DK0418733T3 - Ved stråling polymeriserbar blanding samt fremgangsmåde til fremstilling af en loddemaske - Google Patents

Ved stråling polymeriserbar blanding samt fremgangsmåde til fremstilling af en loddemaske

Info

Publication number: DK0418733T3
Authority: DK; Denmark
Prior art keywords: making; solder mask; epoxy groups; polymerizable mixture; radiation polymerizable
Prior art date: 1989-09-21

Application number

DK90117636T

Other languages

English (en)

Inventor

Walter Dr Herwig

Kurt Erbes

Rudolf Decker

Michael Dr Emmelius

Original Assignee

Morton Int Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-09-21

Filing date

1990-09-13

Publication date

1998-09-07

1990-09-13 Application filed by Morton Int Inc filed Critical Morton Int Inc

1998-09-07 Application granted granted Critical

1998-09-07 Publication of DK0418733T3 publication Critical patent/DK0418733T3/da

Links

239000000203 mixture Substances 0.000 title abstract 3
229910000679 solder Inorganic materials 0.000 title abstract 2
238000004519 manufacturing process Methods 0.000 title 1
230000005855 radiation Effects 0.000 title 1
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 2
150000001875 compounds Chemical class 0.000 abstract 2
125000003700 epoxy group Chemical group 0.000 abstract 2
CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 abstract 1
BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 abstract 1
239000011230 binding agent Substances 0.000 abstract 1
238000010438 heat treatment Methods 0.000 abstract 1
239000003999 initiator Substances 0.000 abstract 1
229910052500 inorganic mineral Inorganic materials 0.000 abstract 1
125000005395 methacrylic acid group Chemical group 0.000 abstract 1
239000011707 mineral Substances 0.000 abstract 1
239000000049 pigment Substances 0.000 abstract 1
239000004848 polyfunctional curative Substances 0.000 abstract 1
RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 abstract 1
235000012239 silicon dioxide Nutrition 0.000 abstract 1
238000005476 soldering Methods 0.000 abstract 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
- C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/136—Coating process making radiation sensitive element

Landscapes

Physics & Mathematics (AREA)
Chemical & Material Sciences (AREA)
General Physics & Mathematics (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Engineering & Computer Science (AREA)
Health & Medical Sciences (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Spectroscopy & Molecular Physics (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Non-Metallic Protective Coatings For Printed Circuits (AREA)
Polymerisation Methods In General (AREA)
Epoxy Resins (AREA)
Manufacturing Of Printed Circuit Boards (AREA)
Preparing Plates And Mask In Photomechanical Process (AREA)
Macromonomer-Based Addition Polymer (AREA)
Dental Preparations (AREA)
Analysing Materials By The Use Of Radiation (AREA)
Reinforced Plastic Materials (AREA)
Adhesives Or Adhesive Processes (AREA)
Photosensitive Polymer And Photoresist Processing (AREA)
Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

DK90117636T 1989-09-21 1990-09-13 Ved stråling polymeriserbar blanding samt fremgangsmåde til fremstilling af en loddemaske DK0418733T3 (da)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE3931467A DE3931467A1 (de)	1989-09-21	1989-09-21	Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstopmaske

Publications (1)

Publication Number	Publication Date
DK0418733T3 true DK0418733T3 (da)	1998-09-07

Family

ID=6389856

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DK90117636T DK0418733T3 (da)	1989-09-21	1990-09-13	Ved stråling polymeriserbar blanding samt fremgangsmåde til fremstilling af en loddemaske

Country Status (15)

