JPH0227579Y2

JPH0227579Y2 -

Info

Publication number: JPH0227579Y2
Application number: JP1982143336U
Authority: JP
Priority date: 1982-09-24
Filing date: 1982-09-24
Publication date: 1990-07-25
Also published as: JPS5948048U

Description

【考案の詳細な説明】 (1) 考案の技術分野本考案はフラツトリード部分のリード端子を基
板にボンデイングする装置に係り、特に基板に対
してヒータチツプが自由に角度変更（フローテイ
ング）を行なうことができるボンデイング装置に
おけるヒータチツプのフローテイング構造に関す
る。[Detailed Description of the Invention] (1) Technical Field of the Invention The present invention relates to a device for bonding lead terminals of flat lead portions to a substrate, and in particular, the heater chip can freely change the angle (floating) with respect to the substrate. This invention relates to a floating structure for a heater chip in a bonding device.

(2) 技術の背景複数本のリード端子を有するリード部品を基板
上にボンデイングする場合、ボンデイング装置の
ヒータチツプでこれらのリード端子を同時に基板
上に押圧（加圧）し、加熱してボンデイングを行
なう方法が通常採られている。その場合、複数本
のリード端子はすべて均等に加圧されて加熱され
ることが重要である。しかし、基板の反りやたわ
みなどによつて、リード端子の配列面とヒータチ
ツプの加圧面との間に傾きが生ずる場合がある。
このためヒータチツプは、この傾きに順応して角
度変更が自動的に行ない得るようなフローテイン
グ構造に構成されている。従つて、この種のヒー
タチツプのフローテイング構造は、ヒータチツプ
が基板の傾斜に容易に順応して角度変更し、常に
複数本のリード端子を均等に加圧できると共に、
非加圧時には迅速かつ正確に原点位置に復帰でき
るものが好ましい。(2) Background of the technology When bonding a lead component with multiple lead terminals onto a board, the heater chip of the bonding device simultaneously presses (pressurizes) these lead terminals onto the board and heats them to perform bonding. method is usually adopted. In that case, it is important that all the plurality of lead terminals are evenly pressurized and heated. However, due to warping or bending of the substrate, an inclination may occur between the arrangement surface of the lead terminals and the pressurizing surface of the heater chip.
For this reason, the heater chip is constructed in a floating structure so that the angle can be automatically changed in accordance with this inclination. Therefore, this kind of floating structure of the heater chip allows the heater chip to easily adapt to the inclination of the board and change its angle, and to always apply pressure evenly to multiple lead terminals.
It is preferable to use one that can quickly and accurately return to the original position when no pressure is applied.

