JPH0155577B2 - - Google Patents

Info

Publication number
JPH0155577B2
JPH0155577B2 JP58162155A JP16215583A JPH0155577B2 JP H0155577 B2 JPH0155577 B2 JP H0155577B2 JP 58162155 A JP58162155 A JP 58162155A JP 16215583 A JP16215583 A JP 16215583A JP H0155577 B2 JPH0155577 B2 JP H0155577B2
Authority
JP
Japan
Prior art keywords
guide ring
semiconductor element
gate
annular portion
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58162155A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6053057A (ja
Inventor
Takeshi Ito
Futoshi Tokuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58162155A priority Critical patent/JPS6053057A/ja
Publication of JPS6053057A publication Critical patent/JPS6053057A/ja
Publication of JPH0155577B2 publication Critical patent/JPH0155577B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings

Landscapes

  • Thyristors (AREA)
  • Die Bonding (AREA)
JP58162155A 1983-09-02 1983-09-02 半導体装置 Granted JPS6053057A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58162155A JPS6053057A (ja) 1983-09-02 1983-09-02 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58162155A JPS6053057A (ja) 1983-09-02 1983-09-02 半導体装置

Publications (2)

Publication Number Publication Date
JPS6053057A JPS6053057A (ja) 1985-03-26
JPH0155577B2 true JPH0155577B2 (cs) 1989-11-27

Family

ID=15749076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58162155A Granted JPS6053057A (ja) 1983-09-02 1983-09-02 半導体装置

Country Status (1)

Country Link
JP (1) JPS6053057A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56144413A (en) * 1980-04-14 1981-11-10 Shin Etsu Chem Co Ltd Convering method for frame of spectacles with tubular molding made of silicone rubber
JP4125908B2 (ja) 2002-03-28 2008-07-30 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPS6053057A (ja) 1985-03-26

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