JPH01137533U - - Google Patents

Info

Publication number
JPH01137533U
JPH01137533U JP1988032938U JP3293888U JPH01137533U JP H01137533 U JPH01137533 U JP H01137533U JP 1988032938 U JP1988032938 U JP 1988032938U JP 3293888 U JP3293888 U JP 3293888U JP H01137533 U JPH01137533 U JP H01137533U
Authority
JP
Japan
Prior art keywords
semiconductor pellet
semiconductor
substrate
see
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988032938U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988032938U priority Critical patent/JPH01137533U/ja
Publication of JPH01137533U publication Critical patent/JPH01137533U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第1図は本考案の実施例を示す側断面図、第2
図及び第3図は本考案装置によつて得られる透視
図、第4図及び第5図は電力用半導体装置の問題
点を説明する要部側断面図を示す。 1……基板、2……半田、4……半導体ペレツ
ト、7,8……X線透視装置、7……撮像カメラ
、8……X線発生源。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半田を介して半導体ペレツトをマウントした基
    板の移動経路を横切つて半導体ペレツトのマウン
    ト領域を透視するX線透視装置を配置したことを
    特徴とする半導体製造装置。
JP1988032938U 1988-03-11 1988-03-11 Pending JPH01137533U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988032938U JPH01137533U (ja) 1988-03-11 1988-03-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988032938U JPH01137533U (ja) 1988-03-11 1988-03-11

Publications (1)

Publication Number Publication Date
JPH01137533U true JPH01137533U (ja) 1989-09-20

Family

ID=31259544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988032938U Pending JPH01137533U (ja) 1988-03-11 1988-03-11

Country Status (1)

Country Link
JP (1) JPH01137533U (ja)

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