EP2315500A4 - Procédé de fabrication de panneau électroluminescent organique - Google Patents

Procédé de fabrication de panneau électroluminescent organique

Info

Publication number
EP2315500A4
EP2315500A4 EP09794151A EP09794151A EP2315500A4 EP 2315500 A4 EP2315500 A4 EP 2315500A4 EP 09794151 A EP09794151 A EP 09794151A EP 09794151 A EP09794151 A EP 09794151A EP 2315500 A4 EP2315500 A4 EP 2315500A4
Authority
EP
European Patent Office
Prior art keywords
ninescenter
electrolum
panel
organic
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09794151A
Other languages
German (de)
English (en)
Other versions
EP2315500A1 (fr
Inventor
Takamasa Hirayama
Akihisa Murata
Yukio Arimitsu
Takashi Yamaoka
Masaaki Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of EP2315500A1 publication Critical patent/EP2315500A1/fr
Publication of EP2315500A4 publication Critical patent/EP2315500A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1163—Sintering for delamination
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1195—Delaminating from release surface

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
EP09794151A 2008-07-08 2009-06-30 Procédé de fabrication de panneau électroluminescent organique Withdrawn EP2315500A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008178181 2008-07-08
PCT/JP2009/003030 WO2010004703A1 (fr) 2008-07-08 2009-06-30 Procédé de fabrication de panneau électroluminescent organique

Publications (2)

Publication Number Publication Date
EP2315500A1 EP2315500A1 (fr) 2011-04-27
EP2315500A4 true EP2315500A4 (fr) 2011-12-28

Family

ID=41506831

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09794151A Withdrawn EP2315500A4 (fr) 2008-07-08 2009-06-30 Procédé de fabrication de panneau électroluminescent organique

Country Status (7)

Country Link
US (1) US8409884B2 (fr)
EP (1) EP2315500A4 (fr)
JP (1) JPWO2010004703A1 (fr)
KR (1) KR20110039248A (fr)
CN (1) CN102077688A (fr)
TW (1) TW201016071A (fr)
WO (1) WO2010004703A1 (fr)

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EP2564240B1 (fr) 2010-04-26 2019-06-12 Koninklijke Philips N.V. Détecteur de rayons x à uniformité et résolution spatiale de gain amélioré et procédé de fabrication d'un tel détecteur de rayons x
GB2481187B (en) * 2010-06-04 2014-10-29 Plastic Logic Ltd Processing substrates
CN102674669B (zh) * 2011-03-16 2014-12-03 京东方科技集团股份有限公司 一种玻璃基板的固定方法
CN102690066B (zh) * 2011-03-22 2015-02-25 京东方科技集团股份有限公司 一种玻璃基板的固定方法
JP6000595B2 (ja) * 2012-03-27 2016-09-28 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法
CN103568443B (zh) * 2012-07-19 2015-06-17 华映视讯（吴江）有限公司 玻璃贴合装置
KR101913436B1 (ko) * 2012-07-26 2018-10-30 도레이첨단소재 주식회사 열박리형 양면 점착 시트 및 이를 이용한 가공방법
US20140287299A1 (en) * 2013-03-25 2014-09-25 Apple Inc. Heat-Debonding Adhesives
KR101484089B1 (ko) * 2013-07-16 2015-01-19 코닝정밀소재 주식회사 초박형 유기발광소자 제조방법
CN104031571B (zh) * 2014-05-17 2016-04-13 甘春丽 一种膨胀易剥离胶带
JP6156443B2 (ja) * 2014-08-13 2017-07-05 Jsr株式会社 積層体および基材の処理方法
JP6587811B2 (ja) * 2015-02-24 2019-10-09 日東電工株式会社 熱剥離型粘着シート
CN105845845B (zh) * 2016-04-14 2018-07-06 鄂尔多斯市源盛光电有限责任公司 一种粘接型阻隔膜的图形化方法、显示面板、显示装置
JP2018028974A (ja) * 2016-08-15 2018-02-22 日東電工株式会社 有機ｅｌ表示装置用粘着剤組成物、有機ｅｌ表示装置用粘着剤層、有機ｅｌ表示装置用粘着剤層付偏光フィルム、及び有機ｅｌ表示装置
KR102748561B1 (ko) * 2016-12-02 2025-01-03 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
CN106875851A (zh) * 2017-04-20 2017-06-20 京东方科技集团股份有限公司 显示装置及其制造方法
TWI681232B (zh) * 2017-09-26 2020-01-01 達邁科技股份有限公司 用於軟性顯示器之透明聚醯亞胺複合膜及其製造方法
JP6790008B2 (ja) * 2018-03-14 2020-11-25 株式会社東芝 検出素子および検出器
AU2019354730B2 (en) * 2018-10-03 2025-02-06 The Regents Of The University Of Michigan Integrated micro-photoionization detector with an ultrathin ultraviolet transmission window
KR20210107648A (ko) * 2018-12-26 2021-09-01 디아이씨 가부시끼가이샤 플렉시블 디스플레이용 발포체 점착 테이프 및 플렉시블 디스플레이 적층물
CN110112185A (zh) * 2019-04-18 2019-08-09 武汉华星光电半导体显示技术有限公司 一种柔性显示面板及其制备方法
CN110305599B (zh) * 2019-07-03 2021-10-22 京东方科技集团股份有限公司 一种散热膜及显示装置
EP4080273A4 (fr) * 2019-12-17 2023-06-28 Xtia Ltd Procédé de production d'un résonateur optique et d'un modulateur optique, résonateur optique, modulateur optique, générateur de peigne de fréquences optiques et oscillateur optique
JP7740629B2 (ja) * 2021-05-26 2025-09-17 京東方科技集團股▲ふん▼有限公司 フレキシブル表示装置及び支持アセンブリ
JP7108164B1 (ja) 2021-05-27 2022-07-28 東洋インキＳｃホールディングス株式会社 粘着剤、粘着シート、積層体、およびフレキシブルディスプレイ
JP7108165B1 (ja) 2021-05-27 2022-07-28 東洋インキＳｃホールディングス株式会社 粘着剤、粘着シート、積層体、およびフレキシブルディスプレイ
JP7739145B2 (ja) * 2021-11-15 2025-09-16 三井化学Ictマテリア株式会社 加工薄ガラスの製造方法、粘着性フィルムおよび薄ガラス付き粘着性フィルム
CN114591002A (zh) * 2022-04-11 2022-06-07 业泓科技(成都)有限公司 指纹辨识模组的减薄方法
JP2023160308A (ja) * 2022-04-22 2023-11-02 三井化学東セロ株式会社 機械加工済み薄ガラスの製造方法

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EP0257984A2 (fr) * 1986-08-21 1988-03-02 Minnesota Mining And Manufacturing Company Structure de ruban piézo-sensible renfermant des microsphères élastiques en polymère
JPH0853653A (ja) * 1994-08-11 1996-02-27 Sony Chem Corp 粘着テープ及びその製造方法
JP2001040300A (ja) * 1999-07-28 2001-02-13 Konishi Co Ltd 戻りの少ない両面粘着テープ
JP2002069410A (ja) * 2000-08-28 2002-03-08 Fujimori Kogyo Co Ltd 熱剥離性粘着剤及びそれを用いた粘着部材
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US20110124136A1 (en) 2011-05-26
KR20110039248A (ko) 2011-04-15
US8409884B2 (en) 2013-04-02
EP2315500A1 (fr) 2011-04-27
TW201016071A (en) 2010-04-16
CN102077688A (zh) 2011-05-25
WO2010004703A1 (fr) 2010-01-14
JPWO2010004703A1 (ja) 2011-12-22

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