JPH0131689B2 - - Google Patents

Info

Publication number
JPH0131689B2
JPH0131689B2 JP56150942A JP15094281A JPH0131689B2 JP H0131689 B2 JPH0131689 B2 JP H0131689B2 JP 56150942 A JP56150942 A JP 56150942A JP 15094281 A JP15094281 A JP 15094281A JP H0131689 B2 JPH0131689 B2 JP H0131689B2
Authority
JP
Japan
Prior art keywords
aluminum
auxiliary body
wiring conductor
wire
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56150942A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5852836A (ja
Inventor
Kimio Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP56150942A priority Critical patent/JPS5852836A/ja
Publication of JPS5852836A publication Critical patent/JPS5852836A/ja
Publication of JPH0131689B2 publication Critical patent/JPH0131689B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP56150942A 1981-09-24 1981-09-24 複合集積回路 Granted JPS5852836A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56150942A JPS5852836A (ja) 1981-09-24 1981-09-24 複合集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56150942A JPS5852836A (ja) 1981-09-24 1981-09-24 複合集積回路

Publications (2)

Publication Number Publication Date
JPS5852836A JPS5852836A (ja) 1983-03-29
JPH0131689B2 true JPH0131689B2 (fr) 1989-06-27

Family

ID=15507779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56150942A Granted JPS5852836A (ja) 1981-09-24 1981-09-24 複合集積回路

Country Status (1)

Country Link
JP (1) JPS5852836A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58151039A (ja) * 1982-03-04 1983-09-08 Denki Kagaku Kogyo Kk 混成集積回路基板
JPS6045089A (ja) * 1983-08-22 1985-03-11 松下電器産業株式会社 回路配線用基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5317747A (en) * 1976-08-02 1978-02-18 Sasaki Mooru Kk Natural light inlet tube
JPS5396667A (en) * 1977-02-04 1978-08-24 Hitachi Ltd Wire bonding method
JPS5396668A (en) * 1977-02-04 1978-08-24 Hitachi Ltd Wire bonding method and auxiliary plate for the same
JPS55158654A (en) * 1979-05-30 1980-12-10 Aichi Steel Works Ltd Manufacture of heat sink in aluminum
JPS5610941A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Semiconductor device
JPS5623763A (en) * 1979-08-04 1981-03-06 Aichi Steel Works Ltd Aluminum heat sink and manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS5852836A (ja) 1983-03-29

Similar Documents

Publication Publication Date Title
JPH10154774A (ja) 半導体モジュール
JPH08148839A (ja) 混成集積回路装置
JP2735912B2 (ja) インバータ装置
JPH06283639A (ja) 混成集積回路
JPH0131689B2 (fr)
JPH104167A (ja) 半導体装置
JPH08148647A (ja) 半導体装置
JP2735920B2 (ja) インバータ装置
JPS63284831A (ja) 混成集積回路の製造方法
JPS6159660B2 (fr)
JPH05129515A (ja) 半導体装置
JP3048707B2 (ja) 混成集積回路
JPH08125092A (ja) 半導体装置およびその製造方法
JPS6315430A (ja) 半導体装置の製造方法
JP2867737B2 (ja) 混成集積回路
JP2830221B2 (ja) ハイブリッド集積回路のマウント構造
JP3279846B2 (ja) 半導体装置の製造方法
JP2744097B2 (ja) 混成集積回路
JP2002184907A (ja) 電力用半導体装置
JPH06260538A (ja) 半導体装置
JP2619155B2 (ja) 混成集積回路装置
JPH0225251Y2 (fr)
JP2000138340A (ja) ハイブリッドモジュール
JP2661230B2 (ja) 混成集積回路装置
JPH0351992Y2 (fr)