BRPI0519014A2 - mÉtodo para deposiÇço de um substrato com um metal, objeto, banho de deposiÇço de prata sem eletricidade autocatalÍtica, e, mÉtodo para deposiÇço autocatalÍtica de prata metÁlica - Google Patents
mÉtodo para deposiÇço de um substrato com um metal, objeto, banho de deposiÇço de prata sem eletricidade autocatalÍtica, e, mÉtodo para deposiÇço autocatalÍtica de prata metÁlicaInfo
- Publication number
- BRPI0519014A2 BRPI0519014A2 BRPI0519014-2A BRPI0519014A BRPI0519014A2 BR PI0519014 A2 BRPI0519014 A2 BR PI0519014A2 BR PI0519014 A BRPI0519014 A BR PI0519014A BR PI0519014 A2 BRPI0519014 A2 BR PI0519014A2
- Authority
- BR
- Brazil
- Prior art keywords
- deposition
- bath
- silver
- autocatalytic
- depositing
- Prior art date
Links
- 238000000151 deposition Methods 0.000 title abstract 10
- 238000000034 method Methods 0.000 title abstract 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title abstract 7
- 230000008021 deposition Effects 0.000 title abstract 7
- 229910052709 silver Inorganic materials 0.000 title abstract 7
- 239000004332 silver Substances 0.000 title abstract 7
- 229910052751 metal Inorganic materials 0.000 title abstract 5
- 239000002184 metal Substances 0.000 title abstract 5
- 230000005611 electricity Effects 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 3
- -1 object Substances 0.000 title 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 abstract 1
- 238000009472 formulation Methods 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Catalysts (AREA)
Abstract
MÉTODO PARA DEPOSIÇçO DE UM SUBSTRATO COM UM METAL, OBJETO, BANHO DE DEPOSIÇçO DE PRATA SEM ELETRICIDADE AUTOCATALÍTICA, E, MÉTODO PARA DEPOSIÇçO AUTOCATALÍTICA DE PRATA METÁLICA. É descrito um método de fazer deposição de um substrato com um metal usando um banho de deposição sem eletricidade autocatalítica em que o banho é operado acima da sua temperatura do ponto de turvação de maneira tal que pelo menos duas fases estejam presentes no banho. Um banho de deposição sem eletricidade autocatalítica para revestimento de prata metálica também é descrito. Um método para deposição autocatalítica de prata metálica diretamente em uma superficie de silício sem a necessidade de uma camada interveniente de metal também é descrito. Os depósitos de prata obtidos são uniformes, não porosos e têm propriedades elétricas. A técnica pode ser aplicada para diferentes processos e formulações de banho, isto é, diferentes metais, agentes complexantes e agentes redutores.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE0403042A SE0403042D0 (sv) | 2004-12-14 | 2004-12-14 | Improved stabilization and performance of autocatalytic electroless process |
| PCT/SE2005/001930 WO2006065221A1 (en) | 2004-12-14 | 2005-12-13 | Stabilization amd performance of autocatalytic electroless processes. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0519014A2 true BRPI0519014A2 (pt) | 2008-12-23 |
Family
ID=33550639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0519014-2A BRPI0519014A2 (pt) | 2004-12-14 | 2005-12-13 | mÉtodo para deposiÇço de um substrato com um metal, objeto, banho de deposiÇço de prata sem eletricidade autocatalÍtica, e, mÉtodo para deposiÇço autocatalÍtica de prata metÁlica |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US20080206474A1 (pt) |
| EP (1) | EP1828435A4 (pt) |
| JP (1) | JP4891919B2 (pt) |
| KR (1) | KR101314035B1 (pt) |
| CN (2) | CN101693992B (pt) |
| AU (1) | AU2005317239B2 (pt) |
