fujimi Inc
Application granted granted Critical
Publication of ATE538188T1 publication Critical patent/ATE538188T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C01B33/021—Preparation
    • C01B33/023—Preparation by reduction of silica or free silica-containing material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K8/00—Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
    • C09K8/52—Compositions for preventing, limiting or eliminating depositions, e.g. for cleaning
    • C09K8/528—Compositions for preventing, limiting or eliminating depositions, e.g. for cleaning inorganic depositions, e.g. sulfates or carbonates
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT04023363T 2003-09-30 2004-09-30 Polierzusammensetzung ATE538188T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2003342530A JP4608196B2 (ja) 2003-09-30 2003-09-30 研磨用組成物
JP2003342531 2003-09-30
JP2003352952A JP2005116987A (ja) 2003-10-10 2003-10-10 研磨用組成物
JP2003394593A JP4759219B2 (ja) 2003-11-25 2003-11-25 研磨用組成物
JP2003396171A JP4406554B2 (ja) 2003-09-30 2003-11-26 研磨用組成物

Publications (1)

Publication Number Publication Date
ATE538188T1 true ATE538188T1 (de) 2012-01-15

Family

ID=34317736

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04023363T ATE538188T1 (de) 2003-09-30 2004-09-30 Polierzusammensetzung

Country Status (7)

Country Link
US (1) US7485162B2 (de)
EP (3) EP2418260B1 (de)
KR (3) KR101110707B1 (de)
CN (1) CN100393833C (de)
AT (1) ATE538188T1 (de)
SG (1) SG110211A1 (de)
TW (1) TWI347969B (de)

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Also Published As

Publication number Publication date
US20050108949A1 (en) 2005-05-26
CN1616575A (zh) 2005-05-18
EP1520892B1 (de) 2011-12-21
EP2418260B1 (de) 2013-02-13
CN100393833C (zh) 2008-06-11
EP1520892A3 (de) 2006-06-21
EP2418260A1 (de) 2012-02-15
KR101074875B1 (ko) 2011-10-19
EP2418259A1 (de) 2012-02-15
KR20110084482A (ko) 2011-07-25
KR101216514B1 (ko) 2012-12-31
US7485162B2 (en) 2009-02-03
KR20110084481A (ko) 2011-07-25
SG110211A1 (en) 2005-04-28
TW200532007A (en) 2005-10-01
TWI347969B (en) 2011-09-01
EP2418259B1 (de) 2013-02-13
EP1520892A2 (de) 2005-04-06
KR20050031992A (ko) 2005-04-06
KR101110707B1 (ko) 2012-04-16

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