JPH0221140B2 - - Google Patents
Info
- Publication number
- JPH0221140B2 JPH0221140B2 JP56174744A JP17474481A JPH0221140B2 JP H0221140 B2 JPH0221140 B2 JP H0221140B2 JP 56174744 A JP56174744 A JP 56174744A JP 17474481 A JP17474481 A JP 17474481A JP H0221140 B2 JPH0221140 B2 JP H0221140B2
- Authority
- JP
- Japan
- Prior art keywords
- cover
- cover body
- brazing material
- sealing
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
Landscapes
- Casings For Electric Apparatus (AREA)
Description
【発明の詳細な説明】
本発明は半導体素子などのIC部品のパツケー
ジに使用されるシール用カバー及びその成形方法
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a sealing cover used for a package of IC parts such as a semiconductor element, and a method for molding the same.
従来、此種シール用カバーはカバー本体のシー
ル面にリング状のろう材を重ね合わせ、あるいは
さらにろう材を予め固定した状態でパツケージ上
に載せて加熱融着し、パツケージを気密封止する
ものである（実開昭48−55763号、特開昭55−
46558号、特公昭54−32312号）。 Conventionally, this type of sealing cover has been made by overlapping a ring-shaped brazing material on the sealing surface of the cover body, or by placing the brazing material pre-fixed on top of the package cage and heat-sealing it to airtightly seal the package cage. It is
No. 46558, Special Publication No. 54-32312).
しかるに、上記従来カバーに接合又は固定する
ろう材は単純な平板リング状であるために、該ろ
う材が溶融したときにカバー本体の外縁全周にわ
たつて十分に行きわたらず、その接着強度が低下
して十分なシール性を得られない場合があつた。 However, since the brazing material that is conventionally joined or fixed to the cover is in the form of a simple flat ring, when the brazing material melts, it does not fully spread around the entire outer edge of the cover body, and its adhesive strength is poor. In some cases, the sealing performance deteriorated and sufficient sealing performance could not be obtained.
従つて、従来においては、ろう材をカバー本体
の外縁全周に一定の精度をもつて接合又は固定す
る必要があり、その製造に余分な手間を要してい
た。 Therefore, in the past, it was necessary to join or fix the brazing material around the entire outer edge of the cover body with a certain degree of precision, which required extra effort to manufacture.
本発明は斯る従来事情に鑑みてなされたもので
あり、その目的とする処は、シール時においてろ
う材が確実かつ容易にカバー本体の外縁全周に十
分行きわたるシール用カバーを提供すると共に、
該カバーを作業性よく大量に生産し得るカバーの
成形方法を提供せんとするものである。 The present invention has been made in view of the conventional circumstances, and its purpose is to provide a sealing cover in which the brazing filler metal reliably and easily spreads over the entire outer edge of the cover body during sealing. ,
It is an object of the present invention to provide a method for molding a cover that can be mass-produced with good workability.
本発明の実施例を図面により説明すれば、第１
図及び第２図は本発明のシール用カバー１０を示
し、１はカバー本体、２はメツキ層、３はろう材
である。 Embodiments of the present invention will be described with reference to the drawings.
The drawings and FIG. 2 show a sealing cover 10 of the present invention, where 1 is a cover body, 2 is a plating layer, and 3 is a brazing material.
カバー本体１は金属又はセラミツクの何れであ
つてもよいが、実施例は金属板、詳しくはFe−
42wt％Ni合金又はFe−29wt％Ni−17wt％Co合
金を所定の形状に成形したものを図示する。もち
ろん上記カバー本体１をセラミツク製とすること
も任意であるが、その場合にはMo，Ｗあるいは
Mo−Ｗ等のメタライジング層を形成し、該層上
にメツキ層２を形成すればよい。 The cover body 1 may be made of metal or ceramic, but in this embodiment it is made of a metal plate, specifically Fe-
The figure shows a 42wt%Ni alloy or a Fe-29wt%Ni-17wt%Co alloy molded into a predetermined shape. Of course, it is optional to make the cover body 1 made of ceramic, but in that case, Mo, W or
A metallizing layer such as Mo-W may be formed, and the plating layer 2 may be formed on the metallizing layer.
