JPH01143143U - - Google Patents
Info
- Publication number
- JPH01143143U JPH01143143U JP1988038783U JP3878388U JPH01143143U JP H01143143 U JPH01143143 U JP H01143143U JP 1988038783 U JP1988038783 U JP 1988038783U JP 3878388 U JP3878388 U JP 3878388U JP H01143143 U JPH01143143 U JP H01143143U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- lead
- semiconductor pellet
- semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図及び第２図は本考案の実施例を示し、第
１図は側断面図、第２図は透視斜視図を示す。第
３図乃至第５図は第１図半導体装置に用いられる
放熱板及びリードの製法の一例を示す斜視図、第
６図は放熱板及びリードの変形例を示す斜視図、
第７図は従来の絶縁型半導体装置を示す側断面図
である。 １１…放熱板、１２ａ…放熱板に接続されたリ
ード、１２ｂ，１２ｃ…他のリード、１３…補強
手段（リブ）、１４…半導体ペレツト。
１図は側断面図、第２図は透視斜視図を示す。第
３図乃至第５図は第１図半導体装置に用いられる
放熱板及びリードの製法の一例を示す斜視図、第
６図は放熱板及びリードの変形例を示す斜視図、
第７図は従来の絶縁型半導体装置を示す側断面図
である。 １１…放熱板、１２ａ…放熱板に接続されたリ
ード、１２ｂ，１２ｃ…他のリード、１３…補強
手段（リブ）、１４…半導体ペレツト。
Claims (1)
- 少くとも一本のリードが半導体ペレツトをマウ
ントした放熱板に接続され、他のリードが半導体
ペレツトの近傍に配置されて半導体ペレツト上の
電極に電気的に接続され、放熱板の全面を樹脂外
装した絶縁型半導体装置において、上記放熱板に
接続されたリードの接続部に補強手段を設けたこ
とを特徴とする絶縁型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988038783U JPH01143143U (ja) | 1988-03-23 | 1988-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988038783U JPH01143143U (ja) | 1988-03-23 | 1988-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143143U true JPH01143143U (ja) | 1989-10-02 |
Family
ID=31265321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988038783U Pending JPH01143143U (ja) | 1988-03-23 | 1988-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143143U (ja) |
-
1988
- 1988-03-23 JP JP1988038783U patent/JPH01143143U/ja active Pending