JPH0289848U - - Google Patents
Info
- Publication number
- JPH0289848U JPH0289848U JP17052788U JP17052788U JPH0289848U JP H0289848 U JPH0289848 U JP H0289848U JP 17052788 U JP17052788 U JP 17052788U JP 17052788 U JP17052788 U JP 17052788U JP H0289848 U JPH0289848 U JP H0289848U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor device
- resin material
- base
- exterior resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 4
- 239000008188 pellet Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案に係る半導体装置の要部拡大
図である。第２図及び第３図は樹脂モールドタイ
プのハイブリツドＩＣの一例を示す縦断面図、第
４図は半導体装置の製造途中におけるリードフレ
ームの平面図、第５図はリードフレームの樹脂モ
ールド時の要部縦断面図である。
１……電子部品マウント用ランド、２……リー
ド、２ａ……凹凸、３……配線基板、４……電子
部品、５……ワイヤ、６……外装樹脂材。
FIG. 1 is an enlarged view of the main parts of a semiconductor device according to this invention. 2 and 3 are longitudinal cross-sectional views showing an example of a resin mold type hybrid IC, FIG. 4 is a plan view of a lead frame in the middle of manufacturing a semiconductor device, and FIG. FIG. DESCRIPTION OF SYMBOLS 1...Land for electronic component mounting, 2...Lead, 2a...Irregularities, 3...Wiring board, 4...Electronic component, 5...Wire, 6...Exterior resin material.
Claims (1)
品をマウントし、基板上の周辺部近傍に配置した
複数のリード根元部と上記基板とをワイヤにて電
気的に接続し、上記基板とリード根元部を含む要
部を外装樹脂材にて封止してなる半導体装置にお
いて、 上記リードの外装樹脂材内に封止される根元部
側面に凹凸を形成したことを特徴とする半導体装
置。[Claims for Utility Model Registration] Electronic components including a plurality of semiconductor pellets are mounted on a substrate, and the bases of a plurality of leads arranged near the periphery of the substrate are electrically connected to the substrate using wires. A semiconductor device in which the main parts including the substrate and the base of the leads are sealed with an exterior resin material is characterized in that unevenness is formed on the side surface of the base of the lead sealed in the exterior resin material. semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17052788U JPH0289848U (en) | 1988-12-27 | 1988-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17052788U JPH0289848U (en) | 1988-12-27 | 1988-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289848U true JPH0289848U (en) | 1990-07-17 |
Family
ID=31461556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17052788U Pending JPH0289848U (en) | 1988-12-27 | 1988-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289848U (en) |
-
1988
- 1988-12-27 JP JP17052788U patent/JPH0289848U/ja active Pending