(3) 従来技術と問題点第１図は従来のボンデイング装置におけるヒー
タチツプのフローテイング構造を示す図であり、
イ図はその正面図、ロ図はイ図の矢印Ａ方向の側
面図である。同図において、符号１０は加圧本
体、１１は浮動性部材を示す。加圧本体１０下方
部の側面形状は、ロ図に示すように、その側面中
央部が下端まで削除され二股状に形成されてい
る。この二股空間の上部左右に、一対の加圧ロー
ラ１２，１２′が、イ図に示すように、加圧本体
１０側に支軸１３，１３′によつて回動自在にそ
れぞれ支承されている。浮動性部材１１の下側
に、加熱電極１４，１４′が左右対称にねじ１５，
１５′によつてねじ止めされている。電極１４，
１４′の中央部下側にヒータチツプ１６がねじ１
７，１７′によつてねじ止めされている。また、
浮動性部材１１の上面はヒータチツプ下面（加圧
面）１６ａの中心点Ｐを中心として半径Ｒの凸状
湾曲面１１ａに形成されている。湾曲面１１ａの
頂部に中心線Ｃに沿つてフツク１８が取着され、
該フツク１８は引張コイルばね１９の下端が掛合
している。コイルばね１９の上端（図示なし）は
加圧本体１０に掛合されている。従つて、浮動性
部材１１はコイルばね１９によつて常に上方に引
張られ、湾曲面１１ａが加圧ローラ１３，１３′
に衝合している。浮動性部材１１の中央部に横方
向の長穴１１ｂが貫通して設けられ、該長穴１１
ｂ内に、加圧本体１０の二股部に植設されたピン
１０ａが遊嵌されている。この長穴１１ｂとピン
１０ａによつて、加圧本体１０と浮動部材１２相
互間の動作範囲が限定される。(3) Prior art and problems Figure 1 is a diagram showing a floating structure of a heater chip in a conventional bonding device.
Figure A is a front view thereof, and Figure B is a side view in the direction of arrow A in Figure A. In the figure, reference numeral 10 indicates a pressurizing body, and 11 indicates a floating member. The side surface of the lower part of the pressurizing body 10 is formed into a bifurcated shape, with the central part of the side surface being cut down to the lower end, as shown in FIG. A pair of pressure rollers 12 and 12' are rotatably supported on the pressure body 10 side by support shafts 13 and 13', respectively, on the left and right sides of the upper part of this bifurcated space, as shown in Figure A. . Heating electrodes 14, 14' are arranged symmetrically on the lower side of the floating member 11 with screws 15,
15'. electrode 14,
Heater chip 16 is attached to screw 1 on the lower center side of 14'.
7, 17'. Also,
The upper surface of the floating member 11 is formed into a convex curved surface 11a having a radius R centered on the center point P of the lower surface (pressure surface) 16a of the heater chip. A hook 18 is attached to the top of the curved surface 11a along the center line C,
The hook 18 is engaged with the lower end of a tension coil spring 19. The upper end (not shown) of the coil spring 19 is engaged with the pressurizing body 10. Therefore, the floating member 11 is constantly pulled upward by the coil spring 19, and the curved surface 11a is pressed against the pressure rollers 13, 13'.
are in conflict with each other. A horizontal elongated hole 11b is provided through the center of the floating member 11, and the elongated hole 11
A pin 10a implanted in the bifurcated portion of the pressurizing body 10 is loosely fitted into the inside of the pressurizing body 10. The elongated hole 11b and the pin 10a limit the range of motion between the pressurizing body 10 and the floating member 12.

さて、基板（図示なし）が水平面に対して傾斜
している場合、加圧本体１０が中心線Ｃに沿つて
下降すると、ヒータチツプ１６の下面１６ａの一
端側が基板に衝合し、さらに下降すると基板の傾
斜に順応してヒータチツプ１６が自動的に矢印Ｂ
方向に角度変更して下面１６ａは基板上面と平行
になり基板上に複数本のリード端子を均等に加圧
してボンデイングが行なわれる。この場合のヒー
タチツプ１６の角度変更は、引張コイルばね１９
の引張力に抗して、加圧ローラ１２，１２′と湾
曲面１１ａ相互間の転動動作によつて行われる。
次に、ボンデイング終了後、加圧本体１０が上昇
して、ヒータチツプ１６が非加圧状態になると、
引張コイルばね１９の引張力によつて浮動性部材
１１が元の位置、すなわちその中心線が中心線Ｃ
上に復元される。この結果ヒータチツプ１６の下
面１６ａの中心点Ｐは原点に復帰される。 Now, when the substrate (not shown) is inclined with respect to the horizontal plane, when the pressurizing body 10 descends along the center line C, one end side of the lower surface 16a of the heater chip 16 abuts against the substrate, and when it descends further, the substrate The heater chip 16 automatically moves in the direction of arrow B according to the inclination of
By changing the angle in the direction, the lower surface 16a becomes parallel to the upper surface of the substrate, and bonding is performed by uniformly pressing the plurality of lead terminals onto the substrate. In this case, the angle of the heater chip 16 can be changed using the tension coil spring 19.
This is done by the rolling action between the pressure rollers 12, 12' and the curved surface 11a against the tensile force of the pressure rollers 12, 12'.
Next, after the bonding is completed, the pressurizing body 10 rises and the heater chip 16 becomes non-pressurized.
Due to the tensile force of the tension coil spring 19, the floating member 11 returns to its original position, that is, its center line returns to the center line C.
restored above. As a result, the center point P of the lower surface 16a of the heater chip 16 is returned to the origin.