Country	Link
US (2)	US5264324A (da)
EP (1)	EP0418733B1 (da)
JP (1)	JP2662083B2 (da)
KR (1)	KR0161970B1 (da)
AT (1)	ATE162316T1 (da)
AU (1)	AU633363B2 (da)
CA (1)	CA2025831C (da)
DE (2)	DE3931467A1 (da)
DK (1)	DK0418733T3 (da)
ES (1)	ES2110956T3 (da)
FI (1)	FI904605A7 (da)
IE (1)	IE903402A1 (da)
IL (1)	IL95739A (da)
NO (1)	NO904115L (da)
ZA (1)	ZA907479B (da)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2706858B2 (ja) *	1991-07-30	1998-01-28	富士写真フイルム株式会社	光重合性組成物
DE4142735A1 (de) *	1991-12-21	1993-06-24	Hoechst Ag	Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstoppmaske
US5389497A (en) *	1992-06-03	1995-02-14	Nippon Paint Co., Ltd.	Method for forming patterned solder mask
DE4234072A1 (de) *	1992-10-09	1994-04-14	Morton Int Inc	Durch Strahlung polymerisierbares Gemisch und Verfahren zur Herstellung einer Lötstoppmaske
DE4316087A1 (de) *	1993-05-13	1994-11-17	Morton Int Inc	Verfahren zum bildmäßigen Metallisieren von strukturierten Leiterplatten
DE4336901A1 (de) *	1993-10-28	1995-05-04	Du Pont Deutschland	Photopolymerisierbares Gemisch und Verfahren zur Herstellung von Lötstopmasken
US5545510A (en) *	1995-03-28	1996-08-13	Mac Dermid, Inc.	Photodefinable dielectric composition useful in the manufacture of printed circuits
US5925499A (en) *	1995-08-01	1999-07-20	Morton International, Inc.	Epoxy-containing waterborne photoimageable composition
US5844308A (en) *	1997-08-20	1998-12-01	Cts Corporation	Integrated circuit anti-bridging leads design
US5874197A (en) *	1997-09-18	1999-02-23	E. I. Du Pont De Nemours And Company	Thermal assisted photosensitive composition and method thereof
US6645696B1 (en) *	2001-11-30	2003-11-11	Euv Llc.	Photoimageable composition
DE10204114A1 (de) *	2002-02-01	2003-08-14	Basf Coatings Ag	Thermisch und mit aktinischer Strahlung härtbares Stoffgemisch, Verfahren zu seiner Herstellung und seine Verwendung
JP2003277437A (ja) *	2002-02-15	2003-10-02	Shipley Co Llc	官能化ポリマー
JP4500657B2 (ja) *	2004-11-30	2010-07-14	旭化成イーマテリアルズ株式会社	パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2006208730A (ja) *	2005-01-27	2006-08-10	Fuji Photo Film Co Ltd	パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP5661293B2 (ja) *	2010-02-08	2015-01-28	太陽ホールディングス株式会社	光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JP5829035B2 (ja) *	2011-03-31	2015-12-09	太陽インキ製造株式会社	光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JPWO2012141153A1 (ja) *	2011-04-13	2014-07-28	太陽インキ製造株式会社	光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
DE102011083791A1 (de)	2011-09-29	2013-04-04	Robert Bosch Gmbh	Verfahren zur Herstellung einer Lötverbindung
TWI541594B (zh) *	2011-09-30	2016-07-11	太陽油墨製造股份有限公司	A photosensitive resin composition, a hardened film thereof, and a printed wiring board
JP2017165846A (ja)	2016-03-15	2017-09-21	アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ	微細パターン形成用組成物およびそれを用いた微細パターン形成方法

