JPH01319972A - Resin sealed type semiconductor device - Google Patents
Resin sealed type semiconductor deviceInfo
- Publication number
- JPH01319972A JPH01319972A JP63154416A JP15441688A JPH01319972A JP H01319972 A JPH01319972 A JP H01319972A JP 63154416 A JP63154416 A JP 63154416A JP 15441688 A JP15441688 A JP 15441688A JP H01319972 A JPH01319972 A JP H01319972A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- island
- lead
- resin
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂封止型半導体装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a resin-sealed semiconductor device.
従来の樹脂封止型半導体装置は、第２図に示すように、
素子載置部を有する矩形状のアイランド］と、アイラン
ド１の相対する辺に接続してアイランド１を保持する吊
リード２と、アイランド１の周辺に配列して設けた内部
リード３と、内部リード３に接続する外部リード４と、
外部リード４を互に接続するタイバー５とを有してリー
ドフレーム７を措成し、前記素子載置部に半導体チップ
８を搭載して半導体チップ８と内部リード３をホンディ
ング線９により電気的に接続する。次に、アイランド１
を含む樹脂封止領域１０を樹脂体により封止し、外部リ
ード４からタイバー５及びリードフレーム７を切離して
吊リード２のスζ又朽１脂休をリードフレーム７に保持
し、外部リード４Ｇ：：電力又は信号を供給して各種の
特性試験を実施干る。The conventional resin-sealed semiconductor device, as shown in FIG.
a rectangular island having an element mounting section], hanging leads 2 connected to opposite sides of the island 1 to hold the island 1, internal leads 3 arranged around the island 1, and internal leads 3, an external lead 4 connected to
A lead frame 7 is constructed having tie bars 5 that connect the external leads 4 to each other, a semiconductor chip 8 is mounted on the element mounting portion, and the semiconductor chip 8 and the internal leads 3 are electrically connected by a bonding wire 9. Connect to. Next, Island 1
The resin sealing area 10 including :: Performs various characteristic tests by supplying power or signals.
上述した従来の樹脂封止型半導体装置は、吊リードがア
イランドの相対する辺に設けて烏ろ、１゛ごめ、アイラ
ンドの吊リードが存在する辺の近ｉ″ｉｊには内部リー
ドを配置することができず内部り−・ドの配置数が制限
されている。これを改善しようどして、吊リードを内部
リードと平行に股、け４・と、内部リード数は増加でき
るものの、特性試験を行うために吊リードのみを残して
内部リードに接続された外部リードをリードフレームよ
り切離し、特性試験終了後に吊リードに接続された外部
リードを切断すると、内部リードに接続された外部リー
ドと吊リードに接続された外部リードとの間に段差が付
いて外部リードの平坦度が悪くなるという問題点があっ
た。In the conventional resin-sealed semiconductor device described above, the suspension leads are provided on opposite sides of the island, and the internal leads are placed near the side of the island where the suspension leads are located. This limits the number of internal leads.In an attempt to improve this, the number of internal leads can be increased by crossing the hanging leads parallel to the internal leads. In order to perform a characteristic test, the external lead connected to the internal lead is separated from the lead frame, leaving only the suspended lead. When the external lead connected to the suspended lead is cut after the characteristic test is completed, the external lead connected to the internal lead is disconnected. There is a problem in that there is a step between the cable and the external lead connected to the suspension lead, which deteriorates the flatness of the external lead.
本発明の樹脂封止型半導体装置は、素子載置部を有する
アイランドと、前記アイランドの四隔に接続して設けた
吊リードと、前記アイランドの周辺に配列して設けた内
部リードと、前記内部リードの外側に配置し且つ先端が
樹脂封止領域内に存在するように設けた保持リードを有
している。The resin-sealed semiconductor device of the present invention includes an island having an element mounting portion, hanging leads connected to the four corners of the island, internal leads arranged around the island, and It has a holding lead that is placed outside the internal lead and whose tip is located within the resin-sealed area.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を説明するためのリードフレ
ームの平面図である。FIG. 1 is a plan view of a lead frame for explaining one embodiment of the present invention.
