CH695490A5 - Verfahren zum Laminieren einer Leiterplatte auf eine Grundplatte und Laminiervorrichtung. - Google Patents
Verfahren zum Laminieren einer Leiterplatte auf eine Grundplatte und Laminiervorrichtung. Download PDFInfo
- Publication number
- CH695490A5 CH695490A5 CH8192001A CH8192001A CH695490A5 CH 695490 A5 CH695490 A5 CH 695490A5 CH 8192001 A CH8192001 A CH 8192001A CH 8192001 A CH8192001 A CH 8192001A CH 695490 A5 CH695490 A5 CH 695490A5
- Authority
- CH
- Switzerland
- Prior art keywords
- circuit board
- laminating
- base plate
- printed circuit
- bearing
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 19
- 238000010030 laminating Methods 0.000 title claims description 17
- 238000003825 pressing Methods 0.000 claims description 26
- 239000012790 adhesive layer Substances 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000002313 adhesive film Substances 0.000 description 5
- 230000005484 gravity Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- -1 Polyetyhlen Polymers 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
- B32B2037/264—Pressure equalizing layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2000126270 DE10026270C1 (de) | 2000-05-26 | 2000-05-26 | Verfahren zum Laminieren einer Leiterplatte auf eine Grundplatte und Laminiervorrichtung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH695490A5 true CH695490A5 (de) | 2006-06-15 |
Family
ID=7643751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH8192001A CH695490A5 (de) | 2000-05-26 | 2001-05-07 | Verfahren zum Laminieren einer Leiterplatte auf eine Grundplatte und Laminiervorrichtung. |
Country Status (3)
| Country | Link |
|---|---|
| CH (1) | CH695490A5 (fr) |
| DE (1) | DE10026270C1 (fr) |
| FR (1) | FR2809583B1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005048702B4 (de) * | 2005-10-11 | 2014-02-20 | Continental Automotive Gmbh | Elektrische Anordnung zweier elektrisch leitender Fügepartner und Verfahren zum Befestigen einer Platte auf einer Grundplatte |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5078820A (en) * | 1988-03-25 | 1992-01-07 | Somar Corporation | Method and apparatus for pressure sticking a thin film to a base plate |
| JPH0622199B2 (ja) * | 1988-03-25 | 1994-03-23 | ソマール株式会社 | 薄膜圧着方法及び薄膜圧着装置 |
| JPH01264831A (ja) * | 1988-04-18 | 1989-10-23 | Alps Electric Co Ltd | 積層板の製造方法 |
| US4975311A (en) * | 1988-12-20 | 1990-12-04 | Itt Corporation | Vacuum lamination station |
| JPH0483608A (ja) * | 1990-07-26 | 1992-03-17 | Yokohama Rubber Co Ltd:The | プリプレグシートの製造方法及びその製造装置 |
| JP3498816B2 (ja) * | 1995-04-20 | 2004-02-23 | 日本政策投資銀行 | 光ディスクの製造方法 |
| DE19607014A1 (de) * | 1996-02-24 | 1997-08-28 | Bosch Gmbh Robert | Verfahren zur Herstellung einer Verbundanordnung |
| JPH1114827A (ja) * | 1997-06-23 | 1999-01-22 | Hitachi Ltd | 偏光板貼付装置 |
| EP0902609A1 (fr) * | 1997-09-05 | 1999-03-17 | Ascom Hasler AG | Procédé de fabrication d'un panneau à circuit, panneau à circuit et dispositif pour la mise en oeuvre de ce procédé |
-
2000
- 2000-05-26 DE DE2000126270 patent/DE10026270C1/de not_active Expired - Fee Related
-
2001
- 2001-05-07 CH CH8192001A patent/CH695490A5/de not_active IP Right Cessation
- 2001-05-21 FR FR0106660A patent/FR2809583B1/fr not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FR2809583A1 (fr) | 2001-11-30 |
| FR2809583B1 (fr) | 2005-05-20 |
| DE10026270C1 (de) | 2001-12-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCAR | Change of the address of the representative |
Free format text: SIEMENS SCHWEIZ AG;INTELLECTUAL PROPERTY FREILAGERSTRASSE 40;8047 ZUERICH (CH) |
|
| PL | Patent ceased |