JPH0121629B2 - - Google Patents

Info

Publication number
JPH0121629B2
JPH0121629B2 JP59129333A JP12933384A JPH0121629B2 JP H0121629 B2 JPH0121629 B2 JP H0121629B2 JP 59129333 A JP59129333 A JP 59129333A JP 12933384 A JP12933384 A JP 12933384A JP H0121629 B2 JPH0121629 B2 JP H0121629B2
Authority
JP
Japan
Prior art keywords
small electronic
printed wiring
package
electronic component
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59129333A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6016447A (ja
Inventor
Kanji Ootsuka
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59129333A priority Critical patent/JPS6016447A/ja
Publication of JPS6016447A publication Critical patent/JPS6016447A/ja
Publication of JPH0121629B2 publication Critical patent/JPH0121629B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP59129333A 1984-06-25 1984-06-25 小型電子部品の実装構造 Granted JPS6016447A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59129333A JPS6016447A (ja) 1984-06-25 1984-06-25 小型電子部品の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59129333A JPS6016447A (ja) 1984-06-25 1984-06-25 小型電子部品の実装構造

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP7315576A Division JPS52156559A (en) 1976-06-23 1976-06-23 Small electronic device packaging package

Publications (2)

Publication Number Publication Date
JPS6016447A JPS6016447A (ja) 1985-01-28
JPH0121629B2 true JPH0121629B2 (mo) 1989-04-21

Family

ID=15007009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59129333A Granted JPS6016447A (ja) 1984-06-25 1984-06-25 小型電子部品の実装構造

Country Status (1)

Country Link
JP (1) JPS6016447A (mo)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63158892A (ja) * 1987-12-11 1988-07-01 株式会社日立製作所 小型電子部品の実装構造
JPH01313969A (ja) * 1988-06-13 1989-12-19 Hitachi Ltd 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4857652U (mo) * 1971-11-02 1973-07-23
JPS4888942U (mo) * 1972-01-31 1973-10-26
JPS5529584B2 (mo) * 1972-10-04 1980-08-05
JPS5532022B2 (mo) * 1973-05-07 1980-08-22
JPS50145262U (mo) * 1974-05-18 1975-12-01

Also Published As

Publication number Publication date
JPS6016447A (ja) 1985-01-28

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