JP2009261978A - 耐摩耗性と耐酸化性のバランスを改良した超高分子量架橋ポリエチレン製医療用移植片の成形プロセス - Google Patents
耐摩耗性と耐酸化性のバランスを改良した超高分子量架橋ポリエチレン製医療用移植片の成形プロセス Download PDFInfo
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Abstract
【解決手段】耐摩耗性と耐酸化性の改良バランスを有する超高分子量ポリエチレン製の医療用移植片は、超高分子量ポリエチレンのプリフォーム(予備成形品)に照射し、照射されたプリフォームを酸素欠如下で融解開始温度またはそれより高い温度でアニールし、安定化した架橋ポリマーから移植片を成形するという方法で作成される。本移植片は非照射超高分子量ポリエチレンに比較して、同程度の耐酸化性およびよりすぐれた耐摩耗性を有する。
【選択図】なし
Description
特に記さない限り、試験片はプリフォームロッドの内部から作成される。
UHMWPE 試料から機械加工でASTM D-638に準拠する引っ張り試験片タイプIVを作成した。試験片をLloyd LR10k機械試験フレームに取り付け、ASTM D-638により引張降伏応力(TYS)、極限引張り応力(UTS)および伸び率を試験した。例1-27および比較例A-CのUTS、TYSおよび伸び率の測定にタイプIV試験片を使用した。
UHMWPE 試料から機械加工でタイプI試験片を作成し、試験フレームに取り付けた。ASTM D-638による引張弾性率をこれらの試料で測定した。例28-37および比較例DのTYS、UTSおよび伸び率の測定にもタイプI試験片を使用した。
伸び特性のすべては5試験片の平均を表す。
測定した融解熱を結晶UHMWPEの理論融解熱、290J/gで除して結晶化率を決めた。
例1-3、28-37および比較例A-Dのそれぞれにおいて、UHMWPEプリフォームは形状が径3.5in.(8.9cm)長さ約30in.(76.2cm)のラム押出UHMWPE(PolyHi Solidur, フォート・ウェイン社、インディアナ州) GUR4150HPから成る。このポリマーは分子量約600万、ピーク融点約135℃、結晶化率約45-55%である。
上記のUHMWPEロッドをMYLAR(商標)ポリエステル被膜を有する加熱密封包装フォイル、SPクラスEスタイル1.40スリーブ加工素材、のパウチに別々に入れ、窒素で洗浄の後真空にした。この手順を繰り返し、次にパウチを真空下で密封した。例1のロッドをコバルト60ソースからのガンマ線線量1Mradで照射した。ガンマ線照射はIsomedix(Morton Grove社、イリノイ州)で行った。例2および3のロッドをそれぞれ2.5Mradおよび5Mradで照射した。照射の後、包装したロッドを325℃の温度で個別にオーブンに入れ、この温度で4.5時間保持した。4.5時間の終わりに、ロッドを包装内で約20℃/時で常温にオーブン内で冷却した。つぎに、冷却したロッドを包装からから取り出し、上記のように機械的および物理的特性、酸化を測定した。その結果およびプロセス条件を表Iに示す。これらの例は熟成および未熟成状態の両方において、比較例A、BおよびCに比べ優れた耐酸化性を示す。その効果はより高い線量5Mradの例3で最大である(比較例C対比)。例1-3の熟成および未熟成耐酸化性は非照射例Dと同等である。この性能の改善は325℃でのアニールによる実質的に完全な遊離基の失活に由来する。これらの例は予期しない利点、すなわち伸び率約2xという大きな増加を示し、これは325℃でのアニールに起因するものであった。伸びは一般的に280℃よりも高い温度でアニールまたはプレアニールした試料で顕著に増加する。
比較例AおよびCのUHMWPEロッドは例1-3で説明したように真空下で包装し、それぞれ1Mradおよび5.0Mradの線量で照射したロッドである。比較例Bのロッドは包装せずに空気中で2.5Mradで照射したロッドである。ロッドは照射後の熱処理をしていない。機械的特性、物理的特性および酸化を上記のように測定した。結果およびプロセス条件を表Iに示す。ロッドの内部から試験片を採取することで、空気中で照射した例Bに同等な酸化効果をほとんど除外した。例Bにつき、15mg/100万サイクルの未熟成摩耗率および88mg/100万サイクルの熟成摩耗率が500万サイクルの後に測定された。これらの例は熟成加速状態での酸化劣化を示し、失活していない遊離基の酸素との反応を実証している。例Bは衝撃強度および摩耗に及ぼすこの酸化効果を示す。衝撃強度は熟成後10のファクタで減少する。例Bの未熟成摩耗率は比較例Dに比べ改善されているが、熟成の後の摩耗率は6x近くで増加し、比較例Dの摩耗率より著しく高い。
この例のUHMWPEロッドは照射、熱処理または加圧していないロッドである。これらのロッドをPLAZLYTE(商標)滅菌システム(Abtox, Ink社、ムンデライン、イリノイ州)でガスプラズマ滅菌した。機械的および物理的特性は市販のUHMWPEロッドと類似であり、表Vに示す。未熟成摩耗率30mg/100万サイクルおよび熟成摩耗率33mg/100万サイクルが500万サイクルの後に得られた。
PolyHi Solidurから得られた形状が径3in.(7.6cm)のロットであるHoechstGUR415 UHMWPEを約15in.(38.1cm)長に切断し、ポリエチレン内層アルミニウムフォイル袋に窒素雰囲気で密封した。