しかしながら、このフローテイング構造におい
ては、コイルばね１９の引張力を強くすると、こ
のばね力によつてヒータチツプ１６の原点復帰は
良好になるが、逆に、ヒータチツプ１６を傾斜基
板に押圧するときにはヒータチツプ１６の角度変
更（フローテイング）が、強力なばね力のため
に、円滑に行なわれないという問題がある。これ
に反して、コイルばね１９の引張力を弱くする
と、ヒータチツプ１６のフローテイングは良好に
なるが、該ヒータチツプ１６の原点復帰が迅速か
つ正確に行なわれないという問題がある。つま
り、このフローテイング構造は、ヒータチツプ１
６の良好なフローテイング動作と、迅速かつ正確
な原点復帰とを同時に両立させることがきわめて
因難であるという問題点を含んでいる。 However, in this floating structure, if the tensile force of the coil spring 19 is strengthened, the spring force allows the heater chip 16 to return to its origin effectively, but conversely, when the heater chip 16 is pressed against the inclined substrate, There is a problem in that the angle change (floating) cannot be performed smoothly due to the strong spring force. On the other hand, if the tensile force of the coil spring 19 is weakened, the floating of the heater chip 16 is improved, but there is a problem in that the heater chip 16 cannot be returned to its original position quickly and accurately. In other words, this floating structure
This problem involves the problem that it is extremely difficult to achieve both the good floating action of No. 6 and the quick and accurate return to the origin at the same time.

(4) 考案の目的本考案は、上記従来技術の問題点に鑑み、ヒー
タチツプの角度変更（フローテイング）が円滑に
行ない得ると共に、原点復帰が迅速かつ正確に行
ない得るボンデイング装置におけるヒータチツプ
のフローテイング構造を提供することを目的とす
るものである。(4) Purpose of the invention In view of the above-mentioned problems of the prior art, the present invention provides a floating method for a heater chip in a bonding device that allows the angle of the heater chip to be smoothly changed (floating) and returns to the origin quickly and accurately. The purpose is to provide structure.

(5) 考案の構成そして、この目的を達成するために、本考案に
依れば、加圧本体下側に、ヒータチツプを有する
浮動性部材を弾発的に結合させているリード端子
ボンデイング装置において、前記加圧本体と浮動
性部材の左右両側に圧縮ばねを配置し、該圧縮ば
ねの上端と下端をそれぞれ前記加圧本体と浮動性
部材に結合し、かつ該浮動性部材の中心部に形成
した三角形状貫通穴と加圧本体側に設けた担持ピ
ンとの係合部を介して前記加圧本体と浮動性部材
相互間を離反するように弾発的に結合し、更に加
圧本体下部中心線上に加圧ローラを配設し、該加
圧ローラに対向して前記浮動性部材の上表面を凸
状湾曲面に形成して、実質的な加熱押圧作用時の
み上記加圧ローラによつてヒータチツプが加圧さ
れるようにしたことを特徴とするボンデイング装
置におけるヒータチツプのフローテイング構造が
提供される。(5) Structure of the invention In order to achieve this object, the invention provides a lead terminal bonding device in which a floating member having a heater tip is elastically bonded to the lower side of the pressurizing body. , compression springs are arranged on both left and right sides of the pressure body and the floating member, the upper and lower ends of the compression springs are respectively connected to the pressure body and the floating member, and are formed in the center of the floating member. The pressurizing body and the floating member are elastically connected so as to be separated from each other through the engaging portion between the triangular through hole and the support pin provided on the pressurizing body side, and A pressure roller is disposed on the line, and the upper surface of the floating member is formed into a convex curved surface opposite to the pressure roller, so that the pressure roller is used only during the substantial heating and pressing action. There is provided a floating structure for a heater chip in a bonding apparatus, characterized in that the heater chip is pressurized.

(6) 考案の実施例以下、本考案の実施例を図面に基づいて詳細に
説明する。(6) Embodiments of the invention Hereinafter, embodiments of the invention will be described in detail based on the drawings.

