ES2030800T3 - Elemento de soporte incorporable a tarjetas de identidad. - Google Patents

Elemento de soporte incorporable a tarjetas de identidad.

Info

Publication number
ES2030800T3
ES2030800T3 ES198888111437T ES88111437T ES2030800T3 ES 2030800 T3 ES2030800 T3 ES 2030800T3 ES 198888111437 T ES198888111437 T ES 198888111437T ES 88111437 T ES88111437 T ES 88111437T ES 2030800 T3 ES2030800 T3 ES 2030800T3
Authority
ES
Spain
Prior art keywords
substrate
screwing
protected
applying
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198888111437T
Other languages
English (en)
Inventor
Yahya Dipl.-Ing. Haghiri-Tehrani
Renee-Lucia Dipl.-Ing. Barak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GAO Gesellschaft fuer Automation und Organisation mbH
Original Assignee
GAO Gesellschaft fuer Automation und Organisation mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6331714&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2030800(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by GAO Gesellschaft fuer Automation und Organisation mbH filed Critical GAO Gesellschaft fuer Automation und Organisation mbH
Application granted granted Critical
Publication of ES2030800T3 publication Critical patent/ES2030800T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Road Signs Or Road Markings (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

SE DESCRIBE UN ELEMENTO PORTADOR CON UNO O VARIOS IC PARA INSTALACION EN UNA TARJETA DE IDENTIDAD O CARTA DE CREDITO. EL ELEMENTO PORTADOR SE COMPONE DE UN SUBSTRATO, EN CUYA SUPERFICIE SE COLOCAN VARIAS SUPERFICIES DE CONTACTO QUE SE CONECTAN POR VIAS CONDUCTORAS ESTA PROTEGIDO DE CIERRE CORRESPONDIENTES AL IC COLOCADO EN EL SUBSTRATO. EL IC CON INCLUSION DE LAS CONEXIONES PARA LAS VIAS CONDUCTORAS ESTA PROTEGIDO POR UNA MASA DE FUNDICION ENDURECIDA DE CARGAS MECANICAS. PARA EVITAR UN DERRAMAMIENTO INDESEADO AL APLICAR LA MASA DE FUNDICION, SE PREVE UNA ESCOTADURA EN LA CAPA ADHESIVA CALIENTE LLEVADA EN UNA PARTE DEL SUBSTRATO, QUE SE MANTIENE AL APLICAR LA RESINA LIQUIDA Y ACTUA COMO BASTIDOR LIMITADOR. LA ESCOTADURA EN LA CAPA ADHESIVA SE ENCUENTRA AL MENOS DONDE SE COLOCA EL IC.
ES198888111437T 1987-07-16 1988-07-15 Elemento de soporte incorporable a tarjetas de identidad. Expired - Lifetime ES2030800T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3723547A DE3723547C2 (de) 1987-07-16 1987-07-16 Trägerelement zum Einbau in Ausweiskarten

Publications (1)

Publication Number Publication Date
ES2030800T3 true ES2030800T3 (es) 1992-11-16

Family

ID=6331714

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198888111437T Expired - Lifetime ES2030800T3 (es) 1987-07-16 1988-07-15 Elemento de soporte incorporable a tarjetas de identidad.

Country Status (7)

Country Link
US (1) US5027190A (es)
EP (1) EP0299530B1 (es)
JP (1) JP2676619B2 (es)
AT (1) ATE73945T1 (es)
DE (2) DE3723547C2 (es)
ES (1) ES2030800T3 (es)
HK (1) HK54295A (es)

