JPS5897847U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5897847U
JPS5897847U JP1981197997U JP19799781U JPS5897847U JP S5897847 U JPS5897847 U JP S5897847U JP 1981197997 U JP1981197997 U JP 1981197997U JP 19799781 U JP19799781 U JP 19799781U JP S5897847 U JPS5897847 U JP S5897847U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
solder layer
layer applied
semiconductor chips
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981197997U
Other languages
English (en)
Inventor
重兼　寿夫
伸一 伊藤
山岸　始男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1981197997U priority Critical patent/JPS5897847U/ja
Publication of JPS5897847U publication Critical patent/JPS5897847U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の複合化半導体装置における接続方式を示
す側面図、第２図はそれに用いるリード線の側面図、第
３図は本考案の一実施例における接続方式を示す側面図
である。 １・・・銅基板、２．　３．　４・・・半導体チップ、
５゜６・・・はんだ層、９・・・金属片、１０・・・ア
ルミニウム線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一方の面において基板上に固着された複数の半導体チッ
    プの他方の面に被着するろう層が相互に接続されるもの
    において、半導体チップに被着するろう層の上に接続の
    ためのリード線の超音波゛ボンディング可能な金属片が
    ろう付されたことを特徴とする半導体装置。
JP1981197997U 1981-12-24 1981-12-24 半導体装置 Pending JPS5897847U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981197997U JPS5897847U (ja) 1981-12-24 1981-12-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981197997U JPS5897847U (ja) 1981-12-24 1981-12-24 半導体装置

Publications (1)

Publication Number Publication Date
JPS5897847U true JPS5897847U (ja) 1983-07-02

Family

ID=30111199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981197997U Pending JPS5897847U (ja) 1981-12-24 1981-12-24 半導体装置

Country Status (1)

Country Link
JP (1) JPS5897847U (ja)

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