第２図は本考案に依るボンデイング装置におけ
るヒータチツプのフローテイング構造（以下、フ
ローテイング構造と呼ぶ）を示す図であつて、イ
図は正面図、ロ図はイ図のＤ−Ｄ線断面図、ハ図
とニ図はイ図のＥ部の内部を示す図である。同図
において、符号２０，２０′は加圧本体、２１，
２１′は浮動性部材を示す。加圧本体２０と２
０′、及び浮動部材２１と２１′、及び他の部品は
中心線Ｃを対称軸として前後左右対称に配置構成
されているので、前面側の加圧本体２０、浮動部
材２１、及びその部品に関してのみ説明する。加
圧本体２０下方部の側面形状は、ロ図に示すよう
に、側面中央部が削除され二股状に形成され、外
壁部２０ａは短縮され、内壁部２０ｂは下方に延
長されている。外壁部２０ａと内壁部２０ｂ間
に、加圧ローラ２２が、イ図に示すように中心線
C′上に支軸２３によつて回動自在に支承されてい
る。浮動性部材２１の下側に、平面形状Ｌ字形の
加熱電極２４ａ，２４ｂが左右対称にねじ２５に
よつてねじ止めされている。これら加熱電極２４
ａ，２４ｂそれぞれの先端にケーブル３４ａ，３
４ｂが接続されている。尚、浮動性部材２１と加
熱電極２４ａ，２４ｂとは適宜な手段によつて絶
縁されている。電極２４ａ，２４ｂの中央部下側
にヒータチツプ２６がねじ２７によつてねじ止め
されている。浮動性部材２１の上面は、ヒータチ
ツプ２６の下面（加圧面）２６ａの中心点P′を中
心として半径R′の凸状湾曲面２１ａに形成され
ている。加圧本体２０と浮動性部材２１の左右両
側に圧縮コイルばね２９ａ，２９ｂがそれぞれ配
置され、該コイルばね２９ａ，２９ｂそれぞれの
下端は、浮動性部材２１の下部両側の突出部２１
ｂ，２１ｃにそれぞれねじ止めされたばね受軸２
８ａ，２８ｂに係合されている。一方、コイルば
ね２９ａ，２９ｂの上端は、加圧本体２０の両側
の突出部２０ｃ，２０ｄに螺合している調整用ば
ね受軸３０ａ，３０ｂにそれぞれ係止されてい
る。これらのばね受軸３０ａ，３０ｂはコイルば
ね２９ａ，２９ｂの圧縮ばね力を調整する役目を
するものでロツクナツト３１ａ，３１ｂによつて
固定される。従つて加圧本体２０と浮動性部材２
１相互間には、コイルばね２９ａ，２９ｂによつ
て、常に両者を離反させる力が作用する。浮動性
部材２１の中央部に中心線C′を対称軸とする三角
形状貫通穴２１ｄが、ハ図とニ図に示すように設
けられている。この貫通穴２１ｄに対応する加圧
本体２０の中心線C′上の部分に担持ピン３２ａが
ねじ込まれ、該担持ピン３２ａと一体的に形成さ
れたカバー３２が貫通穴２１ｄを被うように配置
されている。従つて、加圧本体２０と浮動性部材
２１とは、通常時（非加圧時）には、ハ図に示す
ように、コイルばね２９ａ，２９ｂのばね力と浮
動性部材２１自体の重力とにより、担持ピン３２
ａが三角形状貫通穴２１ｄの頂部と係合して、中
心線C′上に整合される。このとき加圧ローラ２２
と凸状湾曲面２１ａは離隔するように構成されて
いる。そして、加圧本体２０が下降して、ヒータ
チツプが基板（図示なし）上に衝合すると、担持
ピン３２ａと貫通穴２１ｄの頂部との係合が解除
され、担持ピン３２ａは貫通穴２１ｄ内で浮遊状
態になる。このときヒータチツプ２６は矢印Ｆ方
向に角度変更して、基板の傾斜に順応し、容易か
つ迅速にフローテイング（角度変更）を行ない下
面２６ａが基板上面と整合される。すなわち、例
えば、イ図において、ヒータチツプ２６の下面２
６ａの一端側Q₁が、先づ基板上に衝合したとき
他端側Q₂と基板との間は空隙が存在することに
なる。この場合Q₁点とばね２９ｂの作用線との
距離は、Q₁点とばね２９ａの作用線との距離よ
りも大きいので、Q₁点を支点としてヒータチツ
プ２６を回転させようとする力は右回り（時計方
向）に作用し、この結果Q₂点は基板上にすみや
かに衝合されることになる。次いで、加圧本体２
０は更に下降して加圧ローラ２２が、ニ図に示す
ように、浮動性部材２１の上面２１ａに衝合して
実質的な加圧が行なわれ、所定加圧力に達すると
下降が停止されボンデイングが行なわれる。そし
てボンデイングが終了して再び加圧本体２０が上
昇すると、左右のコイルばね２９ａ，２９ｂの圧
縮力によつて、担持ピン３２ａに貫通穴２１ｄの
頂部が係合して、ヒータチツプ２６は迅速かつ正
確に原点（下面２６ａの中心点P′が中心線C′上）
に復帰される。尚、ロ図に示すように加圧ローラ
２２，２２′の外周面と、浮動性部材２１，２
１′の上面（凸状湾曲面）とは共にテーパ状に形
成され、このため加圧時にヒータチツプ２６，２
６′が互に内側に押圧され、両者の間隔が常に一
定に保たれるように考慮されている。またロ図の
符号３３はバキユームパイプを示し、該パイプ３
３は途中３３ｂから下側部は長方形断面に形成さ
れ、下端に取付けられた吸着口３３ａも長方形の
吸着面を有している。 Fig. 2 is a diagram showing a floating structure (hereinafter referred to as floating structure) of a heater chip in a bonding apparatus according to the present invention, in which Fig. A is a front view and Fig. B is a sectional view taken along line D-D of Fig. A. , C and D are diagrams showing the inside of section E in Figure A. In the same figure, numerals 20 and 20' are the pressurizing body, 21,
21' indicates a floating member. Pressurizing bodies 20 and 2
0', the floating members 21 and 21', and other parts are arranged symmetrically in the front, back, left, and right with the center line C as the axis of symmetry. I will only explain. As shown in FIG. 2, the side surface shape of the lower part of the pressurizing body 20 is bifurcated with the central part of the side removed, the outer wall part 20a is shortened, and the inner wall part 20b is extended downward. A pressure roller 22 is placed between the outer wall portion 20a and the inner wall portion 20b, so that the pressure roller 22 is aligned with the center line as shown in FIG.
It is rotatably supported on C' by a support shaft 23. L-shaped planar heating electrodes 24a and 24b are symmetrically screwed to the lower side of the floating member 21 by screws 25. These heating electrodes 24
Cables 34a and 3 are attached to the ends of each of a and 24b.
4b is connected. Note that the floating member 21 and the heating electrodes 24a, 24b are insulated by appropriate means. A heater chip 26 is screwed to the center lower side of the electrodes 24a, 24b with a screw 27. The upper surface of the floating member 21 is formed into a convex curved surface 21a having a radius R' centered on the center point P' of the lower surface (pressure surface) 26a of the heater chip 26. Compression coil springs 29a and 29b are arranged on both left and right sides of the pressure body 20 and the floating member 21, respectively, and the lower ends of the coil springs 29a and 29b are connected to the protrusions 21 on both lower sides of the floating member 21.
