JPH01121957U - - Google Patents
Info
- Publication number
- JPH01121957U JPH01121957U JP1988017218U JP1721888U JPH01121957U JP H01121957 U JPH01121957 U JP H01121957U JP 1988017218 U JP1988017218 U JP 1988017218U JP 1721888 U JP1721888 U JP 1721888U JP H01121957 U JPH01121957 U JP H01121957U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- transparent
- bottom side
- light
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
第１図は本考案に係る半導体装置の実施例を示
す断面図、第２図は従来例を示す断面図、第３図
は第２図の従来例の改良試考例を示す断面図であ
る。 １……基板、２……ＩＣチツプ、３……リード
系、５……フイルム、６……シール材、Ｗ……透
光部。
す断面図、第２図は従来例を示す断面図、第３図
は第２図の従来例の改良試考例を示す断面図であ
る。 １……基板、２……ＩＣチツプ、３……リード
系、５……フイルム、６……シール材、Ｗ……透
光部。
Claims (1)
- ＩＣチツプへの透光を可能とする透光部を有す
る実装構造を備えた半導体装置において、ＩＣチ
ツプの表面に透明性、耐湿性の高い材質からなる
フイルムを被着し、透光窓が開口され下面にリー
ド系が設けられた合成樹脂製の基板の下面側から
ＩＣチツプの表面側を透光窓に対面して接続固定
すると共に、ＩＣチツプの裏面周りをシールした
ことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988017218U JPH01121957U (ja) | 1988-02-10 | 1988-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988017218U JPH01121957U (ja) | 1988-02-10 | 1988-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01121957U true JPH01121957U (ja) | 1989-08-18 |
Family
ID=31230804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988017218U Pending JPH01121957U (ja) | 1988-02-10 | 1988-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01121957U (ja) |
-
1988
- 1988-02-10 JP JP1988017218U patent/JPH01121957U/ja active Pending