CA1038968A - Fabrication de transistors verticaux complementaires - Google Patents
Fabrication de transistors verticaux complementairesInfo
- Publication number
- CA1038968A CA1038968A CA234,241A CA234241A CA1038968A CA 1038968 A CA1038968 A CA 1038968A CA 234241 A CA234241 A CA 234241A CA 1038968 A CA1038968 A CA 1038968A
- Authority
- CA
- Canada
- Prior art keywords
- type
- boron
- doped
- substrate
- introducing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000295 complement effect Effects 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000012535 impurity Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 42
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 30
- 229910052796 boron Inorganic materials 0.000 claims description 30
- 229910052698 phosphorus Inorganic materials 0.000 claims description 17
- 239000011574 phosphorus Substances 0.000 claims description 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 16
- 229910052785 arsenic Inorganic materials 0.000 claims description 16
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 14
- 238000000151 deposition Methods 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000002955 isolation Methods 0.000 abstract description 28
- 230000000694 effects Effects 0.000 abstract description 7
- 238000009792 diffusion process Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000005468 ion implantation Methods 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- 238000011282 treatment Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 150000003017 phosphorus Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/67—Complementary BJTs
- H10D84/673—Vertical complementary BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
- H10D84/0119—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs the components including complementary BJTs
- H10D84/0121—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs the components including complementary BJTs the complementary BJTs being vertical BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Bipolar Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50757074A | 1974-09-19 | 1974-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1038968A true CA1038968A (fr) | 1978-09-19 |
Family
ID=24019174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA234,241A Expired CA1038968A (fr) | 1974-09-19 | 1975-08-27 | Fabrication de transistors verticaux complementaires |
Country Status (10)
| Country | Link |
|---|---|
| JP (1) | JPS5157172A (fr) |
| BE (1) | BE833455A (fr) |
| CA (1) | CA1038968A (fr) |
| DE (1) | DE2541161A1 (fr) |
| ES (1) | ES440909A0 (fr) |
| FR (1) | FR2285717A1 (fr) |
| GB (1) | GB1525247A (fr) |
| IT (1) | IT1042581B (fr) |
| NL (1) | NL7510994A (fr) |
| SE (1) | SE403214B (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55143064A (en) * | 1979-04-24 | 1980-11-08 | Nec Corp | Semiconductor device |
| JPS57106046A (en) * | 1980-12-23 | 1982-07-01 | Toshiba Corp | Manufacture of semiconductor device |
| JPH0713969B2 (ja) * | 1986-01-13 | 1995-02-15 | 三洋電機株式会社 | 縦型pnpトランジスタ |
| GB2186117B (en) * | 1986-01-30 | 1989-11-01 | Sgs Microelettronica Spa | Monolithically integrated semiconductor device containing bipolar junction,cmosand dmos transistors and low leakage diodes and a method for its fabrication |
| EP0347550A3 (fr) * | 1988-06-21 | 1991-08-28 | Texas Instruments Incorporated | Procédé pour l'intégration de transistors bipolaires isolés verticaux et à grand bêta |
-
1975
- 1975-08-27 CA CA234,241A patent/CA1038968A/fr not_active Expired
- 1975-09-10 SE SE7510075A patent/SE403214B/xx unknown
- 1975-09-16 DE DE19752541161 patent/DE2541161A1/de not_active Withdrawn
- 1975-09-16 IT IT27273/75A patent/IT1042581B/it active
- 1975-09-16 BE BE160072A patent/BE833455A/fr unknown
- 1975-09-18 FR FR7528624A patent/FR2285717A1/fr active Granted
- 1975-09-18 JP JP50112210A patent/JPS5157172A/ja active Pending
- 1975-09-18 NL NL7510994A patent/NL7510994A/xx not_active Application Discontinuation
- 1975-09-19 GB GB38498/75A patent/GB1525247A/en not_active Expired
-
1976
- 1976-01-23 ES ES440909A patent/ES440909A0/es active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2285717B1 (fr) | 1980-04-30 |
| GB1525247A (en) | 1978-09-20 |
| ES440909A0 (es) | 1977-03-16 |
| SE7510075L (sv) | 1976-03-22 |
| SE403214B (sv) | 1978-07-31 |
| IT1042581B (it) | 1980-01-30 |
| NL7510994A (nl) | 1976-03-23 |
| JPS5157172A (fr) | 1976-05-19 |
| BE833455A (fr) | 1976-01-16 |
| FR2285717A1 (fr) | 1976-04-16 |
| DE2541161A1 (de) | 1976-04-01 |
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