JP2000323878A - 電子機器の冷却構造 - Google Patents

電子機器の冷却構造

Info

Publication number
JP2000323878A
JP2000323878A JP11130910A JP13091099A JP2000323878A JP 2000323878 A JP2000323878 A JP 2000323878A JP 11130910 A JP11130910 A JP 11130910A JP 13091099 A JP13091099 A JP 13091099A JP 2000323878 A JP2000323878 A JP 2000323878A
Authority
JP
Japan
Prior art keywords
shield case
housing
top plate
fan
cooling structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11130910A
Other languages
English (en)
Japanese (ja)
Inventor
Kenichi Maehara
健一 前原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11130910A priority Critical patent/JP2000323878A/ja
Priority to TW089107890A priority patent/TW463541B/zh
Priority to MYPI20001998A priority patent/MY116078A/en
Priority to US09/569,149 priority patent/US6226182B1/en
Priority to EP00109973A priority patent/EP1052884B1/fr
Priority to DE60017826T priority patent/DE60017826T2/de
Priority to CNB001083716A priority patent/CN1295949C/zh
Publication of JP2000323878A publication Critical patent/JP2000323878A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0041—Ventilation panels having provisions for screening

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP11130910A 1999-05-12 1999-05-12 電子機器の冷却構造 Pending JP2000323878A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP11130910A JP2000323878A (ja) 1999-05-12 1999-05-12 電子機器の冷却構造
TW089107890A TW463541B (en) 1999-05-12 2000-04-26 Cooling structure of electronic appliance
MYPI20001998A MY116078A (en) 1999-05-12 2000-05-09 Cooling structure of electronic appliance
US09/569,149 US6226182B1 (en) 1999-05-12 2000-05-11 Cooling structure of electronic appliance
EP00109973A EP1052884B1 (fr) 1999-05-12 2000-05-11 Structure de refroidissement pour un appareil électronique
DE60017826T DE60017826T2 (de) 1999-05-12 2000-05-11 Kühlstruktur eines elektronischen Geräts
CNB001083716A CN1295949C (zh) 1999-05-12 2000-05-12 电子设备冷却构件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11130910A JP2000323878A (ja) 1999-05-12 1999-05-12 電子機器の冷却構造

Publications (1)

Publication Number Publication Date
JP2000323878A true JP2000323878A (ja) 2000-11-24

Family

ID=15045604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11130910A Pending JP2000323878A (ja) 1999-05-12 1999-05-12 電子機器の冷却構造

Country Status (7)

Country Link
US (1) US6226182B1 (fr)
EP (1) EP1052884B1 (fr)
JP (1) JP2000323878A (fr)
CN (1) CN1295949C (fr)
DE (1) DE60017826T2 (fr)
MY (1) MY116078A (fr)
TW (1) TW463541B (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1217880A3 (fr) * 2000-12-21 2004-03-24 Siemens Aktiengesellschaft Dispositif pour le refroidissement de composants
US7068505B2 (en) 2003-01-28 2006-06-27 Fujitsu Limited Air duct and electronic equipment using the air duct
JP2006301715A (ja) * 2005-04-15 2006-11-02 Toshiba Corp 電子機器
JP2007073790A (ja) * 2005-09-08 2007-03-22 Sharp Corp 配線部材係止装置および電子機器筐体
CN100526657C (zh) * 2006-06-12 2009-08-12 台达电子工业股份有限公司 风扇扇框及其接合结构
WO2009130754A1 (fr) * 2008-04-21 2009-10-29 富士通株式会社 Equipement electronique
JP2010103581A (ja) * 2010-02-10 2010-05-06 Fujitsu Ltd エアダクト及び電子装置
JP2011060329A (ja) * 2010-12-10 2011-03-24 Toshiba Corp 電子機器
CN115096040A (zh) * 2022-06-16 2022-09-23 林素丽 用于制冷设备内部温度的电控系统
JP2023094869A (ja) * 2021-12-24 2023-07-06 Ｎｅｃパーソナルコンピュータ株式会社 情報処理装置

