JPH01123746A - Manufacture of laminated plate - Google Patents
Manufacture of laminated plateInfo
- Publication number
- JPH01123746A JPH01123746A JP62282758A JP28275887A JPH01123746A JP H01123746 A JPH01123746 A JP H01123746A JP 62282758 A JP62282758 A JP 62282758A JP 28275887 A JP28275887 A JP 28275887A JP H01123746 A JPH01123746 A JP H01123746A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- impregnated
- impregnation
- reactive diluent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000005470 impregnation Methods 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000003085 diluting agent Substances 0.000 claims abstract description 11
- 239000011888 foil Substances 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 4
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 abstract description 9
- 239000004744 fabric Substances 0.000 abstract description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- 238000003475 lamination Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 3
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 abstract description 2
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical group C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- -1 for example Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000012209 synthetic fiber Substances 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 241000252233 Cyprinus carpio Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は４子機器、電気機器、コンピューター、通信機
器等に用すられる積層板の製造方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a laminate used for quadruple devices, electrical devices, computers, communication devices, etc.
遊近の積層板は′１子機器等での使用が増大し。 The use of nearby laminates in child devices is increasing.
使用条件も厳しくなり、積層板に対する電気絶縁性、耐
湿性の向上、信頼性の要求が増大してｂる。As usage conditions become more severe, demands for improved electrical insulation, moisture resistance, and reliability for laminates are increasing.
積層板の電気絶縁性、耐湿性は使用する樹脂、基材によ
って左右されるが、信頼性については積層板の基材に対
し如何に樹脂を均一に含浸させるかが問題となって−る
。この為、樹脂ワニスの含浸を１次丈でなく％１次２次
と複数にし１次含浸に低粘度樹脂を用いたりすることが
行なわれてｂる。The electrical insulation and moisture resistance of a laminate depend on the resin and base material used, but the problem with reliability is how uniformly the resin is impregnated into the base material of the laminate. For this reason, the impregnation with resin varnish is not done in the first degree, but in multiple ways, such as %1 and 2, and a low viscosity resin is used for the primary impregnation.
しかし低粘度樹脂を１次含浸に用−でも充分な均一含浸
性を得ることは困難であった。However, even when low viscosity resins are used for primary impregnation, it is difficult to obtain sufficient uniform impregnation.
本発明の目的とするところは、均一含浸性が得られる積
層板の製造方法を提供することにある。An object of the present invention is to provide a method for manufacturing a laminate that provides uniform impregnation.
本発明は反応性希釈剤を１次含浸した後、１次含浸に用
−た反ろ性希釈剤と相溶性のある樹脂でＺａｔ浸して得
た樹脂含浸基材の上面及び又は下面に金４ｗＩを配設し
た槙ｌ一体を積層成形することを特徴とする積層板の製
造方法のため、ａｔ脂ワニスの含浸性を大巾に向上させ
、均一含浸を達成することができたもので、以下本発明
の詳細な説明する。In the present invention, after primary impregnation with a reactive diluent, gold 4wI is applied to the upper and/or lower surfaces of a resin-impregnated base material obtained by impregnating Zat with a resin compatible with the refractory diluent used for the primary impregnation. Because of the manufacturing method of the laminate board, which is characterized by laminating and molding a single piece with a lacquer varnish arranged in it, the impregnating property of the AT fat varnish was greatly improved and uniform impregnation was achieved. The present invention will be described in detail.
本発明に用りる基材としては、ガラス布、ガラスベーパ
ー、ガラス不織布等のガラス系基材に加え紙、合成繊維
布、合成繊維不織布、アスベストペーパー、木綿布等が
用−られるが、好ましくは厚み調整効果の大！＃いガラ
ス布、紙を用することが望ましい０反応性希釈剤として
はフェニルグリリジルエーテル、ブチルグリシジルエー
テル、カーリニラＥ（＊鉛製）、ＧＯＴ （８本化薬層
”）、ＧＡＮ（Ｅ１本化薬１１ ）％Ｐ ＥＤ−ｔｏ
（ｆｆｌ）素Ｍ ）等がある。樹脂としてはエポキシ樹
脂等のように反応性希釈剤を添加できるものであればよ
く、Ｉ！＃に限定するものではな−、金属層としては銅
、アルミニウム、鉄、ステンレス餉、二重ケル、亜鉛、
真鍮等の単ａ％複合箔が用＾られ必要に応じて金属箔の
片面に接着剤層を設けておき、より接着性を向上させる
こともできる。積層成形としては樹脂により無圧乃至ｔ
ｓｏ Ｋ９／ｄ の成形を用す。As the base material used in the present invention, in addition to glass base materials such as glass cloth, glass vapor, and glass nonwoven fabric, paper, synthetic fiber cloth, synthetic fiber nonwoven fabric, asbestos paper, and cotton cloth are preferably used. has a great thickness adjustment effect! It is preferable to use a #0 glass cloth or paper. Examples of reactive diluents include phenyl glycidyl ether, butyl glycidyl ether, Carlinilla E (*made of lead), GOT (8 chemical layers), GAN (1 bottle of E). Kayaku 11)%P ED-to
(ffl)element M ), etc. The resin may be any resin to which a reactive diluent can be added, such as epoxy resin, and I! The metal layer is not limited to #, but the metal layer may include copper, aluminum, iron, stainless steel, double layer, zinc,
A composite foil of AA% such as brass is used, and if necessary, an adhesive layer can be provided on one side of the metal foil to further improve the adhesion. Laminate molding can be done without pressure or t depending on the resin.