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DE2064080C3 (de) *	1970-12-28	1983-11-03	Hoechst Ag, 6230 Frankfurt	Lichtempfindliches Gemisch
US3887450A (en) *	1971-02-04	1975-06-03	Dynachem Corp	Photopolymerizable compositions containing polymeric binding agents
US3776729A (en) *	1971-02-22	1973-12-04	Ibm	Photosensitive dielectric composition and process of using the same
DE2363806B2 (de) *	1973-12-21	1979-05-17	Hoechst Ag, 6000 Frankfurt	Lichtempfindliches Gemisch
ZA757984B (en) *	1974-10-04	1976-12-29	Dynachem Corp	Polymers for aqueous processed photoresists
DE2861486D1 (en) *	1977-11-21	1982-02-18	Ciba Geigy Ag	Process for the application of soldering masks to printed circuits with through holes for contacting
US4278752A (en) *	1978-09-07	1981-07-14	E. I. Du Pont De Nemours And Company	Flame retardant radiation sensitive element
BR8001021A (pt) *	1979-02-26	1980-10-29	Du Pont	Material resistente de pelicula seca, rolo ajustado, mascara de solda e processo para a modificacao seletiva de uma superficie
US4390615A (en) *	1979-11-05	1983-06-28	Courtney Robert W	Coating compositions
DE3114931A1 (de) *	1981-04-13	1982-10-28	Hoechst Ag, 6000 Frankfurt	Durch strahlung polymerisierbares gemisch und daraus hergestelltes photopolymerisierbares kopiermaterial
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DE3134123A1 (de) *	1981-08-28	1983-03-17	Hoechst Ag, 6000 Frankfurt	Durch strahlung polymerisierbares gemisch und daraushergestelltes photopolymerisierbares kopiermaterial
EP0075537B2 (de) *	1981-09-17	1991-03-20	Ciba-Geigy Ag	Verfahren zum Beschichten gedruckter Schaltungen
CA1194637A (en) *	1982-04-26	1985-10-01	Charles R. Morgan	Uv and thermally curable, thermoplastic-containing compositions
DE3236560A1 (de) *	1982-10-02	1984-04-05	Hoechst Ag, 6230 Frankfurt	Lichtempfindliches schichtuebertragungsmaterial und verfahren zur herstellung einer photoresistschablone
US4479983A (en) *	1983-01-07	1984-10-30	International Business Machines Corporation	Method and composition for applying coatings on printed circuit boards
DE3412992A1 (de) *	1984-04-06	1985-10-24	Hoechst Ag, 6230 Frankfurt	Durch strahlung polymerisierbares gemisch und verfahren zum aufbringen von markierungen auf eine loetstopresistschicht
JPH0618856B2 (ja) *	1986-02-14	1994-03-16	日本合成ゴム株式会社	液状感光性樹脂組成物およびそれを用いる画像形成法
JPS63258975A (ja) *	1986-12-26	1988-10-26	Toshiba Corp	ソルダーレジストインキ組成物
JP2604173B2 (ja) *	1987-02-25	1997-04-30	東京応化工業株式会社	耐熱性感光性樹脂組成物
JP2604174B2 (ja) *	1987-03-25	1997-04-30	東京応化工業株式会社	耐熱性感光性樹脂組成物
JPH0717737B2 (ja) *	1987-11-30	1995-03-01	太陽インキ製造株式会社	感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
JP2694037B2 (ja) *	1987-12-07	1997-12-24	モートンサイオコール，インコーポレイティド	光画像形成組成物，ドライフィルムの調製方法及び光画像形成要素
JPH0748108B2 (ja) *	1988-02-02	1995-05-24	イビデン株式会社	感光性樹脂組成物
JPH01203424A (ja) *	1988-02-09	1989-08-16	Toagosei Chem Ind Co Ltd	硬化性組成物

