IL155459A0 - An integrated circuit carrier - Google Patents

An integrated circuit carrier

Info

Publication number
IL155459A0
IL155459A0 IL15545901A IL15545901A IL155459A0 IL 155459 A0 IL155459 A0 IL 155459A0 IL 15545901 A IL15545901 A IL 15545901A IL 15545901 A IL15545901 A IL 15545901A IL 155459 A0 IL155459 A0 IL 155459A0
Authority
IL
Israel
Prior art keywords
integrated circuit
carrier
islands
circuit carrier
receiving zone
Prior art date
Application number
IL15545901A
Other languages
English (en)
Original Assignee
Silverbrook Res Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silverbrook Res Pty Ltd filed Critical Silverbrook Res Pty Ltd
Publication of IL155459A0 publication Critical patent/IL155459A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Amplifiers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
IL15545901A 2000-10-20 2001-10-19 An integrated circuit carrier IL155459A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/693,277 US6710457B1 (en) 2000-10-20 2000-10-20 Integrated circuit carrier
PCT/AU2001/001336 WO2002034020A1 (en) 2000-10-20 2001-10-19 An integrated circuit carrier

Publications (1)

Publication Number Publication Date
IL155459A0 true IL155459A0 (en) 2003-11-23

Family

ID=24784027

Family Applications (2)

Application Number Title Priority Date Filing Date
IL15545901A IL155459A0 (en) 2000-10-20 2001-10-19 An integrated circuit carrier
IL155459A IL155459A (en) 2000-10-20 2003-04-15 Integrated circuit carrier

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL155459A IL155459A (en) 2000-10-20 2003-04-15 Integrated circuit carrier

Country Status (12)

Country Link
US (5) US6710457B1 (de)
EP (1) EP1334647B1 (de)
JP (2) JP3839405B2 (de)
KR (1) KR100499821B1 (de)
CN (1) CN1238941C (de)
AT (1) ATE375702T1 (de)
AU (2) AU2002210256B2 (de)
DE (1) DE60130913D1 (de)
IL (2) IL155459A0 (de)
SG (1) SG126772A1 (de)
WO (1) WO2002034020A1 (de)
ZA (1) ZA200303160B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6710457B1 (en) * 2000-10-20 2004-03-23 Silverbrook Research Pty Ltd Integrated circuit carrier
US7221043B1 (en) * 2000-10-20 2007-05-22 Silverbrook Research Pty Ltd Integrated circuit carrier with recesses
US6775906B1 (en) * 2000-10-20 2004-08-17 Silverbrook Research Pty Ltd Method of manufacturing an integrated circuit carrier
TW587325B (en) * 2003-03-05 2004-05-11 Advanced Semiconductor Eng Semiconductor chip package and method for manufacturing the same
US7345353B2 (en) * 2005-12-30 2008-03-18 International Business Machines Corporation Silicon carrier having increased flexibility
US8735183B2 (en) 2007-04-12 2014-05-27 Micron Technology, Inc. System in package (SIP) with dual laminate interposers
EP2410562B1 (de) * 2009-03-19 2016-04-13 Fujitsu Limited Halbleiterbauelement, herstellungsverfahren dafür, elektronische einrichtung und elektronische komponente
TW201448126A (zh) * 2013-06-07 2014-12-16 日月光半導體製造股份有限公司 半導體封裝件及其製造方法
DE102014210912A1 (de) * 2014-06-06 2015-12-17 Robert Bosch Gmbh Interposer für die Montage eines vertikal hybrid integrierten Bauteils auf einem Bauteilträger
US10064275B1 (en) 2017-07-18 2018-08-28 Mellanox Technologies, Ltd. Extending the lifetime of a leadless SMT solder joint using pads comprising spring-shaped traces
US20250118715A1 (en) 2022-01-25 2025-04-10 Analog Devices, Inc. Microelectromechanical systems (mems) and related packages

