JPH01125557U - - Google Patents

Info

Publication number
JPH01125557U
JPH01125557U JP1988020188U JP2018888U JPH01125557U JP H01125557 U JPH01125557 U JP H01125557U JP 1988020188 U JP1988020188 U JP 1988020188U JP 2018888 U JP2018888 U JP 2018888U JP H01125557 U JPH01125557 U JP H01125557U
Authority
JP
Japan
Prior art keywords
heat dissipation
tungsten
copper
ceramics
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988020188U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988020188U priority Critical patent/JPH01125557U/ja
Publication of JPH01125557U publication Critical patent/JPH01125557U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
JP1988020188U 1988-02-18 1988-02-18 Pending JPH01125557U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988020188U JPH01125557U (cs) 1988-02-18 1988-02-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988020188U JPH01125557U (cs) 1988-02-18 1988-02-18

Publications (1)

Publication Number Publication Date
JPH01125557U true JPH01125557U (cs) 1989-08-28

Family

ID=31523283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988020188U Pending JPH01125557U (cs) 1988-02-18 1988-02-18

Country Status (1)

Country Link
JP (1) JPH01125557U (cs)

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