1989
- 1989-09-21 DE DE3931467A patent/DE3931467A1/de not_active Withdrawn
1990
- 1990-09-13 ES ES90117636T patent/ES2110956T3/es not_active Expired - Lifetime
- 1990-09-13 EP EP90117636A patent/EP0418733B1/de not_active Expired - Lifetime
- 1990-09-13 DK DK90117636T patent/DK0418733T3/da active
- 1990-09-13 DE DE59010796T patent/DE59010796D1/de not_active Expired - Fee Related
- 1990-09-13 AT AT90117636T patent/ATE162316T1/de not_active IP Right Cessation
- 1990-09-19 KR KR1019900014795A patent/KR0161970B1/ko not_active Expired - Fee Related
- 1990-09-19 FI FI904605A patent/FI904605A7/fi not_active Application Discontinuation
- 1990-09-19 IL IL9573990A patent/IL95739A/en not_active IP Right Cessation
- 1990-09-19 ZA ZA907479A patent/ZA907479B/xx unknown
- 1990-09-20 US US07/585,642 patent/US5264324A/en not_active Expired - Lifetime
- 1990-09-20 IE IE340290A patent/IE903402A1/en not_active IP Right Cessation
- 1990-09-20 CA CA002025831A patent/CA2025831C/en not_active Expired - Fee Related
- 1990-09-20 AU AU63047/90A patent/AU633363B2/en not_active Ceased
- 1990-09-20 JP JP25168090A patent/JP2662083B2/ja not_active Expired - Fee Related
- 1990-09-20 NO NO90904115A patent/NO904115L/no unknown
1993
- 1993-10-27 US US08/144,115 patent/US5387486A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP0418733A3 (en)	1992-03-04
KR0161970B1 (ko)	1999-01-15
JPH03164742A (ja)	1991-07-16
NO904115D0 (no)	1990-09-20
ZA907479B (en)	1991-06-26
IL95739A0 (en)	1991-06-30
IE903402A1 (en)	1991-04-10
IL95739A (en)	1995-03-15
FI904605A7 (fi)	1991-03-22
US5264324A (en)	1993-11-23
DE59010796D1 (de)	1998-02-19
JP2662083B2 (ja)	1997-10-08
EP0418733B1 (de)	1998-01-14
NO904115L (no)	1991-03-22
AU6304790A (en)	1991-03-28
CA2025831C (en)	2001-11-20
KR910006781A (ko)	1991-04-30
DE3931467A1 (de)	1991-04-04
ATE162316T1 (de)	1998-01-15
ES2110956T3 (es)	1998-03-01
FI904605A0 (fi)	1990-09-19
US5387486A (en)	1995-02-07
EP0418733A2 (de)	1991-03-27
CA2025831A1 (en)	1991-03-22
AU633363B2 (en)	1993-01-28

Publication	Publication Date	Title
AU633363B2 (en)	1993-01-28	Radiation-polymerizable mixture and process for producing a solder resist mask
BR9401197A (pt)	1994-10-18	Processo para o endurecimento de compostos polimerizáveis etilenicamente insaturados, uso de compostos, composições e processo para o revestimento de superfícies.
BR9502725A (pt)	1997-08-05	Aparelho para polimerização de uma composição polimerizável e processo para formação de uma lente de contato
CA1248909A (en)	1989-01-17	Two-stage radiation polymerization of layer containing diurethanedimethacrylate for orthodontic device
JPH03160013A (ja)	1991-07-10	感光性混合物
KR0147812B1 (ko)	1998-08-17	감광성 액체 수지 조성물 및 그로부터 3차원 물체를 제조하는 방법
JP2002517522A5 (da)	2006-07-13
AU565532B2 (en)	1987-09-17	Radiation-polymerisable composition
KR910001455A (ko)	1991-01-30	근자외선 방사(near ultraviolet radiation)에 의해 고해상도(高解象度)를 나타내는 산 경화 광저항물(Acid hardening photoresists)에 있어서 선택된 광활성 조성물의 사용법
DE2964562D1 (en)	1983-02-24	Photopolymerisable composition
GB2003494A (en)	1979-03-14	Thiol containing photo-curable polymeric compositions
UY23977A1 (es)	1995-09-05	Resinas para trabajos de fundicion
YU180090A (sh)	1992-12-21	Zmes, ki se da polimerizirati s sevanjem, in postopek za izdelavo spajkalne kritne maske
JPS5632510A (en)	1981-04-02	Radically curable composition
JPS5623340A (en)	1981-03-05	Binder for mold and coating sand used it, and molding method of mold used said binder
SU798681A1 (ru)	1981-01-23	Фотополимерна печатна форма
JPS56140342A (en)	1981-11-02	Image forming composition and formation of resist image
TW200715052A (en)	2007-04-16	Composition curable with actinic energy ray
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