図に示すように、素子ａ！載置部有する矩形又は正方形
のアイランド１と、アイランド１の四隔に接続してアイ
ランド１を保持する吊リード２と、アイランド１の周辺
に配列して設けた内部リード３と、吊リード２と内部リ
ード３のそれぞれに接続する外部リード４と、外部リー
ド４を互いに接続するタイバー５と、アイランド１の相
対する辺の内部リード３の外側に配置し且つ先端が樹脂
封止領域１０内に存在するように設けた保持リード６と
を有してリードフレーム７を構成し、前記素子載置部に
半導体チップ８を搭載して半導体チップ８と内部リード
３をボンディング線９により電気的に接続する０次に、
アイランド１を含む前記樹脂封止領域１０内を樹脂体に
より封止し、外部リード４に接続しているタイバー５及
びリードフレーム７を切離して保持リード６のみで樹脂
封止体をリードフレームに保存し、特性試験を行う。As shown in the figure, element a! A rectangular or square island 1 having a mounting portion, hanging leads 2 connected to four quarters of the island 1 to hold the island 1, internal leads 3 arranged around the island 1, and hanging leads 2. External leads 4 that connect to each of the internal leads 3, tie bars 5 that connect the external leads 4 to each other, and tie bars 5 that are arranged outside the internal leads 3 on opposite sides of the island 1 and have their tips within the resin sealing area 10. A lead frame 7 is configured with a holding lead 6 provided so as to be held, a semiconductor chip 8 is mounted on the element mounting portion, and the semiconductor chip 8 and the internal leads 3 are electrically connected by bonding wires 9. 0th order,
The interior of the resin-sealed region 10 including the island 1 is sealed with a resin body, the tie bar 5 and lead frame 7 connected to the external lead 4 are separated, and the resin-sealed body is stored in the lead frame using only the holding leads 6. and conduct characteristic tests.
以上説明したように本発明は、アイランドの周辺に配列
して設けた内部リードの外側に配置し且つ先端が樹脂封
止領域内に存在するように設けた保持リードにより、保
持リードとアイランドの間にも内部リードを配置して内
部リード数を増加させることができる効果を有し、吊リ
ードに接続された外部リードと内部リードに接続された
外部リードを同時にリードフレームより切離し、保持リ
ードのみで樹脂体を保持させることにより、外部リード
の平坦度を改善することができるという効果がある。As explained above, the present invention provides a structure between the holding leads and the island by using holding leads that are arranged outside of the internal leads arranged around the island and whose tips are located within the resin-sealed area. It also has the effect of increasing the number of internal leads by arranging the internal leads, and the external leads connected to the hanging leads and the external leads connected to the internal leads can be simultaneously disconnected from the lead frame, allowing only the holding leads to be used. By holding the resin body, the flatness of the external lead can be improved.
第１図は、本発明の一実施例を説明するためのリードフ
レームの平面図、第２図は、従来の半導体装置の一例を
説明するためのリードフレームの平面図である。
１・・・アイランド、２・・・吊リード、３・・・内部
リード、４・・・外部リード、５・・・タイバー、６・
・・保持リード、７・・・リードフレーム、８・・・半
導体チップ、醪ノ
見 １ 図
男２ 図FIG. 1 is a plan view of a lead frame for explaining an embodiment of the present invention, and FIG. 2 is a plan view of a lead frame for explaining an example of a conventional semiconductor device. 1...Island, 2...Hanging lead, 3...Internal lead, 4...External lead, 5...Tie bar, 6...
...Holding lead, 7...Lead frame, 8...Semiconductor chip, Morinomi 1 Figure 2 Figure
Claims (1)
四隔に接続して設けた吊リードと、前記アイランドの周
辺に配列して設けた内部リードと、前記内部リードの外
側に配置し且つ先端が樹脂封止領域内に存在するように
設けた保持リードを有することを特徴とする樹脂封止型
半導体装置。An island having an element mounting part, hanging leads connected to the four sides of the island, internal leads arranged around the island, and tips arranged outside the internal leads having resin tips. A resin-sealed semiconductor device characterized by having a holding lead located within a sealing region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63154416A JPH01319972A (en) | 1988-06-21 | 1988-06-21 | Resin sealed type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63154416A JPH01319972A (en) | 1988-06-21 | 1988-06-21 | Resin sealed type semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01319972A true JPH01319972A (en) | 1989-12-26 |
Family
ID=15583682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63154416A Pending JPH01319972A (en) | 1988-06-21 | 1988-06-21 | Resin sealed type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01319972A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022146269A (en) * | 2021-03-22 | 2022-10-05 | ローム株式会社 | Semiconductor device |
-
1988
- 1988-06-21 JP JP63154416A patent/JPH01319972A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022146269A (en) * | 2021-03-22 | 2022-10-05 | ローム株式会社 | Semiconductor device |
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