メツキ層２は金属製カバー本体１の全周又は少
なくともシール側の片面に形成してカバー本体１
の耐蝕性を高めるとともにろう材３の接着性を良
好ならしめるものである。 The plating layer 2 is formed on the entire circumference of the metal cover body 1 or at least on one side on the sealing side.
This improves the corrosion resistance of the brazing filler metal 3 and improves the adhesion of the brazing filler metal 3.
上記メツキ層２はNi，Au，Agの何れか１つ又
は２種の合金でメツキ処理を施こして形成する。 The plating layer 2 is formed by plating with one or an alloy of Ni, Au, and Ag.
ろう材３はカバー本体１の片面全面にわたる板
状を呈し、無酸化雰囲気中で融着して接着し、あ
るいは冷間圧延により接着されたもので、この板
状のろう材３の外縁全周にわたつてカバー本体１
の全周囲側面に延びるよう縁上げした上り端縁
３′を一体に形成する。 The brazing filler metal 3 has a plate shape that covers the entire surface of one side of the cover body 1, and is bonded by fusion in a non-oxidizing atmosphere or by cold rolling. Cover body 1
A raised end edge 3' is integrally formed so as to extend over the entire circumferential side surface.
上記ろう材３の材質は、例えばPb−１−63wt
％Sn、Pb−１〜3wt％Ag−１〜10wt％Snであ
る。 The material of the brazing filler metal 3 is, for example, Pb-1-63wt.
%Sn, Pb-1 to 3wt%Ag-1 to 10wt%Sn.
而して上記カバー１０はICパツケージのベー
ス１２上の所定位置に、ろう材３を下向にして載
承され該パツケージを無酸化雰囲気中で加熱する
ことによりろう材３が溶融し、該ろう材３により
カバー１０をベース１２に接着してベース１２の
空所１４を気密封止するものである（第３図）。 The cover 10 is mounted at a predetermined position on the base 12 of the IC package with the brazing filler metal 3 facing downward, and by heating the package in a non-oxidizing atmosphere, the brazing filler metal 3 is melted and the solder filler metal 3 is melted. The cover 10 is adhered to the base 12 using the material 3, and the cavity 14 of the base 12 is hermetically sealed (FIG. 3).
上記ろう材３は、その溶融時において、表面張
力が作用して、中心側のろう材が上り端縁３′に
沿いカバー本体１の側面に誘引される現象を起し
カバー本体１の全周囲側面にろう材が確実に肉盛
りされ、カバー本体１の外縁全周をベース１２に
十分なじませて堅固に接着させる（第３図、第４
図）。 When the brazing filler metal 3 is melted, surface tension acts on the brazing filler metal 3, causing a phenomenon in which the center-side brazing filler metal is attracted to the side surface of the cover body 1 along the rising edge 3', and the entire periphery of the cover body 1. The brazing material is surely built up on the side surface, and the entire outer edge of the cover body 1 is sufficiently blended with the base 12 to firmly adhere it (Figs. 3 and 4).
figure).
尚、第３図において１６は空所１４の囲りに形
成したメタライジング層、１８は半導体素子、１
９はリード線、１９′リード線を接続させるメタ
ライジング層である。 In addition, in FIG. 3, 16 is a metallizing layer formed around the cavity 14, 18 is a semiconductor element, 1
Reference numeral 9 denotes a metallizing layer to which lead wires and 19' lead wires are connected.
次に第５図及び第６図は第１図、第２図に示す
金属製カバー１０の成形方法を説明するもので、
カバー素材板Ａはプレス成形可能な金属製、例え
ば前述したFe−Ni合金又はFe−Ni−Co合金から
なる長尺状金属板であつて、その全周にメツキ層
２を形成するとともに片面全面にろう材３を冷間
圧延により接着させたものである。 Next, FIGS. 5 and 6 illustrate a method of forming the metal cover 10 shown in FIGS. 1 and 2.
The cover material plate A is a long metal plate made of metal that can be press-formed, such as the Fe-Ni alloy or Fe-Ni-Co alloy mentioned above, and has a plating layer 2 formed around its entire circumference and one side of the entire surface. The brazing filler metal 3 is bonded by cold rolling.