ロットをCo-60ガンマ線で照射し、密閉袋内で1ヶ月熟成して遊離基を反応させた。照射線量は0.5、1、2、および5Mradを使用した。次に棒材を袋から取り出し、ここに引用として取り入れたシモンズ(Simmons)らの米国特許第5,236,669号が記載するように、直ちに圧力容器に入れた。容器を密閉して水で約5000psiまで加圧して加圧再結晶を行った。次に容器を1.5時間にわたって250℃まで加熱した。2時間後、圧力を50,000psiに上昇させ、残りの圧力処理の間この圧力を維持した。250℃で1-2時間の後、容器を75℃まで冷却し、この点で圧力を開放して製品を回収した。追加のロッドも上記の手順を用いて39,000および34,000psiで加圧再結晶した。結果を表IIに示す。
この例では、径3in.のGUR415 UHMWPEロッドを235℃で4.5時間窒素中でプレアニールし、窒素中で約20℃/時で冷却し、次に窒素雰囲気下でアルミニウムフォイル/ポリエチレン袋に密封した。次に棒材をガンマ線で照射した。1ヶ月の熟成の後、ポリマーを上記の方法で加圧再結晶した。プロセス条件および結果を表IIIに示す。ポリマーは高圧下でのみ鎖が伸張した形状に変換される。加圧再結晶中50,000psiで処理した試料は高い融点、高い融解熱、高い引張弾性率、高い最大強度、高い降伏引張強度、高いアイゾット衝撃強度および耐クリープ性の改善を示した。
例16-21のプレアニールした試料はプレアニールしていない例4,5,7,8,10および11の対応する試料よりも高い伸びを有する。
この例では、これらの例では、径3in.のGUR415 UHMWPEロッドを2.5Mradおよび5Mradでガンマ線照射し、次に例4-15に記したプロセスを用いて39,500psiで加圧再結晶させた。照射条件および結果を表IVに示す。
これらの例では、径3in.のGUR415 UHMWPEロッドを2.5Mradおよび5Mradでガンマ線照射し、次に例4-15に記したプロセスを用いて33,500psiで加圧再結晶させた。照射条件および結果を表IVに示す。
例22-23および例24-25は熟成および未熟成状態で、例1-3同様、優れた耐酸化性を示し、これは加圧再結晶段階における遊離基の実質的に完全な失活に起因する。試料は結晶化率の増加を示し、これは結果として架橋の存在下でも結晶構造を変えることが可能であることを示す。
これらの例では、径3in.のGUR415 UHMWPEロッドを照射前に窒素雰囲気下325℃で4.5時間プレアニールし、約20℃/時で冷却し、引き続き窒素中で2.5Mradおよび5Mradでガンマ線照射し、次に例4-15に記したプロセスを用いて39,500psiで加圧再結晶させた。照射条件および結果を表IVに示す。これらの例は照射後にプレアニール(325℃)段階を加圧再結晶に組み合わせることで、通常のUHMWPE(比較例D)に比べ、耐酸化性が保持され、伸びが増加し、結晶化率が増加することを示す。
例28-30のUHMWPEロッドは包装し、例2に記したように処理したロッド(2.5Mrad)である。ただしロッドの加熱条件は155℃、それぞれ6,24および48時間とした。次にロッドをオーブンから取り出して冷却した。プロセス条件および機械的特性、物理的特性を表Vに示す。これらの例は155℃でのアニールが耐酸化性に優れた材料を創出することを示す。照射試料28-30は非照射の比較例Dに比べ、二重ノッチ付きアイゾットの減少を示す。また、線量2.5Mradの照射で生じた架橋が膨潤比3.9を生じることを示し、例Dの24.1と比較される。例30の架橋ポリマーで作成した股関節カップにつき、500万サイクル後の未熟成摩耗率14mg/100万サイクルが測定された。
例31,32および33のUHMWPEロッドは包装し、例3に記したように処理したロッド(5Mrad)である。ただしロッドの加熱条件は155℃、それぞれ6,24および48時間とした。次にロッドをオーブンから取り出して冷却した。プロセス条件および機械的特性、物理的特性を表Vに示す。これらの例は5Mradのガンマ線に暴露し、次に155℃でアニールしたUHMWPEが優れた耐酸化性を与えることを示す。また、放射線線量が衝撃強度および伸びを減少させることを示す。これらの膨潤比2.6を例28-30と比べると、架橋が放射線線量に伴って増加することが分かる。未成熟摩耗率0.8mg/100万サイクルおよび成熟摩耗率0.6mg/100万サイクルが250万サイクル後の例32で測定された。例32の摩耗率は例30,BおよびDに比べ大きく減少している。照射およびアニールの両方を行うことで、この材料の摩耗および耐酸化性は照射しアニールしていない材料よりも大きく改善される。耐酸化性は非照射ポリマー(比較例D)と同等であり、摩耗性能は著しく改善されている。
例34,35および36のUHMWPEロッドは包装し、例3に記したように処理したロッド(5Mrad)である。ただしロッドの加熱条件は200℃、それぞれ6,24および48時間とした。次にロッドをオーブンから取り出して冷却した。プロセス条件および機械的特性、物理的特性を表Vに示す。これらの例は200℃でのアニールも耐酸化性材料を作成するのに効果的であることを示す。
