ES2076385T3 - Procedimiento para preparar una armadura, con el fin de reducir las particulas dentro de una camara de deposicion fisica de vapor. - Google Patents

Procedimiento para preparar una armadura, con el fin de reducir las particulas dentro de una camara de deposicion fisica de vapor.

Info

Publication number
ES2076385T3
ES2076385T3 ES91102324T ES91102324T ES2076385T3 ES 2076385 T3 ES2076385 T3 ES 2076385T3 ES 91102324 T ES91102324 T ES 91102324T ES 91102324 T ES91102324 T ES 91102324T ES 2076385 T3 ES2076385 T3 ES 2076385T3
Authority
ES
Spain
Prior art keywords
steam
acid erosion
prepare
shielding
reinforcement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91102324T
Other languages
English (en)
Inventor
Humoyoun Talieh
Haim Gilboa
Donald M Mintz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ES2076385T3 publication Critical patent/ES2076385T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

EN UN METODO PARA PREPARAR UN BLINDAJE (17) PARA SU USO EN UN PROCESO FISICO DE DEPOSITACION DE VAPOR, EL BLINDAJE SE LIMPIA MEDIANTE UN PROCESO DE EROSION POR ACIDO PARA INCREMENTAR LA ADHESION DE LOS DEPOSITOS EN EL PROCESO FISICO DE DEPOSITACION DE VAPOR. LA LIMPIEZA MEDIANTE EROSION POR ACIDO SIRVE PARA DESPRENDER LA CONTAMINACION QUE PODRIA FORMAR UNA BARRERA DE DIFUSION Y EVITAR QUE LOS DEPOSITOS SE UNIERAN AL BLINDAJE. TAMBIEN LA LIMPIEZA MEDIANTE EROSION POR ACIDO CREA UN ALTO GRADO DE MICRORUGOSIDADES. LA ASPEREZA PERMITE UN INCREMENTO EN LOS LUGARES DE NUCLEACION QUE MINIMIZA LA FORMACION DE ESPACIOS VACIOS INTERMEDIOS. ADEMAS DE SER LIMPIADO MEDIANTE UN PROCESO DE EROSION POR ACIDO, EL BLINDAJE PUEDE EXPONERSE A LA ACCION DE UN CHORRO DE PARTICULAS. LA EXPOSICION AL CHORRO DE PARTICULAS HACE LA SUPERFICIE DEL BLINDAJE IRREGULAR. TODO ELLO MEJORA LA SEPARACION DE LA SUPERFICIE DE CONTACTO DEL MATERIAL DEPOSITADO EN UNA ESCALA MICROSCOPICA, DANDO COMO RESULTADO UN MENOR DESMENUZAMIENTO.
ES91102324T 1990-03-02 1991-02-19 Procedimiento para preparar una armadura, con el fin de reducir las particulas dentro de una camara de deposicion fisica de vapor. Expired - Lifetime ES2076385T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US48756790A 1990-03-02 1990-03-02

Publications (1)

Publication Number Publication Date
ES2076385T3 true ES2076385T3 (es) 1995-11-01

Family

ID=23936262

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91102324T Expired - Lifetime ES2076385T3 (es) 1990-03-02 1991-02-19 Procedimiento para preparar una armadura, con el fin de reducir las particulas dentro de una camara de deposicion fisica de vapor.

Country Status (5)

Country Link
EP (1) EP0446657B1 (es)
JP (1) JPH0819515B2 (es)
KR (1) KR100226809B1 (es)
DE (1) DE69111490T2 (es)
ES (1) ES2076385T3 (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5391275A (en) * 1990-03-02 1995-02-21 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
US5401319A (en) * 1992-08-27 1995-03-28 Applied Materials, Inc. Lid and door for a vacuum chamber and pretreatment therefor
US5403459A (en) * 1993-05-17 1995-04-04 Applied Materials, Inc. Cleaning of a PVD chamber containing a collimator
US5423918A (en) * 1993-09-21 1995-06-13 Applied Materials, Inc. Method for reducing particulate contamination during plasma processing of semiconductor devices
JP2720420B2 (ja) * 1994-04-06 1998-03-04 キヤノン販売株式会社 成膜／エッチング装置
US5518593A (en) * 1994-04-29 1996-05-21 Applied Komatsu Technology, Inc. Shield configuration for vacuum chamber
WO1996025535A1 (en) * 1995-02-16 1996-08-22 Philips Electronics N.V. Device having a switch comprising a chromium layer and method for depositing chromium layers by sputtering
US5614071A (en) * 1995-06-28 1997-03-25 Hmt Technology Corporation Sputtering shield
US6007673A (en) * 1996-10-02 1999-12-28 Matsushita Electronics Corporation Apparatus and method of producing an electronic device
US6589407B1 (en) * 1997-05-23 2003-07-08 Applied Materials, Inc. Aluminum deposition shield
US6105435A (en) * 1997-10-24 2000-08-22 Cypress Semiconductor Corp. Circuit and apparatus for verifying a chamber seal, and method of depositing a material onto a substrate using the same
JP4656697B2 (ja) 2000-06-16 2011-03-23 キヤノンアネルバ株式会社 高周波スパッタリング装置
JP5856805B2 (ja) * 2010-11-01 2016-02-10 株式会社アルバック 真空部品の製造方法
US20200306802A1 (en) * 2017-12-18 2020-10-01 Sekisui Chemical Co., Ltd. Surface treatment method and surface treatment apparatus
CN112847048B (zh) * 2020-12-31 2021-12-17 浙江茂丰工艺品有限公司 一种水晶加工设备
CN112877655A (zh) * 2021-03-08 2021-06-01 泰杋科技股份有限公司 一种溅镀沉积的反应腔体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2088659A5 (es) * 1970-04-21 1972-01-07 Progil
BE786708A (fr) * 1971-07-29 1973-01-25 Uss Eng & Consult Application d'un revetement de chrome brillant sous un vide modere
JPS60238474A (ja) * 1984-05-10 1985-11-27 Toshiba Corp モリブデンシリサイドスパツタリング装置
JPS62243783A (ja) * 1986-04-16 1987-10-24 Hitachi Ltd 真空処理装置
JPS6454733A (en) * 1987-08-26 1989-03-02 Toshiba Corp Production device for semiconductor
JPH01159368A (ja) * 1987-12-15 1989-06-22 Canon Inc 堆積膜形成装置
JPH02285067A (ja) * 1989-04-27 1990-11-22 Toshiba Corp 真空薄膜形成装置
JPH083145B2 (ja) * 1989-06-08 1996-01-17 富士通株式会社 半導体製造装置

Also Published As

Publication number Publication date
JPH0819515B2 (ja) 1996-02-28
EP0446657A1 (en) 1991-09-18
EP0446657B1 (en) 1995-07-26
DE69111490T2 (de) 1996-04-18
DE69111490D1 (de) 1995-08-31
JPH05106020A (ja) 1993-04-27
KR100226809B1 (ko) 1999-10-15

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