JPH0192134U - - Google Patents

Info

Publication number
JPH0192134U
JPH0192134U JP1987186446U JP18644687U JPH0192134U JP H0192134 U JPH0192134 U JP H0192134U JP 1987186446 U JP1987186446 U JP 1987186446U JP 18644687 U JP18644687 U JP 18644687U JP H0192134 U JPH0192134 U JP H0192134U
Authority
JP
Japan
Prior art keywords
bonding
semiconductor
semiconductor device
bump
semiconductor chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987186446U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987186446U priority Critical patent/JPH0192134U/ja
Publication of JPH0192134U publication Critical patent/JPH0192134U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の半導体装置の一部破断斜視図
、第２図は従来の半導体チツプの組立状態を示す
一部破断斜視図、第３図は従来の他の半導体チツ
プの組立状態を示す一部破断斜視図である。 ２１……第１の半導体チツプ、２２……第２の
半導体チツプ、２３……接着剤層、２４……バン
プ、２５……ボンデイングパツド、２６，２７…
…リード、２８……金属ワイヤ、２９……パツケ
ージ。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 同一パツケージ内に互いに裏面を接着した
    状態で複数の半導体チツプをマウントするように
    したことを特徴とする半導体装置。 (2) 前記裏面を接する一方の半導体チツプをバ
    ンプ構造となし、該バンプによるフエイスボンデ
    イングを行い、他方の半導体チツプにボンデイン
    グパツドを設け、ワイヤによるボンデイングを行
    うようにしたことを特徴とする実用新案登録請求
    の範囲第１項記載の半導体装置。
JP1987186446U 1987-12-09 1987-12-09 Pending JPH0192134U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987186446U JPH0192134U (ja) 1987-12-09 1987-12-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987186446U JPH0192134U (ja) 1987-12-09 1987-12-09

Publications (1)

Publication Number Publication Date
JPH0192134U true JPH0192134U (ja) 1989-06-16

Family

ID=31477674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987186446U Pending JPH0192134U (ja) 1987-12-09 1987-12-09

Country Status (1)

Country Link
JP (1) JPH0192134U (ja)

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