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US7110227B2 (en) 1997-04-08 2006-09-19 X2Y Attenuators, Llc Universial energy conditioning interposer with circuit architecture
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
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US7336467B2 (en) 2000-10-17 2008-02-26 X2Y Attenuators, Llc Energy pathway arrangement
US20020122286A1 (en) * 2000-10-17 2002-09-05 X2Y Attenuators, Llc Energy pathway arrangement
US7042703B2 (en) 2000-03-22 2006-05-09 X2Y Attenuators, Llc Energy conditioning structure
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US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
US7106570B2 (en) 1997-04-08 2006-09-12 Xzy Altenuators, Llc Pathway arrangement
US7274549B2 (en) 2000-12-15 2007-09-25 X2Y Attenuators, Llc Energy pathway arrangements for energy conditioning
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US7110235B2 (en) 1997-04-08 2006-09-19 Xzy Altenuators, Llc Arrangement for energy conditioning
US6954346B2 (en) 1997-04-08 2005-10-11 Xzy Attenuators, Llc Filter assembly
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US20030161086A1 (en) 2000-07-18 2003-08-28 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7427816B2 (en) 1998-04-07 2008-09-23 X2Y Attenuators, Llc Component carrier
US7113383B2 (en) 2000-04-28 2006-09-26 X2Y Attenuators, Llc Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
EP1312148A4 (fr) 2000-08-15 2009-06-03 X2Y Attenuators Llc Systeme d'electrodes pour conditionnement d'energie en circuit
US7193831B2 (en) 2000-10-17 2007-03-20 X2Y Attenuators, Llc Energy pathway arrangement
KR100536511B1 (ko) 2000-10-17 2005-12-14 엑스2와이 어테뉴에이터스, 엘.엘.씨 공통 기준 노드를 갖는 단일 또는 다수의 회로들을 위한 차폐 아말감 및 차폐된 에너지 경로들 및 다른 엘리먼트들
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US6459578B1 (en) * 2001-04-24 2002-10-01 Agilent Technologies, Inc. Chassis having reduced acoustic noise and electromagnetic emissions and method of cooling components within a chassis
US6765796B2 (en) * 2002-11-21 2004-07-20 Teradyne, Inc. Circuit board cover with exhaust apertures for cooling electronic components
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US6724624B1 (en) * 2003-05-05 2004-04-20 Douglas A. Dodson Housing with directed-flow cooling for computer
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KR20060120683A (ko) 2003-12-22 2006-11-27 엑스2와이 어테뉴에이터스, 엘.엘.씨 내부적으로 차폐된 에너지 컨디셔너
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CN100561717C (zh) * 2004-10-21 2009-11-18 鸿富锦精密工业（深圳）有限公司 电子元件散热装置及其组合
US7218517B2 (en) * 2004-12-07 2007-05-15 International Business Machines Corporation Cooling apparatus for vertically stacked printed circuit boards
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JP2008537843A (ja) 2005-03-01 2008-09-25 エックストゥーワイ アテニュエイターズ，エルエルシー 内部で重なり合った調整器
WO2006093831A2 (fr) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Conditionneur d'energie avec electrodes traversantes reliees
WO2006099297A2 (fr) 2005-03-14 2006-09-21 X2Y Attenuators, Llc Conditionneur a conducteurs coplanaires
CN2792115Y (zh) * 2005-05-06 2006-06-28 纽福克斯光电科技（上海）有限公司 超小型超薄转换器
TWI259522B (en) * 2005-08-02 2006-08-01 Quanta Comp Inc Electronic device
EP1758439A1 (fr) * 2005-08-23 2007-02-28 THOMSON Licensing Jupe périphérique destinée à être attachée sous le fond d'un dispositif, et dispositif correspondant
US9047066B2 (en) 2005-09-30 2015-06-02 Intel Corporation Apparatus and method to efficiently cool a computing device
CN2875001Y (zh) * 2005-12-23 2007-02-28 鸿富锦精密工业（深圳）有限公司 散热器
US20070147008A1 (en) * 2005-12-28 2007-06-28 Intel Corporation Use of porous materials to cool the surfaces of a computing device
