JPH01218008A - コンデンサの封口構造 - Google Patents

コンデンサの封口構造

Info

Publication number: JPH01218008A
Authority: JP; Japan
Prior art keywords: casing; sealant; capacitor; outer case; sealing body
Prior art date: 1988-02-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP4368388A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0568087B2 (cs

Inventor

Susumu Ando

進安藤

Ikuo Hagiwara

郁夫萩原

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nippon Chemi Con Corp

Original Assignee

Nippon Chemi Con Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-02-26

Filing date

1988-02-26

Publication date

1989-08-31

1988-02-26 Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp

1988-02-26 Priority to JP4368388A priority Critical patent/JPH01218008A/ja

1989-08-31 Publication of JPH01218008A publication Critical patent/JPH01218008A/ja

1993-09-28 Publication of JPH0568087B2 publication Critical patent/JPH0568087B2/ja

Status Granted legal-status Critical Current

Links

239000003990 capacitor Substances 0.000 title claims abstract description 34
238000007789 sealing Methods 0.000 title claims description 45
239000000565 sealant Substances 0.000 abstract description 9
238000000034 method Methods 0.000 description 9
238000002788 crimping Methods 0.000 description 8
WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
238000005452 bending Methods 0.000 description 4
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
229910052782 aluminium Inorganic materials 0.000 description 3
239000011888 foil Substances 0.000 description 2
238000005476 soldering Methods 0.000 description 2
230000008646 thermal stress Effects 0.000 description 2
239000004593 Epoxy Substances 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
238000004873 anchoring Methods 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
239000003292 glue Substances 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
229920003002 synthetic resin Polymers 0.000 description 1
239000000057 synthetic resin Substances 0.000 description 1
239000002699 waste material Substances 0.000 description 1
238000004804 winding Methods 0.000 description 1

Landscapes

Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

JP4368388A 1988-02-26 1988-02-26 コンデンサの封口構造 Granted JPH01218008A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP4368388A JPH01218008A (ja)	1988-02-26	1988-02-26	コンデンサの封口構造

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP4368388A JPH01218008A (ja)	1988-02-26	1988-02-26	コンデンサの封口構造

Publications (2)

Publication Number	Publication Date
JPH01218008A true JPH01218008A (ja)	1989-08-31
JPH0568087B2 JPH0568087B2 (cs)	1993-09-28

Family

ID=12670639

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP4368388A Granted JPH01218008A (ja)	1988-02-26	1988-02-26	コンデンサの封口構造

Country Status (1)

Country	Link
JP (1)	JPH01218008A (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0644134U (ja) *	1991-07-31	1994-06-10	エルナー株式会社	座付き偏平形電解コンデンサ及びこれに用いる座板材
JP2002299186A (ja) *	2001-03-29	2002-10-11	Nippon Chemicon Corp	コンデンサ及びコンデンサ用外装ケース

1988
- 1988-02-26 JP JP4368388A patent/JPH01218008A/ja active Granted

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH0644134U (ja) *	1991-07-31	1994-06-10	エルナー株式会社	座付き偏平形電解コンデンサ及びこれに用いる座板材
JP2002299186A (ja) *	2001-03-29	2002-10-11	Nippon Chemicon Corp	コンデンサ及びコンデンサ用外装ケース

Also Published As

Publication number	Publication date
JPH0568087B2 (cs)	1993-09-28

Similar Documents

Publication	Publication Date	Title
JPH0568087B2 (cs)	1993-09-28
JP2832719B2 (ja)	1998-12-09	チップ形コンデンサ
JP2894332B2 (ja)	1999-05-24	チップ形コンデンサ
JP2727950B2 (ja)	1998-03-18	チップ形電解コンデンサ
JPH0258209A (ja)	1990-02-27	チップ形コンデンサ
JPH1098148A (ja)	1998-04-14	半導体パッケージ用端子ピン
JP2631122B2 (ja)	1997-07-16	コンデンサ
JPH10106889A (ja)	1998-04-24	チップ型固体電解コンデンサ
JPH03248522A (ja)	1991-11-06	偏平形アルミ電解コンデンサ
JP2691412B2 (ja)	1997-12-17	チップ形コンデンサ
JP2000331870A (ja)	2000-11-30	電子部品
JP2000223363A (ja)	2000-08-11	電子部品およびこれを実装する配線基板
JPH0467332B2 (cs)	1992-10-28
JPH0265207A (ja)	1990-03-05	チップ形コンデンサ
JP2000269082A (ja)	2000-09-29	チップ形コンデンサ
JPH01227413A (ja)	1989-09-11	チップ形コンデンサ
JP2000277395A (ja)	2000-10-06	チップ形コンデンサ
JPH05259008A (ja)	1993-10-08	電子部品
JPH01218007A (ja)	1989-08-31	コンデンサ
JPS61220411A (ja)	1986-09-30	電解コンデンサ
JPH0963893A (ja)	1997-03-07	電気二重層コンデンサ
JPH01253223A (ja)	1989-10-09	チップ形コンデンサおよびその製造方法
JPH0234904A (ja)	1990-02-05	チップ形コンデンサ
JPH01175216A (ja)	1989-07-11	チップ形コンデンサ
JPH0714752A (ja)	1995-01-17	電解コンデンサ

Legal Events

Date	Code	Title	Description
2006-01-27	S531	Written request for registration of change of domicile	Free format text: JAPANESE INTERMEDIATE CODE: R313531
2006-02-03	R350	Written notification of registration of transfer	Free format text: JAPANESE INTERMEDIATE CODE: R350
2007-09-28	LAPS	Cancellation because of no payment of annual fees