JPH0149034B2 - - Google Patents

Info

Publication number: JPH0149034B2
Authority: JP; Japan
Prior art keywords: plating; circuit board; etching; circuit; copper
Prior art date: 1983-12-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP23888083A

Other languages

English (en)

Japanese (ja)

Other versions

JPS60130889A (ja

Inventor

Setsuo Suzuki

Yozo Shioda

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Sumitomo Bakelite Co Ltd

Original Assignee

Sumitomo Bakelite Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-12-20

Filing date

1983-12-20

Publication date

1989-10-23

1983-12-20 Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd

1983-12-20 Priority to JP23888083A priority Critical patent/JPS60130889A/ja

1985-07-12 Publication of JPS60130889A publication Critical patent/JPS60130889A/ja

1989-10-23 Publication of JPH0149034B2 publication Critical patent/JPH0149034B2/ja

Status Granted legal-status Critical Current

Links

239000000178 monomer Substances 0.000 claims description 20
238000000034 method Methods 0.000 claims description 16
238000007747 plating Methods 0.000 claims description 16
238000007772 electroless plating Methods 0.000 claims description 11
238000005530 etching Methods 0.000 claims description 9
238000004519 manufacturing process Methods 0.000 claims description 7
239000005062 Polybutadiene Substances 0.000 claims description 6
229920002857 polybutadiene Polymers 0.000 claims description 6
238000007788 roughening Methods 0.000 claims description 6
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 5
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 5
239000003999 initiator Substances 0.000 claims description 4
239000003504 photosensitizing agent Substances 0.000 claims description 4
230000000694 effects Effects 0.000 claims description 3
238000009713 electroplating Methods 0.000 claims description 3
NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
238000010438 heat treatment Methods 0.000 claims 1
239000010410 layer Substances 0.000 description 22
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
229910000679 solder Inorganic materials 0.000 description 9
150000001252 acrylic acid derivatives Chemical class 0.000 description 6
239000011248 coating agent Substances 0.000 description 6
238000000576 coating method Methods 0.000 description 6
229910052802 copper Inorganic materials 0.000 description 6
239000010949 copper Substances 0.000 description 6
239000011889 copper foil Substances 0.000 description 5
238000001723 curing Methods 0.000 description 5
229920005989 resin Polymers 0.000 description 5
239000011347 resin Substances 0.000 description 5
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
230000000052 comparative effect Effects 0.000 description 4
229910052751 metal Inorganic materials 0.000 description 4
239000002184 metal Substances 0.000 description 4
238000007719 peel strength test Methods 0.000 description 4
239000003505 polymerization initiator Substances 0.000 description 4
238000012360 testing method Methods 0.000 description 4
238000012719 thermal polymerization Methods 0.000 description 4
239000004593 Epoxy Substances 0.000 description 3
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
229910052709 silver Inorganic materials 0.000 description 3
239000004332 silver Substances 0.000 description 3
238000005476 soldering Methods 0.000 description 3
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
229920000180 alkyd Polymers 0.000 description 2
JZULKTSSLJNBQJ-UHFFFAOYSA-N chromium;sulfuric acid Chemical compound [Cr].OS(O)(=O)=O JZULKTSSLJNBQJ-UHFFFAOYSA-N 0.000 description 2
238000004132 cross linking Methods 0.000 description 2
125000004386 diacrylate group Chemical group 0.000 description 2
238000001035 drying Methods 0.000 description 2
238000010292 electrical insulation Methods 0.000 description 2
238000009413 insulation Methods 0.000 description 2
239000005340 laminated glass Substances 0.000 description 2
239000000463 material Substances 0.000 description 2
QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
229910052753 mercury Inorganic materials 0.000 description 2
229920001721 polyimide Polymers 0.000 description 2
238000007650 screen-printing Methods 0.000 description 2
150000003457 sulfones Chemical class 0.000 description 2
239000013008 thixotropic agent Substances 0.000 description 2
229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 1
KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical class C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
SEILKFZTLVMHRR-UHFFFAOYSA-N 2-phosphonooxyethyl 2-methylprop-2-enoate Chemical group CC(=C)C(=O)OCCOP(O)(O)=O SEILKFZTLVMHRR-UHFFFAOYSA-N 0.000 description 1
UZDMJPAQQFSMMV-UHFFFAOYSA-N 4-oxo-4-(2-prop-2-enoyloxyethoxy)butanoic acid Chemical compound OC(=O)CCC(=O)OCCOC(=O)C=C UZDMJPAQQFSMMV-UHFFFAOYSA-N 0.000 description 1
FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
239000005751 Copper oxide Substances 0.000 description 1
WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical group OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
239000002202 Polyethylene glycol Substances 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
239000000654 additive Substances 0.000 description 1
125000003368 amide group Chemical group 0.000 description 1
239000002518 antifoaming agent Substances 0.000 description 1
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
239000012965 benzophenone Substances 0.000 description 1
UPIWXMRIPODGLE-UHFFFAOYSA-N butyl benzenecarboperoxoate Chemical compound CCCCOOC(=O)C1=CC=CC=C1 UPIWXMRIPODGLE-UHFFFAOYSA-N 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
229910000431 copper oxide Inorganic materials 0.000 description 1
239000007822 coupling agent Substances 0.000 description 1
230000007547 defect Effects 0.000 description 1
238000011161 development Methods 0.000 description 1
239000003085 diluting agent Substances 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
239000000945 filler Substances 0.000 description 1
238000007429 general method Methods 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000000265 homogenisation Methods 0.000 description 1
230000002209 hydrophobic effect Effects 0.000 description 1
230000005764 inhibitory process Effects 0.000 description 1
239000011229 interlayer Substances 0.000 description 1
230000001678 irradiating effect Effects 0.000 description 1
150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
239000002923 metal particle Substances 0.000 description 1
238000013508 migration Methods 0.000 description 1
230000005012 migration Effects 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
125000000896 monocarboxylic acid group Chemical group 0.000 description 1
229920002601 oligoester Polymers 0.000 description 1
229910052760 oxygen Inorganic materials 0.000 description 1
239000001301 oxygen Substances 0.000 description 1
229910052698 phosphorus Inorganic materials 0.000 description 1
239000011574 phosphorus Substances 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
229920006267 polyester film Polymers 0.000 description 1
229920001223 polyethylene glycol Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
238000012545 processing Methods 0.000 description 1
239000000758 substrate Substances 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
238000001029 thermal curing Methods 0.000 description 1
229920001187 thermosetting polymer Polymers 0.000 description 1
229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
238000005406 washing Methods 0.000 description 1