US7403385B2 (en) * 2006-03-06 2008-07-22 Cisco Technology, Inc. Efficient airflow management
EP1991996A1 (fr) 2006-03-07 2008-11-19 X2Y Attenuators, L.L.C. Structures de conditionneur d'énergie
US7593229B2 (en) * 2006-03-31 2009-09-22 Hong Kong Applied Science & Technology Research Institute Co. Ltd Heat exchange enhancement
US8654528B2 (en) * 2006-11-16 2014-02-18 Autonetworks Technologies, Ltd. Electric connection box
US7764514B2 (en) * 2006-12-08 2010-07-27 Intel Corporation Electromagnetic interference shielding for device cooling
WO2008136172A1 (fr) * 2007-04-16 2008-11-13 Panasonic Corporation Structure d'installation d'une unité de ventilation
JP5011016B2 (ja) * 2007-07-30 2012-08-29 株式会社日立産機システム 電力変換装置
JP4934559B2 (ja) * 2007-09-27 2012-05-16 オンセミコンダクター・トレーディング・リミテッド 回路装置およびその製造方法
JP2009081325A (ja) * 2007-09-27 2009-04-16 Sanyo Electric Co Ltd 回路装置
TWI402952B (zh) * 2007-09-27 2013-07-21 三洋電機股份有限公司 電路裝置及其製造方法
JP4969388B2 (ja) * 2007-09-27 2012-07-04 オンセミコンダクター・トレーディング・リミテッド 回路モジュール
JP5319908B2 (ja) * 2007-10-31 2013-10-16 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置
US7957140B2 (en) * 2007-12-31 2011-06-07 Intel Corporation Air mover for device surface cooling
US8553409B2 (en) * 2008-06-27 2013-10-08 Dell Products L.P. System and method for portable information handling system parallel-wall thermal shield
KR100997864B1 (ko) * 2008-07-16 2010-12-01 배성우 책상 하면 부착형 컴퓨터
US10321601B2 (en) * 2008-10-17 2019-06-11 Artesyn Embedded Computing, Inc. System and method for restricting airflow through a portion of an electronics enclosure
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JP5614542B2 (ja) * 2011-03-28 2014-10-29 株式会社安川電機 モータ制御装置
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CN102361232B (zh) * 2011-06-17 2014-10-01 赫兹曼电力（广东）有限公司 密封开关柜箱体
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CN104487794B (zh) * 2012-09-05 2017-03-08 松下知识产权经营株式会社 冷却装置、装载有该冷却装置的电动汽车和电子设备
TWM456072U (zh) * 2012-11-16 2013-06-21 Wistron Corp 電子裝置及其機殼
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CN104486935A (zh) * 2014-12-18 2015-04-01 江苏天安智联科技股份有限公司 一种用于车载主机的电磁屏蔽兼散热装置
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CN113840503A (zh) * 2020-06-23 2021-12-24 福州数据技术研究院有限公司 一种复杂电磁环境下的主动散热结构
CN113194688A (zh) * 2021-05-07 2021-07-30 同方威视技术股份有限公司 防辐射盒体系统
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1217880A3 (fr) * 2000-12-21 2004-03-24 Siemens Aktiengesellschaft Dispositif pour le refroidissement de composants
US7068505B2 (en) 2003-01-28 2006-06-27 Fujitsu Limited Air duct and electronic equipment using the air duct
JP2006301715A (ja) * 2005-04-15 2006-11-02 Toshiba Corp 電子機器
JP2007073790A (ja) * 2005-09-08 2007-03-22 Sharp Corp 配線部材係止装置および電子機器筐体
CN100526657C (zh) * 2006-06-12 2009-08-12 台达电子工业股份有限公司 风扇扇框及其接合结构
WO2009130754A1 (fr) * 2008-04-21 2009-10-29 富士通株式会社 Equipement electronique
JP2010103581A (ja) * 2010-02-10 2010-05-06 Fujitsu Ltd エアダクト及び電子装置
JP2011060329A (ja) * 2010-12-10 2011-03-24 Toshiba Corp 電子機器
JP2023094869A (ja) * 2021-12-24 2023-07-06 Ｎｅｃパーソナルコンピュータ株式会社 情報処理装置
CN115096040A (zh) * 2022-06-16 2022-09-23 林素丽 用于制冷设备内部温度的电控系统
CN115096040B (zh) * 2022-06-16 2024-06-11 雄美(河北雄安)科技有限公司 用于制冷设备内部温度的电控系统

Also Published As

Publication number Publication date
US6226182B1 (en) 2001-05-01
EP1052884A2 (fr) 2000-11-15
DE60017826D1 (de) 2005-03-10
EP1052884B1 (fr) 2005-02-02
DE60017826T2 (de) 2005-06-23
EP1052884A3 (fr) 2001-02-28
CN1295949C (zh) 2007-01-17
MY116078A (en) 2003-10-31
CN1274258A (zh) 2000-11-22
TW463541B (en) 2001-11-11

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