Spring bearing shaft 2 screwed to b and 21c, respectively
8a and 28b. On the other hand, the upper ends of the coil springs 29a and 29b are respectively locked to adjustment spring bearing shafts 30a and 30b which are screwed into protrusions 20c and 20d on both sides of the pressurizing body 20. These spring bearing shafts 30a, 30b serve to adjust the compression spring force of the coil springs 29a, 29b, and are fixed by lock nuts 31a, 31b. Therefore, the pressurizing body 20 and the floating member 2
1, a force is constantly applied between the two by the coil springs 29a and 29b to separate them. A triangular through hole 21d having an axis of symmetry about the center line C' is provided in the center of the floating member 21, as shown in Figures C and D. A support pin 32a is screwed into a portion on the center line C' of the pressurizing body 20 corresponding to the through hole 21d, and a cover 32 formed integrally with the support pin 32a is arranged to cover the through hole 21d. has been done. Therefore, under normal conditions (when not pressurized), the pressurizing body 20 and the floating member 21 are operated by the spring force of the coil springs 29a and 29b and the gravity of the floating member 21 itself, as shown in Fig. C. Accordingly, the carrying pin 32
a engages with the top of the triangular through hole 21d and is aligned on the center line C'. At this time, the pressure roller 22
and the convex curved surface 21a are configured to be separated from each other. Then, when the pressurizing body 20 descends and the heater chip collides with the substrate (not shown), the engagement between the support pin 32a and the top of the through hole 21d is released, and the support pin 32a is moved inside the through hole 21d. become floating. At this time, the heater chip 26 changes its angle in the direction of arrow F to adapt to the inclination of the substrate, and easily and quickly floats (changes its angle) so that its lower surface 26a is aligned with the upper surface of the substrate. That is, for example, in FIG.
When one end side Q ₁ of 6a first abuts on the substrate, a gap will exist between the other end side Q ₂ and the substrate. In this case, the distance between point _Q1 and the line of action of spring 29b is greater than the distance between point _Q1 and the line of action of spring 29a, so the force trying to rotate heater chip 26 with point _Q1 as a fulcrum is directed to the right. It acts in a circular direction (clockwise), and as a result, _{the two} points Q quickly collide on the substrate. Next, the pressurizing body 2
0 further descends, and as shown in Figure 2, the pressure roller 22 collides with the upper surface 21a of the floating member 21 to apply substantial pressure, and when a predetermined pressure is reached, the pressure roller 22 stops descending. Bonding is performed. When the bonding is finished and the pressurizing body 20 rises again, the top of the through hole 21d engages with the support pin 32a due to the compression force of the left and right coil springs 29a, 29b, and the heater chip 26 is quickly and accurately moved. origin (center point P' of bottom surface 26a is on center line C')
will be reinstated. In addition, as shown in FIG.
Both the upper surfaces (convex curved surfaces) 1' are formed in a tapered shape, so that the heater chips 26, 2
6' are pressed inward to keep the distance between them constant. Further, the reference numeral 33 in the figure B indicates a vacuum pipe, and the pipe 3
3 has a rectangular cross section from the middle 33b to the lower side, and the suction port 33a attached to the lower end also has a rectangular suction surface.