So K9/d molding is used.
温度１時間は特に限定しな−０ 以下本発明を実施例にもとづ＾で説明する。Temperature 1 hour is not particularly limited -0 The present invention will be explained below based on Examples.
実施例
厚さ０．２鱈のガラス布にフェニルグリリジルエーテル
をキツス型含浸ロールで含浸量が１０ ｉｌ ｉｋ ％
（以下単に係と記す）になるように１次含浸させた後、
エポキシ樹脂（Ｖエル化学製％）商品名工ピコ−） １
００１） Ｚｏｏ重鮒部（以下単に部と記す）、ジシア
ンジアミド４部、ベンジルジメチルアミン０．２Ｗｈ、
メチルオキシトール１００部からなるエボキＶ樹ｌぽワ
ニスを全体乾燥後重量が５０優になるように２次含浸、
乾燥して得た樹脂含浸基材８枚の上下面に浮さ０．０３
１５ｍの銅箔を夫々配設した積層体を成形圧力４０ψ、
１６５℃で１２０分間積層成形して厚さ１．６ ｍの両
面鋼張積層板を得た。Example: A glass cloth with a thickness of 0.2 mm was impregnated with phenyl glycylydyl ether using a kits type impregnation roll to an amount of 10 il ik%.
(Hereinafter simply referred to as "Kate") After the primary impregnation,
1
001) Zoo heavy carp part (hereinafter simply referred to as part), dicyandiamide 4 parts, benzyldimethylamine 0.2Wh,
Secondary impregnation with Eboki V tree varnish consisting of 100 parts of methyloxytol to a weight of 50% after drying.
The float on the upper and lower surfaces of 8 resin-impregnated base materials obtained by drying was 0.03.
A laminate with 15m of copper foil placed on each was molded at a pressure of 40ψ.
Lamination molding was performed at 165° C. for 120 minutes to obtain a double-sided steel-clad laminate having a thickness of 1.6 m.
比較例
厚さ０．２Ｍのガラス布に実施例と同じエポキシ樹脂フ
エスを直ちに含浸、乾燥して得た樹脂含浸基材を用いた
以外は実施例と同様に処理して厚さ１．６１ａ＋の両面
銅張積層板を得た。Comparative Example A glass cloth with a thickness of 1.61a+ was processed in the same manner as in the example except that a resin-impregnated base material obtained by immediately impregnating a glass cloth with a thickness of 0.2M with the same epoxy resin as in the example and drying it was used. A double-sided copper-clad laminate was obtained.
実施例と比較例の積層板の性能は第・１表で明白なよう
に本発明のものの性能はよく本発明の積層板の製造方法
の優れて−ることを確認した。As is clear from Table 1, the performance of the laminates of Examples and Comparative Examples was good, confirming that the method of manufacturing laminates of the present invention was superior.
第 １ 表Chapter 1 Table
Claims (2)
に用いた反応性希釈剤と相溶性のある樹脂で２次含浸し
て得た樹脂含浸基材の上面及び又は下面に金属箔を配設
した積層体を積層成形することを特徴とする積層板の製
造方法。(1) The upper and/or lower surfaces of a resin-impregnated base obtained by first impregnating the base material with a reactive diluent and then secondly impregnating it with a resin that is compatible with the reactive diluent used in the first impregnation. 1. A method for producing a laminate, comprising laminating and molding a laminate in which metal foil is provided.
許請求の範囲第１項記載の積層板の製造方法。(2) The method for manufacturing a laminate according to claim 1, wherein the resin is an epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62282758A JPH01123746A (en) | 1987-11-09 | 1987-11-09 | Manufacture of laminated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62282758A JPH01123746A (en) | 1987-11-09 | 1987-11-09 | Manufacture of laminated plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01123746A true JPH01123746A (en) | 1989-05-16 |
Family
ID=17656680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62282758A Pending JPH01123746A (en) | 1987-11-09 | 1987-11-09 | Manufacture of laminated plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01123746A (en) |
-
1987
- 1987-11-09 JP JP62282758A patent/JPH01123746A/en active Pending
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