| BR (1) | BRPI0519014A2 (pt) |
| CA (1) | CA2591411C (pt) |
| IL (1) | IL183354A0 (pt) |
| MX (1) | MX2007006537A (pt) |
| NO (1) | NO20072917L (pt) |
| RU (1) | RU2398049C2 (pt) |
| SE (1) | SE0403042D0 (pt) |
| UA (1) | UA91995C2 (pt) |
| WO (1) | WO2006065221A1 (pt) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2009139366A1 (ja) * | 2008-05-15 | 2011-09-22 | Jx日鉱日石金属株式会社 | 基板 |
| DE102008063030A1 (de) | 2008-12-23 | 2010-06-24 | Bundesdruckerei Gmbh | Sicherheits- und/oder Wertdokument mit einer leitfähigen Struktur und Verfahren zu dessen Herstellung |
| EP2784181B1 (en) * | 2013-03-27 | 2015-12-09 | ATOTECH Deutschland GmbH | Electroless copper plating solution |
| CN107002242B (zh) | 2014-12-17 | 2020-02-11 | 埃托特克德国有限公司 | 用于化学镀钯的镀浴组合物和方法 |
| US20170051411A1 (en) * | 2015-08-20 | 2017-02-23 | Macdermid Acumen, Inc. | Electroless Silver Plating Bath and Method of Using the Same |
| JP7080781B2 (ja) * | 2018-09-26 | 2022-06-06 | 株式会社東芝 | 多孔質層の形成方法、エッチング方法、物品の製造方法、半導体装置の製造方法、及びめっき液 |
| FR3119172A1 (fr) * | 2021-01-28 | 2022-07-29 | Swissto12 Sa | Composition stable pour dépôt catalytique d’argent |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2842461A (en) * | 1955-12-02 | 1958-07-08 | Hauserman Co E F | Lead coating process and material |
| US2842561A (en) * | 1956-02-06 | 1958-07-08 | Ici Ltd | New dyestuff intermediates |
| US3403035A (en) * | 1964-06-24 | 1968-09-24 | Process Res Company | Process for stabilizing autocatalytic metal plating solutions |
| US3839165A (en) * | 1967-08-26 | 1974-10-01 | Henkel & Cie Gmbh | Nickel electroplating method |
| US3650777A (en) * | 1971-02-11 | 1972-03-21 | Kollmorgen Corp | Electroless copper plating |
| US4293591A (en) * | 1975-10-23 | 1981-10-06 | Nathan Feldstein | Process using activated electroless plating catalysts |
| US4412947A (en) * | 1979-09-12 | 1983-11-01 | Seton Company | Collagen sponge |
| JPS6033358A (ja) * | 1983-08-04 | 1985-02-20 | Hitachi Chem Co Ltd | 無電解銅めっき液 |
| CA1319319C (en) * | 1986-03-17 | 1993-06-22 | Donald Charles Mente | Thickening aqueous systems |
| US4999054A (en) * | 1986-12-19 | 1991-03-12 | Lamerie, N.V. | Gold plating solutions, creams and baths |
| EP0618307B1 (en) * | 1993-03-26 | 1997-11-12 | C. Uyemura & Co, Ltd | Electroless gold plating bath |
| US5803957A (en) * | 1993-03-26 | 1998-09-08 | C. Uyemura & Co.,Ltd. | Electroless gold plating bath |
| JP3332668B2 (ja) * | 1994-07-14 | 2002-10-07 | 松下電器産業株式会社 | 半導体装置の配線形成に用いる無電解めっき浴及び半導体装置の配線形成方法 |
| US5905157A (en) * | 1997-12-12 | 1999-05-18 | Bayer Corporation | Process for producing 2-(methylthio)-5-(trifluoromethyl)-1,3,4-thiadiazole using methyldithiocarbazinate and trifluoroacetic acid |
| JP3920462B2 (ja) * | 1998-07-13 | 2007-05-30 | 株式会社大和化成研究所 | 貴金属を化学的還元析出によって得るための水溶液 |
| US6066889A (en) * | 1998-09-22 | 2000-05-23 | International Business Machines Corporation | Methods of selectively filling apertures |
| US6361823B1 (en) * | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
| JP2001342453A (ja) * | 2000-06-01 | 2001-12-14 | Mitsubishi Rayon Co Ltd | キレート剤組成物 |
| JP2002004058A (ja) * | 2000-06-16 | 2002-01-09 | Kuwana Shoji Kk | 無電解めっきによる金属成形体の製造方法とその成形体 |
| RU2210623C2 (ru) * | 2000-06-27 | 2003-08-20 | Закрытое акционерное общество "Наука и серийный выпуск" | Способ получения медных покрытий на стальных поверхностях методом химического восстановления |
