JPH0236064B2 - - Google Patents

Info

Publication number
JPH0236064B2
JPH0236064B2 JP58020094A JP2009483A JPH0236064B2 JP H0236064 B2 JPH0236064 B2 JP H0236064B2 JP 58020094 A JP58020094 A JP 58020094A JP 2009483 A JP2009483 A JP 2009483A JP H0236064 B2 JPH0236064 B2 JP H0236064B2
Authority
JP
Japan
Prior art keywords
wire
connection point
capillary
bonding tool
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58020094A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59150436A (ja
Inventor
Tomio Kashihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58020094A priority Critical patent/JPS59150436A/ja
Publication of JPS59150436A publication Critical patent/JPS59150436A/ja
Publication of JPH0236064B2 publication Critical patent/JPH0236064B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP58020094A 1983-02-09 1983-02-09 ワイヤボンデイング方法 Granted JPS59150436A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58020094A JPS59150436A (ja) 1983-02-09 1983-02-09 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58020094A JPS59150436A (ja) 1983-02-09 1983-02-09 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS59150436A JPS59150436A (ja) 1984-08-28
JPH0236064B2 true JPH0236064B2 (mo) 1990-08-15

Family

ID=12017522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58020094A Granted JPS59150436A (ja) 1983-02-09 1983-02-09 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS59150436A (mo)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2823454B2 (ja) * 1992-12-03 1998-11-11 株式会社東芝 ワイヤボンディング装置
EP1187190A1 (en) 2000-09-11 2002-03-13 Marconi Communications GmbH Method for monitoring the length of constant-wire-length bonds & apparatus therefor
JP5065585B2 (ja) 2005-10-11 2012-11-07 ユニ・チャーム株式会社 母乳パッド
CN102047400B (zh) * 2008-03-17 2013-01-30 库力索法工业公司 用于线焊机的导线放线测量和校准技术

Also Published As

Publication number Publication date
JPS59150436A (ja) 1984-08-28

Similar Documents

Publication Publication Date Title
US4603802A (en) Variation and control of bond force
US4600138A (en) Bonding tool and clamp assembly and wire handling method
US4444349A (en) Wire bonding apparatus
US4340166A (en) High speed wire bonding method
KR950009619B1 (ko) 반도체장치의 와이어 본딩방법
PH12012000317A1 (en) Automatic wire tail adjustment system for wire bonders
US4053096A (en) Thermocompression welding device
US7025243B2 (en) Bondhead for wire bonding apparatus
US6595400B2 (en) Wire bonding apparatus
US4878609A (en) Apparatus for manual wire bonding
US5170928A (en) Bonding head
JPS59150436A (ja) ワイヤボンデイング方法
JP2885242B1 (ja) ワイヤボンディング方法及び装置
JPS62179733A (ja) ワイヤボンデイング方式
JP2575066B2 (ja) 半導体組立装置
JPH025533Y2 (mo)
JPH02199846A (ja) ワイヤボンディング方法
JPH0135500B2 (mo)
JPH11312707A (ja) ワイヤボンディング装置
JPS61290730A (ja) ボンデイング装置
JP3369764B2 (ja) ワイヤボンディング装置における放電用トーチ電極体
JP2765833B2 (ja) 半導体装置のワイヤボンディング方法
JPS5988841A (ja) ワイヤボンデイング装置
JP2539963B2 (ja) ワイヤボンディング装置及びワイヤボンディング方法
JPH02303138A (ja) ワイヤボンディング装置及び方法