上記素材板Ａを、ろう材３が下側になるように
してダイス２０上に間歇移送させながらポンチ２
２によつてプレス工程の打抜き動作を行なわせる
ことにより、ダイス２０の型孔２０′及びポンチ
２２の形状に適合するカバー１０を連続して打抜
き成形する。上記打抜き動作によつて打抜かれた
カバー１０は打抜き時の剪断作用によつて下面外
周部が型孔２０′の孔縁に沿い上向に切り上げら
れるため、ろう材３の外縁全周がカバー本体１の
側面に沿つて縁上げされ、その結果カバー本体１
の全周囲側面にわたるろう材３の上り端縁３′が
自動的に形成される。 While intermittently transferring the material plate A onto the die 20 with the brazing material 3 facing downward, punch the punch 2.
2 performs the punching operation of the press step, so that the cover 10 that matches the shape of the die hole 20' of the die 20 and the shape of the punch 22 is continuously punched and formed. The outer periphery of the lower surface of the cover 10 punched out by the above-mentioned punching operation is cut upward along the edge of the die hole 20' due to the shearing action during punching, so that the entire periphery of the outer edge of the brazing filler metal 3 becomes the cover body. 1, and as a result, the cover body 1
The upper edge 3' of the brazing filler metal 3 over the entire circumferential side is automatically formed.
本発明のシール用カバーは以上説明したよう
に、ろう材を板状とすると共にその外縁全周に渉
つてカバー本体の側面に延びる上り端縁を形成し
たので、このカバーをパツケージに加熱融着する
シール時において、溶融した前記ろう材の板状部
が表面張力の作用により上り端縁側に誘引されて
カバー本体の全周囲側面にさらに肉盛りされ、ろ
う材をカバー本体の外縁全周に十分に行きわたら
せることができる。 As explained above, in the sealing cover of the present invention, the brazing material is made into a plate shape and has an upward edge extending over the entire outer circumference of the cover body to the side surface of the cover body, so that the cover is heat-fused to the package. During sealing, the plate-shaped portion of the melted brazing material is attracted to the upper edge side by the effect of surface tension and is further built up on the entire circumference of the cover body, spreading the brazing material sufficiently around the entire outer edge of the cover body. can be distributed to
従つて、シール時においてろう材をカバー本体
の外縁全周に確実かつ容易に行きわたらせること
ができる、信頼性が高くなおかつ製造容易なシー
ル用カバーを提供することができる。同時に、ろ
う材とカバー本体の接着強度が大きくなり、その
シール性をさらに向上することができる。 Therefore, it is possible to provide a sealing cover that is highly reliable and easy to manufacture, in which the brazing material can be reliably and easily spread over the entire outer edge of the cover body during sealing. At the same time, the adhesive strength between the brazing material and the cover main body is increased, and the sealing performance thereof can be further improved.
又、本発明のカバー成形方法によれば、金属製
カバー素材板の片面にろう材を接着し、該素材板
をプレス工程によつてろう材方向に打抜くだけで
板状のろう材の外縁にカバー本体の全周囲側面に
延びる上り端縁を形成することができ、よつて上
記シール用カバーをきわめて作業性よく大量に生
産することができる。 Further, according to the cover forming method of the present invention, the outer edge of the plate-shaped brazing material can be formed simply by bonding a brazing material to one side of a metal cover material plate and punching out the material plate in the direction of the brazing material using a pressing process. It is possible to form an upward edge extending over the entire circumferential side surface of the cover body, making it possible to mass-produce the sealing cover with extremely good workability.
第１図は本発明のICパツケージのシール用カ
バーの一例を表わす断面図、第２図はその一部切
欠せる底面図、第３図はカバーを組付けたICパ
ツケージの断面図、第４図はその要部拡大図、第
５図はカバー成形方法で用いる素材の断面斜視
図、第６図は成形方法を説明する断面図である。
図中、１０はカバー、１はカバー本体、２はメ
ツキ層、３はろう材、３′は上り端縁、Ａはカバ
ー素材板、２０はダイス、２０′は型孔、２２は
ポンチである。
Fig. 1 is a sectional view showing an example of the sealing cover of the IC package of the present invention, Fig. 2 is a partially cutaway bottom view, Fig. 3 is a sectional view of the IC package with the cover assembled, and Fig. 4. 5 is a cross-sectional perspective view of a material used in the cover molding method, and FIG. 6 is a sectional view illustrating the molding method. In the figure, 10 is the cover, 1 is the cover body, 2 is the plating layer, 3 is the brazing material, 3' is the upper edge, A is the cover material plate, 20 is the die, 20' is the mold hole, and 22 is the punch. .
