JPH01130554U - - Google Patents

Info

Publication number
JPH01130554U
JPH01130554U JP1988025991U JP2599188U JPH01130554U JP H01130554 U JPH01130554 U JP H01130554U JP 1988025991 U JP1988025991 U JP 1988025991U JP 2599188 U JP2599188 U JP 2599188U JP H01130554 U JPH01130554 U JP H01130554U
Authority
JP
Japan
Prior art keywords
support plate
lead wire
external
lead
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988025991U
Other languages
English (en)
Other versions
JPH0528778Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988025991U priority Critical patent/JPH0528778Y2/ja
Publication of JPH01130554U publication Critical patent/JPH01130554U/ja
Application granted granted Critical
Publication of JPH0528778Y2 publication Critical patent/JPH0528778Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案を応用したパワートランジスタ
の斜視図、第２図は組立段階のリードフレームの
平面図を示す。 １……支持板、２……第一の外部リード、３…
…第二の外部リード、４……パワートランジスタ
チツプ（半導体チツプ）、５……第一のリード細
線、６……第二のリード細線、７……樹脂封止体
（外囲体）、８……端部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 支持板と、該支持板に固着されかつ電気的に接
    続された半導体チツプと、前記支持板とは別体と
    して形成されかつ前記支持板に連結されかつ前記
    支持板と電気的に接続された端部を有する第一の
    外部リードと、該第一の外部リードと前記支持板
    とを電気的に接続する第一のリード細線と、前記
    支持板とは別体として形成され前記支持板に直接
    に連結されない第二の外部リードと、該第二の外
    部リードと前記半導体チツプの前記支持板とは反
    対側の主面とを電気的に接続する第二のリード細
    線と、前記支持板、半導体チツプ、リード細線及
    び外部リードの端部を封止する外囲体とを備えた
    ことを特徴とする半導体装置。
JP1988025991U 1988-03-01 1988-03-01 Expired - Lifetime JPH0528778Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988025991U JPH0528778Y2 (ja) 1988-03-01 1988-03-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988025991U JPH0528778Y2 (ja) 1988-03-01 1988-03-01

Publications (2)

Publication Number Publication Date
JPH01130554U true JPH01130554U (ja) 1989-09-05
JPH0528778Y2 JPH0528778Y2 (ja) 1993-07-23

Family

ID=31247208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988025991U Expired - Lifetime JPH0528778Y2 (ja) 1988-03-01 1988-03-01

Country Status (1)

Country Link
JP (1) JPH0528778Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756531U (ja) * 1980-09-19 1982-04-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756531U (ja) * 1980-09-19 1982-04-02

Also Published As

Publication number Publication date
JPH0528778Y2 (ja) 1993-07-23

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