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DE4040770C2 (de) * 1990-12-19 1999-11-11 Gao Ges Automation Org Datenträger mit integriertem Schaltkreis
FR2670930A1 (fr) * 1990-12-21 1992-06-26 Bull Cp8 Procede de realisation du module electronique d'un objet portatif tel qu'une carte a microcircuits, module et cartes obtenus par la mise en óoeuvre du procede.
DE9100665U1 (de) * 1991-01-21 1992-07-16 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Trägerelement für integrierte Halbleiter-Schaltkreise, insbesondere zum Einbau in Chip-Karten
DE4105869C2 (de) * 1991-02-25 2000-05-18 Edgar Schneider IC-Karte und Verfahren zu ihrer Herstellung
DE4122049A1 (de) * 1991-07-03 1993-01-07 Gao Ges Automation Org Verfahren zum einbau eines traegerelements
DE4126874C2 (de) * 1991-08-14 1997-05-22 Orga Kartensysteme Gmbh Datenträger mit integriertem Schaltkreis
DE4209184C1 (es) * 1992-03-21 1993-05-19 Orga Kartensysteme Gmbh, 6072 Dreieich, De
US5796164A (en) * 1993-05-11 1998-08-18 Micromodule Systems, Inc. Packaging and interconnect system for integrated circuits
JPH0737049A (ja) * 1993-07-23 1995-02-07 Toshiba Corp 外部記憶装置
DE4326816A1 (de) * 1993-08-10 1995-02-16 Giesecke & Devrient Gmbh Elektronisches Modul für Karten und Herstellung eines solchen Moduls
DE4340847A1 (de) * 1993-11-26 1995-06-01 Optosys Gmbh Berlin Chipmodul und Verfahren zur Herstellung eines Chipmoduls
FR2721732B1 (fr) * 1994-06-22 1996-08-30 Solaic Sa Carte à mémoire sans contact dont le circuit électronique comporte un module.
DE4423575A1 (de) 1994-07-05 1996-01-11 Giesecke & Devrient Gmbh Datenträger mit einem Modul mit integriertem Schaltkreis
DE4427802C1 (de) * 1994-08-05 1995-10-26 Beiersdorf Ag Thermoaktivierbare Klebfolie zur Herstellung eines Datenträgers
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
DE19502157B4 (de) * 1995-01-25 2011-07-21 Sagem Orga GmbH, 33106 Trägerelement für einen IC-Baustein zum Einbau in Chipkarten
DE19512725C1 (de) * 1995-04-05 1996-09-12 Orga Kartensysteme Gmbh Ausweiskarte o.dgl. in Form einer Chipkarte
CA2192076C (en) * 1995-04-13 2000-01-18 Masao Gogami Ic card and ic module
US5677521A (en) * 1995-06-29 1997-10-14 Garrou; Elizabeth B. Personal identification and credit information system and method of performing transaction
DE29510947U1 (de) * 1995-07-06 1995-09-14 Stocko Metallwarenfabriken Henkels Und Sohn Gmbh & Co, 42327 Wuppertal Kontaktfeldbaugruppe zur Anordnung auf einer Kontaktiereinheit
DE19539181C2 (de) * 1995-10-20 1998-05-14 Ods Gmbh & Co Kg Chipkartenmodul sowie entsprechendes Herstellungsverfahren
ATE194242T1 (de) * 1996-08-02 2000-07-15 Schlumberger Systems & Service Kombinierte chipkarte
DE19632813C2 (de) * 1996-08-14 2000-11-02 Siemens Ag Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte
US5847445A (en) * 1996-11-04 1998-12-08 Micron Technology, Inc. Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
KR100431501B1 (ko) * 1997-06-05 2004-10-02 삼성전자주식회사 고전력 패키지 구조 및 제조 방법
JP3883652B2 (ja) * 1997-06-23 2007-02-21 大日本印刷株式会社 板状枠体付きｉｃキャリアとその製造方法
WO1998059317A1 (en) * 1997-06-23 1998-12-30 Rohm Co., Ltd. Module for ic card, ic card, and method for manufacturing module for ic card
FR2769110B1 (fr) * 1997-09-26 1999-12-03 Gemplus Card Int Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette
DE69842065D1 (de) * 1997-09-26 2011-02-03 Gemalto Sa Verfahren zur herstellung eines elektronischen moduls oder etiketts, derart hergestelltes modul oder etikett und träger mit solchem modul oder etikett
FR2769130B1 (fr) * 1997-09-30 2001-06-08 Thomson Csf Procede d'enrobage d'une puce electronique et carte electronique comportant au moins une puce enrobee selon ce procede
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
US6241153B1 (en) * 1998-03-17 2001-06-05 Cardxx, Inc. Method for making tamper-preventing, contact-type, smart cards
FR2785072B1 (fr) * 1998-10-23 2001-01-19 St Microelectronics Sa Circuit electronique autocollant
US6179210B1 (en) * 1999-02-09 2001-01-30 Motorola, Inc. Punch out pattern for hot melt tape used in smartcards
FR2793331B1 (fr) * 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de fabrication d'une carte a microcircuit
DE10024376A1 (de) * 2000-05-17 2001-12-06 Infineon Technologies Ag Halbleiterbauelement und Verfahren zu dessen Herstellung
DE20100158U1 (de) 2001-01-05 2002-05-08 Bundesdruckerei GmbH, 10969 Berlin Identifikations- und Sicherheitskarte aus laminierten und/oder gespritzten Kunststoffen
EP1615166A1 (en) * 2004-07-07 2006-01-11 Axalto S.A. Carrier tape for chip modules and method of manufacturing a chip card
JP2008537215A (ja) * 2005-03-23 2008-09-11 カードエックスエックス インコーポレイテッド 高品質外面を有する等方性熱硬化接着材料を使用して集積電子機器を備えた最新スマートカードを製造する方法。
JP2007133802A (ja) * 2005-11-14 2007-05-31 Dainippon Printing Co Ltd Ｉｃカードおよびｉｃカード用ｉｃモジュール
USD571810S1 (en) * 2006-06-20 2008-06-24 Kabushiki Kaisha Toshiba Module with built-in integrated circuits for use with IC cards
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
JP1647393S (es) 2018-02-01 2019-12-09
USD930000S1 (en) 2018-10-12 2021-09-07 Huawei Technologies Co., Ltd. Memory card
USD983261S1 (en) 2019-12-20 2023-04-11 Capital One Services, Llc Vented laminated card

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FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
US4216577A (en) * 1975-12-31 1980-08-12 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
US4222516A (en) * 1975-12-31 1980-09-16 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull Standardized information card
JPS57207357A (en) * 1981-06-17 1982-12-20 Asahi Glass Co Ltd Component part holder
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
DE3235650A1 (de) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg Informationskarte und verfahren zu ihrer herstellung
FR2548857B1 (fr) * 1983-07-04 1987-11-27 Cortaillod Cables Sa Procede de fabrication en continu d'une carte imprimee
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben

Also Published As

Publication number Publication date
DE3869248D1 (de) 1992-04-23
EP0299530A1 (de) 1989-01-18
US5027190A (en) 1991-06-25
ATE73945T1 (de) 1992-04-15
EP0299530B1 (de) 1992-03-18
DE3723547A1 (de) 1989-01-26
HK54295A (en) 1995-04-21
JP2676619B2 (ja) 1997-11-17
DE3723547C2 (de) 1996-09-26
JPS6436496A (en) 1989-02-07

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