Landscapes

Laminated Bodies (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)

JP23888083A 1983-12-20 1983-12-20 多層積層板の製造方法 Granted JPS60130889A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP23888083A JPS60130889A (ja)	1983-12-20	1983-12-20	多層積層板の製造方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP23888083A JPS60130889A (ja)	1983-12-20	1983-12-20	多層積層板の製造方法

Publications (2)

Publication Number	Publication Date
JPS60130889A JPS60130889A (ja)	1985-07-12
JPH0149034B2 true JPH0149034B2 (de)	1989-10-23

Family

ID=17036634

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP23888083A Granted JPS60130889A (ja)	1983-12-20	1983-12-20	多層積層板の製造方法

Country Status (1)

Country	Link
JP (1)	JPS60130889A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH09214140A (ja) *	1995-11-29	1997-08-15	Toppan Printing Co Ltd	多層プリント配線板及びその製造方法
JP2010144356A (ja) *	2008-12-17	2010-07-01	Sekisui Jushi Co Ltd	道路用標示体

1983
- 1983-12-20 JP JP23888083A patent/JPS60130889A/ja active Granted

Also Published As

Publication number	Publication date
JPS60130889A (ja)	1985-07-12

Publication	Publication Date	Title
US4268614A (en)	1981-05-19	Method of making printed circuit board
US4888450A (en)	1989-12-19	Circuit board fabrication leading to increased capacity
EP0096701B1 (de)	1989-08-30	Zu vergrössertem aufnahmevermögen führende leiterplattenherstellung
CN1113585C (zh)	2003-07-02	印刷电路板及其制造方法
JPH0149034B2 (de)	1989-10-23
JPH08316642A (ja)	1996-11-29	インタースティシャルバイアホールを有する多層プリント配線板およびその製造方法
JPH06148877A (ja)	1994-05-27	フォトビア形成用感光性エレメント及び多層配線板の製造法
CN1255489C (zh)	2006-05-10	积层电路板用液态感光绝缘油墨
JPH10275983A (ja)	1998-10-13	多層プリント配線板
EP0691802B1 (de)	2002-08-28	Verfahren und Zusammensetzung zur Herstellung einer mehrschichtigen Leiterplatte
JPH09186462A (ja)	1997-07-15	多層フレキシブルプリント配線板の製造方法
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JPH06260733A (ja)	1994-09-16	銅張絶縁シート用樹脂組成物
JP2000082878A (ja)	2000-03-21	ビルドアップ多層プリント配線板の製造方法
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JPH05259649A (ja)	1993-10-08	ブラインドホールを有する多層プリント配線板の製造方法
JPH1036682A (ja)	1998-02-10	硬化性樹脂組成物およびそれを用いた多層プリント配線板の製造方法ならびにその方法でえられた多層プリント配線板
JP4051587B2 (ja)	2008-02-27	熱又は光により硬化可能な樹脂組成物を用いた多層配線板の製造方法
JPH06260760A (ja)	1994-09-16	ビルドアップ多層プリント回路板の製造方法
JPH07131182A (ja)	1995-05-19	プリント回路板の製造方法
JPH0766560A (ja)	1995-03-10	ブラインドホールを有する多層プリント配線板の製造方法
JP4126735B2 (ja)	2008-07-30	特定の酸化防止剤を含む絶縁樹脂を用いた多層配線板の製造方法