JPH01121950U - - Google Patents

Info

Publication number
JPH01121950U
JPH01121950U JP1988017211U JP1721188U JPH01121950U JP H01121950 U JPH01121950 U JP H01121950U JP 1988017211 U JP1988017211 U JP 1988017211U JP 1721188 U JP1721188 U JP 1721188U JP H01121950 U JPH01121950 U JP H01121950U
Authority
JP
Japan
Prior art keywords
transparent
window hole
chip
transparent window
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988017211U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988017211U priority Critical patent/JPH01121950U/ja
Publication of JPH01121950U publication Critical patent/JPH01121950U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Description

【図面の簡単な説明】
第1図は本考案に係る半導体装置の実施例を示
す断面図、第2図は従来例を示す断面図、第3図
は第2図の従来例の改良試考例を示す断面図であ
る。 1……基板、2……ICチツプ、4……カバー
系、41……遮蔽枠、41′……透光窓穴、42
……透光フード、5……シール材料、W……透光
部。

Claims (1)

    【実用新案登録請求の範囲】
  1. ICチツプへの透光を可能とする透光部を有す
    る実装構造を備えた半導体装置において、合成樹
    脂製の基板に載置したICチツプ周りにICチツ
    プの上方を開放する透光窓穴を有する合成樹脂製
    の遮蔽枠を設け、透光窓穴の上部を透光フードで
    閉塞すると共に、透光フードの下部の透光窓穴内
    全体に透明性、耐湿性の高いシール材料を充填し
    たことを特徴とする半導体装置。
JP1988017211U 1988-02-10 1988-02-10 Pending JPH01121950U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988017211U JPH01121950U (ja) 1988-02-10 1988-02-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988017211U JPH01121950U (ja) 1988-02-10 1988-02-10

Publications (1)

Publication Number Publication Date
JPH01121950U true JPH01121950U (ja) 1989-08-18

Family

ID=31230790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988017211U Pending JPH01121950U (ja) 1988-02-10 1988-02-10

Country Status (1)

Country Link
JP (1) JPH01121950U (ja)

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