JPH02136062U - - Google Patents

Info

Publication number
JPH02136062U
JPH02136062U JP4597089U JP4597089U JPH02136062U JP H02136062 U JPH02136062 U JP H02136062U JP 4597089 U JP4597089 U JP 4597089U JP 4597089 U JP4597089 U JP 4597089U JP H02136062 U JPH02136062 U JP H02136062U
Authority
JP
Japan
Prior art keywords
treated
auxiliary electrode
plating
electrode
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4597089U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4597089U priority Critical patent/JPH02136062U/ja
Publication of JPH02136062U publication Critical patent/JPH02136062U/ja
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Description

【図面の簡単な説明】
第１図は、この考案に従う補助電極を組み込ん
だ電気めつき装置の模式図、第２図は、従来の代
表的電気めつき装置の模式図、第３図は、従来法
に従い大表面積の被めつき板に電気めつきを施し
たときの被めつき面におけるめつき付着状況を示
した図、第４図は、電極面板を被処理面に対し凸
状に湾曲させたときのめつき金属イオンの流れを
示した図、第５図ａ，ｂは、この発明に伴う補助
電極の平面図および正面図、第６図は、ロツド６
と通電棒７の接合状態を示した図、第７図ａ，ｂ
は、実施例で用いた電気めつき装置の平面図およ
び正面図、第８図ａ，ｂは、この考案に従う補助
電極を組み込んだ電気めつき装置および従来の電
気めつき装置を用いてめつき処理を行つたときの
めつき面全体にわたるめつき付着状況を比較して
示した図である。 １…被めつき材、１−１…プリント配線基板、
２…陽極、２−１…バスケツトケース、２−２…
含りん銅、３…通電バー、４…補助電極、４−１
…電極面板、５…調節棒、６…ロツド、７…通電
棒、８…締め付け金具。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 被処理面積が広大または長大な被めつき材の
    電気めつき処理において、被処理面と電極との間
    にてめつき付着量が少ない被処理領域に対向する
    配置として該領域に対するめつき電流密度の増加
    を促し、かつ上下移動、左右移動および前進後退
    移動が自在に配設された補助電極。 ２ 電極面板が、被処理面に対し凸型の曲面形成
    が自在である請求項１記載の補助電極。
JP4597089U 1989-04-19 1989-04-19 Pending JPH02136062U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4597089U JPH02136062U (ja) 1989-04-19 1989-04-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4597089U JPH02136062U (ja) 1989-04-19 1989-04-19

Publications (1)

Publication Number Publication Date
JPH02136062U true JPH02136062U (ja) 1990-11-13

Family

ID=31560629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4597089U Pending JPH02136062U (ja) 1989-04-19 1989-04-19

Country Status (1)

Country Link
JP (1) JPH02136062U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014111831A (ja) * 2012-11-27 2014-06-19 Lam Research Corporation 電気めっき中の動的な電流分布制御のための方法および装置
US10017869B2 (en) 2008-11-07 2018-07-10 Novellus Systems, Inc. Electroplating apparatus for tailored uniformity profile

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235029U (ja) * 1985-08-20 1987-03-02
JPH0199284A (ja) * 1987-10-12 1989-04-18 Fujitsu Ltd 電解メッキ装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6235029U (ja) * 1985-08-20 1987-03-02
JPH0199284A (ja) * 1987-10-12 1989-04-18 Fujitsu Ltd 電解メッキ装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10017869B2 (en) 2008-11-07 2018-07-10 Novellus Systems, Inc. Electroplating apparatus for tailored uniformity profile
US10920335B2 (en) 2008-11-07 2021-02-16 Novellus Systems, Inc. Electroplating apparatus for tailored uniformity profile
US11549192B2 (en) 2008-11-07 2023-01-10 Novellus Systems, Inc. Electroplating apparatus for tailored uniformity profile
JP2014111831A (ja) * 2012-11-27 2014-06-19 Lam Research Corporation 電気めっき中の動的な電流分布制御のための方法および装置
US9909228B2 (en) 2012-11-27 2018-03-06 Lam Research Corporation Method and apparatus for dynamic current distribution control during electroplating

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