JP3738127B2 - 高耐圧半導体デバイス - Google Patents
高耐圧半導体デバイス Download PDFInfo
- Publication number
- JP3738127B2 JP3738127B2 JP06233698A JP6233698A JP3738127B2 JP 3738127 B2 JP3738127 B2 JP 3738127B2 JP 06233698 A JP06233698 A JP 06233698A JP 6233698 A JP6233698 A JP 6233698A JP 3738127 B2 JP3738127 B2 JP 3738127B2
- Authority
- JP
- Japan
- Prior art keywords
- diffusion layer
- layer
- region
- conductivity type
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 32
- 238000009792 diffusion process Methods 0.000 claims description 171
- 239000010410 layer Substances 0.000 description 229
- 239000010408 film Substances 0.000 description 39
- 108091006146 Channels Proteins 0.000 description 33
- 239000012535 impurity Substances 0.000 description 31
- 230000015556 catabolic process Effects 0.000 description 29
- 239000010409 thin film Substances 0.000 description 21
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 18
- 229920005591 polysilicon Polymers 0.000 description 18
- 238000010586 diagram Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- TVZRAEYQIKYCPH-UHFFFAOYSA-N 3-(trimethylsilyl)propane-1-sulfonic acid Chemical compound C[Si](C)(C)CCCS(O)(=O)=O TVZRAEYQIKYCPH-UHFFFAOYSA-N 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/665—Vertical DMOS [VDMOS] FETs having edge termination structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/662—Vertical DMOS [VDMOS] FETs having a drift region having a doping concentration that is higher between adjacent body regions relative to other parts of the drift region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/156—Drain regions of DMOS transistors
- H10D62/157—Impurity concentrations or distributions
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06233698A JP3738127B2 (ja) | 1998-02-26 | 1998-02-26 | 高耐圧半導体デバイス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06233698A JP3738127B2 (ja) | 1998-02-26 | 1998-02-26 | 高耐圧半導体デバイス |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005273382A Division JP4294016B2 (ja) | 2005-09-21 | 2005-09-21 | 半導体デバイスの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11251590A JPH11251590A (ja) | 1999-09-17 |
| JPH11251590A5 JPH11251590A5 (2) | 2005-04-07 |
| JP3738127B2 true JP3738127B2 (ja) | 2006-01-25 |
Family
ID=13197195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP06233698A Expired - Lifetime JP3738127B2 (ja) | 1998-02-26 | 1998-02-26 | 高耐圧半導体デバイス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3738127B2 (2) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6635926B2 (en) * | 2000-08-30 | 2003-10-21 | Shindengen Electric Manufacturing Co., Ltd. | Field effect transistor with high withstand voltage and low resistance |
| JP2002246595A (ja) * | 2001-02-19 | 2002-08-30 | Shindengen Electric Mfg Co Ltd | トランジスタ |
| JP4088063B2 (ja) * | 2001-11-14 | 2008-05-21 | 株式会社東芝 | パワーmosfet装置 |
| JP3973934B2 (ja) * | 2002-03-15 | 2007-09-12 | 株式会社東芝 | 高耐圧半導体装置 |
| JP5037476B2 (ja) * | 2008-11-13 | 2012-09-26 | 三菱電機株式会社 | 半導体装置 |
| JP6381101B2 (ja) * | 2013-12-09 | 2018-08-29 | 富士電機株式会社 | 炭化珪素半導体装置 |
-
1998
- 1998-02-26 JP JP06233698A patent/JP3738127B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11251590A (ja) | 1999-09-17 |
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