JPH0211328U - - Google Patents
Info
- Publication number
- JPH0211328U JPH0211328U JP8969588U JP8969588U JPH0211328U JP H0211328 U JPH0211328 U JP H0211328U JP 8969588 U JP8969588 U JP 8969588U JP 8969588 U JP8969588 U JP 8969588U JP H0211328 U JPH0211328 U JP H0211328U
- Authority
- JP
- Japan
- Prior art keywords
- island
- wiring pattern
- chip
- bonding pad
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の正面図であり、第
２図は第１図のＡ−Ａ′縦断面図である。
１……リード、２……Ｓｉ基板、３……アイラ
ンド（ポリイミド、ガラエポ）、４……アイラン
ド上のパターン、５……Ｓｉ基板のボンデイング
パツド部に接続するためのアイランド上のパター
ンのとつ起。
FIG. 1 is a front view of an embodiment of the present invention, and FIG. 2 is a longitudinal cross-sectional view taken along line A-A' in FIG. 1... Lead, 2... Si substrate, 3... Island (polyimide, glass epoxy), 4... Pattern on the island, 5... Pattern on the island for connection to the bonding pad part of the Si substrate. Triggering.
Claims (1)
配線パターン上に半導体チツプのボンデイングパ
ツド部と接続するために突起を設け、前記チツプ
を逆方向にアイランドに熱圧着していることを特
徴とする半導体装置。 A semiconductor device characterized in that a wiring pattern is formed on the island, a projection is provided on the wiring pattern for connection to a bonding pad portion of a semiconductor chip, and the chip is bonded to the island by thermocompression in the opposite direction. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8969588U JPH0211328U (en) | 1988-07-05 | 1988-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8969588U JPH0211328U (en) | 1988-07-05 | 1988-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211328U true JPH0211328U (en) | 1990-01-24 |
Family
ID=31314240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8969588U Pending JPH0211328U (en) | 1988-07-05 | 1988-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211328U (en) |
-
1988
- 1988-07-05 JP JP8969588U patent/JPH0211328U/ja active Pending