JPH01100439U - - Google Patents

Info

Publication number
JPH01100439U
JPH01100439U JP19678887U JP19678887U JPH01100439U JP H01100439 U JPH01100439 U JP H01100439U JP 19678887 U JP19678887 U JP 19678887U JP 19678887 U JP19678887 U JP 19678887U JP H01100439 U JPH01100439 U JP H01100439U
Authority
JP
Japan
Prior art keywords
conductive pattern
land
electronic component
wiring board
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19678887U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19678887U priority Critical patent/JPH01100439U/ja
Publication of JPH01100439U publication Critical patent/JPH01100439U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5368—Shapes of wire connectors the bond wires having helical loops
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、この考案の一実施例を示した要部縦
断面図である。第２図乃至第５図は、この考案の
途中にリング状ループを形成したワイヤボンデイ
ング要領を示す説明図である。第６図及び第７図
は、ハイブリツドＩＣの具体的構造例を示す平面
図及び要部縦断面図である。 １……リードフレーム、２……ランド部、３…
…導電パターン、４……配線基板、６……電子部
品、７……リード、８……ワイヤ、８ａ……ルー
プ、９……外装樹脂材。 FIG. 1 is a longitudinal cross-sectional view of a main part showing an embodiment of this invention. FIGS. 2 to 5 are explanatory diagrams showing the procedure for wire bonding in which a ring-shaped loop is formed in the middle of this invention. FIGS. 6 and 7 are a plan view and a vertical sectional view of a main part showing a specific structural example of a hybrid IC. 1...Lead frame, 2...Land part, 3...
...Conductive pattern, 4...Wiring board, 6...Electronic component, 7...Lead, 8...Wire, 8a...Loop, 9...Exterior resin material.

Claims (1)

【実用新案登録請求の範囲】 金属製リードフレームのランド部上に、直接半
導体ペレツトをマウントするか、あるいは、上記
ランド部上に、導電パターンを形成すると共に、
該導電パターン上に、複数の半導体ペレツトを含
む電子部品をマウントした絶縁性の配線基板を固
着し、上記電子部品、配線基板の導電パターン及
び上記ランド部の周辺部近傍に延びるリード先端
部を、相互に適宜ワイヤで電気的に接続すると共
に、上記ランド部とリード先端部とを含む主要部
分を、樹脂モールドしてなる半導体装置に於いて
、 上記電子部品配線基板の導電パターン及びとリ
ード先端部とを、電気的に接続するワイヤの中間
部に、リング状のループを形成したことを特徴と
する半導体装置。[Claims for Utility Model Registration] Directly mounting a semiconductor pellet on the land of a metal lead frame, or forming a conductive pattern on the land,
An insulating wiring board on which an electronic component including a plurality of semiconductor pellets is mounted is fixed onto the conductive pattern, and a lead end portion extending near the periphery of the electronic component, the conductive pattern of the wiring board, and the land portion, In a semiconductor device in which the main parts including the land portion and the lead tip portion are resin-molded while being electrically connected to each other with appropriate wires, the conductive pattern and the lead tip portion of the electronic component wiring board are A semiconductor device characterized in that a ring-shaped loop is formed in the middle of a wire that electrically connects the two.
JP19678887U 1987-12-24 1987-12-24 Pending JPH01100439U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19678887U JPH01100439U (en) 1987-12-24 1987-12-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19678887U JPH01100439U (en) 1987-12-24 1987-12-24

Publications (1)

Publication Number Publication Date
JPH01100439U true JPH01100439U (en) 1989-07-05

Family

ID=31487382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19678887U Pending JPH01100439U (en) 1987-12-24 1987-12-24

Country Status (1)

Country Link
JP (1) JPH01100439U (en)

Similar Documents

Publication Publication Date Title
JPH01100439U (en)
JPH0275742U (en)
JPH0383952U (en)
JPS646038U (en)
JPH0289847U (en)
JPH0173932U (en)
JPH0459939U (en)
JPH038449U (en)
JPH0456349U (en)
JPH01174949U (en)
JPH01162259U (en)
JPH01161328U (en)
JPH0289848U (en)
JPH0365275U (en)
JPH0213728U (en)
JPH0379433U (en)
JPS6350136U (en)
JPS63187330U (en)
JPS61123544U (en)
JPH01129877U (en)
JPS5936244U (en) semiconductor equipment
JPH0263550U (en)
JPS6310568U (en)
JPS63115233U (en)
JPS6146742U (en) Semiconductor device mounting structure