この例のロッドは包装し、例3に記したように処理したロッド(5Mrad)である。ただしロッドの加熱条件は200℃、48時間とした。次にロッドをオーブンから取り出して冷却した。未成熟摩耗率5mg/100万サイクルが500万サイクル後に測定された。結果を表Vに示す。この例は5Mradで架橋し、120℃で48時間アニールした材料の耐摩耗性が改善されることを示し、例30(2.5Mrad、155℃/48時間)、C(5Mrad、非アニール)およびD(非照射)と比較される。
Claims (1)
- 耐摩耗性と耐酸化性の改良されたバランスを有する医療用移植片の製造方法であって、
超高分子ポリエチレンのプリフォームに照射して遊離基を形成し、
前記照射されたプリフォームを、実質的に酸素のない雰囲気中で融解開始温度またはそれ以上の温度で、実質的にすべての前記遊離基の再結合および前記超高分子ポリエチレンの架橋のために十分な時間加熱することによってアニールし、
前記架橋したプリフォームを冷却し、その間実質的に酸素のない雰囲気を維持し、
前記架橋したプリフォームから医療用移植片を成形し、
前記医療用移植片を空気透過性包装に包み、
前記包装した移植片を非照射法を用いて滅菌する諸段階を含んでなる方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US2735496P | 1996-10-02 | 1996-10-02 | |
| US08/911,792 US6017975A (en) | 1996-10-02 | 1997-08-15 | Process for medical implant of cross-linked ultrahigh molecular weight polyethylene having improved balance of wear properties and oxidation resistance |
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| JP51686598A Division JP5014528B2 (ja) | 1996-10-02 | 1997-10-02 | 耐摩耗性と耐酸化性のバランスを改良した超高分子量架橋ポリエチレン製医療用移植片の成形プロセス |
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| JP2009261978A true JP2009261978A (ja) | 2009-11-12 |
| JP2009261978A5 JP2009261978A5 (ja) | 2012-05-17 |
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| JP51686598A Expired - Lifetime JP5014528B2 (ja) | 1996-10-02 | 1997-10-02 | 耐摩耗性と耐酸化性のバランスを改良した超高分子量架橋ポリエチレン製医療用移植片の成形プロセス |
| JP2009160178A Pending JP2009261978A (ja) | 1996-10-02 | 2009-07-06 | 耐摩耗性と耐酸化性のバランスを改良した超高分子量架橋ポリエチレン製医療用移植片の成形プロセス |
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| JP51686598A Expired - Lifetime JP5014528B2 (ja) | 1996-10-02 | 1997-10-02 | 耐摩耗性と耐酸化性のバランスを改良した超高分子量架橋ポリエチレン製医療用移植片の成形プロセス |
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| US (4) | US6017975A (ja) |
| EP (1) | EP0935474B1 (ja) |
| JP (2) | JP5014528B2 (ja) |
| AU (1) | AU4742697A (ja) |
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Also Published As
| Publication number | Publication date |
|---|---|
| DE69737356D1 (de) | 2007-03-29 |
| WO1998014223A1 (en) | 1998-04-09 |
| AU4742697A (en) | 1998-04-24 |
| EP0935474B1 (en) | 2007-02-14 |
| US6017975A (en) | 2000-01-25 |
| US6242507B1 (en) | 2001-06-05 |
| US20020107300A1 (en) | 2002-08-08 |
| DE69737356T2 (de) | 2007-08-16 |
| US6316158B1 (en) | 2001-11-13 |
| EP0935474A1 (en) | 1999-08-18 |
| US6562540B2 (en) | 2003-05-13 |
| JP2001523982A (ja) | 2001-11-27 |
| JP5014528B2 (ja) | 2012-08-29 |
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