(7) 考案の効果以上、詳細に説明したように、本考案のボンデ
イング装置におけるヒータチツプのフローテイン
グ構造は、複数本のリード端子を基板上に常にき
わめて均等に加圧することが可能であり、かつ非
加圧時におけるヒータチツプの原点復帰を迅速か
つ正確に行なうことができ、作業性の向上、製品
の品質の向上、等の効果大なるものがある。(7) Effects of the invention As explained in detail above, the floating structure of the heater chip in the bonding device of the invention allows multiple lead terminals to be constantly and extremely evenly pressed onto the substrate. It is possible to quickly and accurately return the heater chip to its origin when no pressure is applied, which has great effects such as improved workability and improved product quality.

[Brief explanation of the drawing]

第１図は従来のボンデイング装置におけるヒー
タチツプのフローテイング構造の説明図、第２図
は本考案に依るボンデイング装置におけるヒータ
チツプのフローテイング構造の実施例を示す図で
ある。２０，２０′……加圧本体、２１，２１′……浮
動性部材、２１ａ……凸状湾曲面、２１ｄ……三
角形状貫通穴、２２，２２′……加圧ローラ、２
３，２３′……支軸、２４ａ，２４ｂ，２４′ａ…
…加熱電極、２６，２６′……ヒータチツプ、２
６ａ，２６′ａ……ヒータチツプの下面（加圧
面）、２８ａ，２８ｂ……ばね受軸、２９ａ，２
９ｂ……圧縮コイルばね、３０ａ，３０ｂ……調
整用ばね受軸、３１ａ，３１ｂ……ロツクナツ
ト、３２……カバー、３２ａ……担持ピン。 FIG. 1 is an explanatory diagram of a floating structure of a heater chip in a conventional bonding apparatus, and FIG. 2 is a diagram showing an embodiment of a floating structure of a heater chip in a bonding apparatus according to the present invention. 20, 20'... Pressure main body, 21, 21'... Floating member, 21a... Convex curved surface, 21d... Triangular through hole, 22, 22'... Pressure roller, 2
3, 23'... Support shaft, 24a, 24b, 24'a...
... Heating electrode, 26, 26' ... Heater chip, 2
6a, 26'a... lower surface of heater chip (pressure surface), 28a, 28b... spring bearing shaft, 29a, 2
9b...Compression coil spring, 30a, 30b...Adjustment spring bearing shaft, 31a, 31b...Lock nut, 32...Cover, 32a...Holding pin.

Claims

[Scope of utility model registration request]

In a lead terminal bonding device in which a floating member having a heater chip is elastically bonded to the lower side of a pressure body, compression springs are arranged on both left and right sides of the pressure body and the floating member, and the upper end of the compression spring is and lower ends are respectively connected to the pressure body and the floating member, and the pressure body is connected to the pressure body through an engagement portion between a triangular through hole formed in the center of the floating member and a support pin provided on the pressure body side. The pressure body and the floating member are elastically coupled so as to be separated from each other, and a pressure roller is disposed on the center line of the lower part of the pressure body, and a pressure roller is provided on the floating member opposite to the pressure roller. 1. A floating structure for a heater chip in a bonding apparatus, characterized in that the surface is formed into a convex curved surface so that the pressure roller presses the heater chip only during a substantial heating and pressing action.