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62257756A (ja) * 1986-04-30 1987-11-10 Nec Corp シリコン基板
IT1201836B (it) * 1986-07-17 1989-02-02 Sgs Microelettronica Spa Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico
JPH01258458A (ja) * 1988-04-08 1989-10-16 Nec Corp ウェーハ集積型集積回路
JPH0242739A (ja) * 1988-08-01 1990-02-13 Toagosei Chem Ind Co Ltd Ｃｏｂ実装プリント回路板
JPH06503207A (ja) * 1990-09-27 1994-04-07 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー 熱的歪み緩和複合超小形電子デバイス
JPH0685010A (ja) * 1992-09-02 1994-03-25 Toshiba Corp マルチチップモジュール
JP3294740B2 (ja) 1995-07-31 2002-06-24 富士通株式会社 半導体装置
DE19540814A1 (de) * 1995-11-02 1997-05-07 Vdo Schindling Platine
FR2745930B1 (fr) * 1996-03-11 1998-04-10 Solaic Sa Carte a circuit integre comportant une zone desolidarisee par une rainure
US6064576A (en) * 1997-01-02 2000-05-16 Texas Instruments Incorporated Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board
US6067505A (en) * 1997-04-10 2000-05-23 The Foxboro Company Method and apparatus for self-calibration of a coordinated control system for an electric power generating station
AUPP398798A0 (en) * 1998-06-09 1998-07-02 Silverbrook Research Pty Ltd Image creation method and apparatus (ij43)
JPH11135675A (ja) * 1997-10-30 1999-05-21 Kawasaki Steel Corp 半導体装置及びその製造方法
JP3398319B2 (ja) * 1997-12-16 2003-04-21 新光電気工業株式会社 半導体装置及びその製造方法
JP3718989B2 (ja) 1998-03-17 2005-11-24 日本軽金属株式会社 アルミニウム精製方法及び精製装置
JPH11284029A (ja) 1998-03-27 1999-10-15 Denso Corp 電子部品の実装構造
JP3575324B2 (ja) 1998-03-31 2004-10-13 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法及び半導体装置の実装方法
WO1999059206A2 (en) 1998-05-13 1999-11-18 Koninklijke Philips Electronics N.V. Semiconductor device and method for making the device
JP2000012732A (ja) * 1998-06-24 2000-01-14 Rohm Co Ltd Ｂｇａ型半導体装置の構造
US6050832A (en) * 1998-08-07 2000-04-18 Fujitsu Limited Chip and board stress relief interposer
US6341071B1 (en) 1999-03-19 2002-01-22 International Business Machines Corporation Stress relieved ball grid array package
US6078505A (en) 1999-05-14 2000-06-20 Triquint Semiconductor, Inc. Circuit board assembly method
JP2001094228A (ja) 1999-09-22 2001-04-06 Seiko Epson Corp 半導体装置の実装構造
JP3772078B2 (ja) * 2000-09-29 2006-05-10 株式会社東芝 半導体装置及び半導体装置搭載用配線基板
US6710457B1 (en) * 2000-10-20 2004-03-23 Silverbrook Research Pty Ltd Integrated circuit carrier
US6507099B1 (en) * 2000-10-20 2003-01-14 Silverbrook Research Pty Ltd Multi-chip integrated circuit carrier
US6700195B1 (en) * 2003-03-26 2004-03-02 Delphi Technologies, Inc. Electronic assembly for removing heat from a flip chip

Also Published As

Publication number Publication date
JP2004511921A (ja) 2004-04-15
US7187086B2 (en) 2007-03-06
US6946743B2 (en) 2005-09-20
US7470995B2 (en) 2008-12-30
ATE375702T1 (de) 2007-10-15
DE60130913D1 (de) 2007-11-22
US20040164424A1 (en) 2004-08-26
CN1238941C (zh) 2006-01-25
ZA200303160B (en) 2003-11-06
US20070164450A1 (en) 2007-07-19
US7919872B2 (en) 2011-04-05
US20090056986A1 (en) 2009-03-05
WO2002034020A1 (en) 2002-04-25
EP1334647A4 (de) 2006-05-03
AU2002210256B2 (en) 2004-04-22
US20050140001A1 (en) 2005-06-30
JP4528245B2 (ja) 2010-08-18
US6710457B1 (en) 2004-03-23
JP3839405B2 (ja) 2006-11-01
CN1471801A (zh) 2004-01-28
KR100499821B1 (ko) 2005-07-07
AU1025602A (en) 2002-04-29
JP2006080556A (ja) 2006-03-23
EP1334647B1 (de) 2007-10-10
IL155459A (en) 2010-05-17
KR20030057542A (ko) 2003-07-04
SG126772A1 (en) 2006-11-29
EP1334647A1 (de) 2003-08-13

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