JPH01179452U - - Google Patents
Info
- Publication number
- JPH01179452U JPH01179452U JP1988076525U JP7652588U JPH01179452U JP H01179452 U JPH01179452 U JP H01179452U JP 1988076525 U JP1988076525 U JP 1988076525U JP 7652588 U JP7652588 U JP 7652588U JP H01179452 U JPH01179452 U JP H01179452U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- wiring material
- semiconductor chip
- wiring
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
図はこの考案の一実施例の断面図である。
図において、１は半導体チツプ、２はアイラン
ド、３は配線材、４は電極、５はリード、６はリ
ード先端に設けられた突起部を示す。なお、図中
、同一符号は同一、または相当部分を示す。
ド、３は配線材、４は電極、５はリード、６はリ
ード先端に設けられた突起部を示す。なお、図中
、同一符号は同一、または相当部分を示す。
Claims (1)
- 半導体装置の組立工程における金属細線による
配線工程において、配線材と半導体チツプの接触
を防ぐ為に半導体チツプ表面に対する配線材の高
さを必要量以上に維持することを目的として、リ
ードのパツケージ内部側先端に配線材を支持する
為、リード側ボンデイング部よりリード上面方向
に高さを有する突起部を設けたことを特徴とする
リードフレーム。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988076525U JPH01179452U (ja) | 1988-06-09 | 1988-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988076525U JPH01179452U (ja) | 1988-06-09 | 1988-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01179452U true JPH01179452U (ja) | 1989-12-22 |
Family
ID=31301546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988076525U Pending JPH01179452U (ja) | 1988-06-09 | 1988-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01179452U (ja) |
-
1988
- 1988-06-09 JP JP1988076525U patent/JPH01179452U/ja active Pending