| US6416812B1 (en) * | 2000-06-29 | 2002-07-09 | International Business Machines Corporation | Method for depositing copper onto a barrier layer |
| US6387542B1 (en) * | 2000-07-06 | 2002-05-14 | Honeywell International Inc. | Electroless silver plating |
| WO2002016673A1 (fr) * | 2000-08-24 | 2002-02-28 | Hideo Yoshida | Nouveau procede de traitement electrochimique, tel que la galvanoplastie et dispositif de reaction a cet effet |
| US7163589B2 (en) * | 2001-05-23 | 2007-01-16 | Argos Associates, Inc. | Method and apparatus for decontamination of sensitive equipment |
| JP4660806B2 (ja) * | 2001-05-30 | 2011-03-30 | 石原薬品株式会社 | 無電解銀メッキ浴 |
| CN1329972C (zh) * | 2001-08-13 | 2007-08-01 | 株式会社荏原制作所 | 半导体器件及其制造方法 |
| US6645567B2 (en) * | 2001-12-19 | 2003-11-11 | Intel Corporation | Electroless plating bath composition and method of using |
| US6821324B2 (en) * | 2002-06-19 | 2004-11-23 | Ramot At Tel-Aviv University Ltd. | Cobalt tungsten phosphorus electroless deposition process and materials |
| US7166152B2 (en) * | 2002-08-23 | 2007-01-23 | Daiwa Fine Chemicals Co., Ltd. | Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method |
| JP2004195391A (ja) * | 2002-12-19 | 2004-07-15 | Kurita Water Ind Ltd | 非イオン性界面活性剤を含んだ有機化合物含有水の処理方法および処理装置 |
| JP4441726B2 (ja) * | 2003-01-24 | 2010-03-31 | 石原薬品株式会社 | スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法 |
-
2004
- 2004-12-14 SE SE0403042A patent/SE0403042D0/sv unknown
-
2005
- 2005-12-13 KR KR1020077016208A patent/KR101314035B1/ko not_active Expired - Fee Related
- 2005-12-13 MX MX2007006537A patent/MX2007006537A/es active IP Right Grant
- 2005-12-13 RU RU2007126815A patent/RU2398049C2/ru not_active IP Right Cessation
- 2005-12-13 US US11/791,512 patent/US20080206474A1/en not_active Abandoned
- 2005-12-13 CN CN200910205698XA patent/CN101693992B/zh not_active Expired - Fee Related
- 2005-12-13 UA UAA200707939A patent/UA91995C2/ru unknown
- 2005-12-13 AU AU2005317239A patent/AU2005317239B2/en not_active Ceased
- 2005-12-13 WO PCT/SE2005/001930 patent/WO2006065221A1/en not_active Ceased
- 2005-12-13 JP JP2007546613A patent/JP4891919B2/ja not_active Expired - Fee Related
- 2005-12-13 CA CA 2591411 patent/CA2591411C/en not_active Expired - Fee Related
- 2005-12-13 BR BRPI0519014-2A patent/BRPI0519014A2/pt not_active IP Right Cessation
- 2005-12-13 EP EP05819079.4A patent/EP1828435A4/en not_active Withdrawn
- 2005-12-13 CN CN200580042943XA patent/CN101080512B/zh not_active Expired - Fee Related
-
2007
- 2007-05-21 IL IL183354A patent/IL183354A0/en unknown
- 2007-06-07 NO NO20072917A patent/NO20072917L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1828435A1 (en) | 2007-09-05 |
| RU2398049C2 (ru) | 2010-08-27 |
| CN101693992B (zh) | 2012-12-26 |
| WO2006065221A1 (en) | 2006-06-22 |
| IL183354A0 (en) | 2007-09-20 |
| AU2005317239B2 (en) | 2010-03-04 |
| AU2005317239A1 (en) | 2006-06-22 |
| SE0403042D0 (sv) | 2004-12-14 |
| CN101080512A (zh) | 2007-11-28 |
| NO20072917L (no) | 2007-09-14 |
| KR20070092988A (ko) | 2007-09-14 |
| CN101080512B (zh) | 2011-08-17 |
| KR101314035B1 (ko) | 2013-10-02 |
| CA2591411A1 (en) | 2006-06-22 |
| RU2007126815A (ru) | 2009-01-27 |
| EP1828435A4 (en) | 2014-10-29 |
| CA2591411C (en) | 2014-01-28 |
| UA91995C2 (ru) | 2010-09-27 |
| JP2008523253A (ja) | 2008-07-03 |
| MX2007006537A (es) | 2007-08-20 |
| JP4891919B2 (ja) | 2012-03-07 |
| US20080206474A1 (en) | 2008-08-28 |
| CN101693992A (zh) | 2010-04-14 |
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