Claims (1)
カバー本体の片面全面に渉る板状に形成すると共
に、該ろう材の外縁全周に渉つてカバー本体の側
面に延びる上り端縁を一体に形成したことを特徴
とするICパツケージのシール用カバー。 ２ 金属製カバー素材板の片面にろう材を接着
し、該素材板をプレス工程によつてろう材方向に
打抜いて片面全面に板状のろう材を有するカバー
本体を成形すると共に、打抜き時の剪断作用によ
つて該板状のろう材の外縁全周をカバー本体の側
面に縁上させることを特徴とするICパツケージ
のシール用カバーの成形方法。[Claims] 1. A brazing material to be adhered to the sealing surface of the cover body,
A cover for sealing an IC package, characterized in that it is formed into a plate shape that spans the entire surface of one side of the cover body, and is integrally formed with an upward edge that extends to the side surface of the cover body over the entire outer edge of the brazing material. . 2 A brazing material is bonded to one side of a metal cover material plate, and the material plate is punched out in the direction of the brazing material by a pressing process to form a cover body having a plate-shaped brazing material on the entire surface of one side, and at the time of punching. A method for forming a sealing cover for an IC package, characterized in that the entire outer edge of the plate-shaped brazing filler metal is brought up to the side surface of the cover body by shearing action.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56174744A JPS5875850A (en) | 1981-10-31 | 1981-10-31 | Sealing cover for ic package and forming method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56174744A JPS5875850A (en) | 1981-10-31 | 1981-10-31 | Sealing cover for ic package and forming method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5875850A JPS5875850A (en) | 1983-05-07 |
| JPH0221140B2 true JPH0221140B2 (en) | 1990-05-11 |
Family
ID=15983916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56174744A Granted JPS5875850A (en) | 1981-10-31 | 1981-10-31 | Sealing cover for ic package and forming method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5875850A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02235361A (en) * | 1989-03-09 | 1990-09-18 | Sumitomo Metal Mining Co Ltd | Hermetic seal cover and its manufacturing method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS524841Y2 (en) * | 1972-10-26 | 1977-02-01 | ||
| JPS5432312A (en) * | 1977-08-16 | 1979-03-09 | Toshiba Corp | Magnetic data write apparatus |
| JPS5546558A (en) * | 1978-09-29 | 1980-04-01 | Fujitsu Ltd | Metallic cover plate for semiconductor package |
-
1981
- 1981-10-31 JP JP56174744A patent/JPS5875850A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5875850A (en) | 1983-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3941916A (en) | Electronic circuit package and method of brazing | |
| JPH08186225A (en) | Semiconductor package and manufacturing method thereof | |
| WO2005024933A1 (en) | Semiconductor device manufacturing method | |
| JPH0221140B2 (en) | ||
| JP4055158B2 (en) | Lead frame and semiconductor device provided with lead frame | |
| KR100201384B1 (en) | Semiconductor package having a transparency lid | |
| JPH06132457A (en) | Semiconductor device and manufacturing method thereof | |
| JPS601487Y2 (en) | Cathode structure for magnetron | |
| JPH01239958A (en) | Airtightly sealed semiconductor element | |
| JPH0423383A (en) | Semiconductor laser | |
| JPS63102247A (en) | Resin sealed type semiconductor device | |
| JPS5940552A (en) | Cap fitting construction for semiconductor device | |
| JPS6330131Y2 (en) | ||
| JPH0822932A (en) | Chip solid electrolytic capacitor | |
| JP2543661Y2 (en) | Microwave transistor | |
| JPH05145004A (en) | Method for manufacturing semiconductor device | |
| JPS6210942Y2 (en) | ||
| JPS6323891Y2 (en) | ||
| JPH08162590A (en) | Lead frame | |
| JPH1012813A (en) | Semiconductor device | |
| JP2000174579A (en) | Manufacture of surface acoustic wave device | |
| JPS6317256Y2 (en) | ||
| JPH0195528A (en) | Wire bonding and equipment therefor | |
| JPH01128456A (en) | Surface packaging type semiconductor device and leadframe | |
| JPS5981878A (en) | Airtight terminal and method of producing same |