JPH0236148B2 - - Google Patents

Info

Publication number
JPH0236148B2
JPH0236148B2 JP58121450A JP12145083A JPH0236148B2 JP H0236148 B2 JPH0236148 B2 JP H0236148B2 JP 58121450 A JP58121450 A JP 58121450A JP 12145083 A JP12145083 A JP 12145083A JP H0236148 B2 JPH0236148 B2 JP H0236148B2
Authority
JP
Japan
Prior art keywords
group
epoxy resin
molding
mold
mold release
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58121450A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6013841A (ja
Inventor
Yoshiji Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Silicone Co Ltd filed Critical Toray Silicone Co Ltd
Priority to JP58121450A priority Critical patent/JPS6013841A/ja
Publication of JPS6013841A publication Critical patent/JPS6013841A/ja
Publication of JPH0236148B2 publication Critical patent/JPH0236148B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58121450A 1983-07-04 1983-07-04 成形用エポキシ樹脂組成物 Granted JPS6013841A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58121450A JPS6013841A (ja) 1983-07-04 1983-07-04 成形用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58121450A JPS6013841A (ja) 1983-07-04 1983-07-04 成形用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS6013841A JPS6013841A (ja) 1985-01-24
JPH0236148B2 true JPH0236148B2 (fr) 1990-08-15

Family

ID=14811431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58121450A Granted JPS6013841A (ja) 1983-07-04 1983-07-04 成形用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS6013841A (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61101520A (ja) * 1984-10-23 1986-05-20 Toshiba Chem Corp 封止用樹脂組成物
JPS61101521A (ja) * 1984-10-23 1986-05-20 Toshiba Chem Corp 封止用樹脂組成物
JPH0723425B2 (ja) * 1986-07-14 1995-03-15 株式会社東芝 樹脂封止型半導体装置
JPS63275624A (ja) * 1987-05-08 1988-11-14 Hitachi Ltd 半導体封止用エポキシ樹脂組成物及び樹脂封止型半導体装置
JPH01215820A (ja) * 1988-02-24 1989-08-29 Hitachi Ltd 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
PH27310A (en) * 1988-05-13 1993-05-28 M & T Chemicals Inc Epoxy-aromatic polysiloxane compositions
JPH0623236B2 (ja) * 1988-05-26 1994-03-30 松下電工株式会社 エポキシ樹脂組成物
JPH0251521A (ja) * 1988-08-12 1990-02-21 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH0623237B2 (ja) * 1988-12-23 1994-03-30 松下電工株式会社 エポキシ樹脂組成物
JPH02170819A (ja) * 1988-12-23 1990-07-02 Matsushita Electric Works Ltd エポキシ樹脂組成物
JP2804360B2 (ja) * 1989-11-06 1998-09-24 日東電工株式会社 光半導体装置
DE4328466C1 (de) * 1993-08-24 1995-04-13 Siemens Ag Siloxanhaltiges Gießharzsystem
JP6327840B2 (ja) * 2013-12-04 2018-05-23 Ｊｘ金属株式会社 熱硬化性樹脂と離型剤とを含む樹脂組成物
WO2020177068A1 (fr) * 2019-03-05 2020-09-10 Dow Global Technologies Llc Dispersion de polyuréthane à base d'eau et son procédé de préparation

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3926885A (en) * 1974-12-23 1975-12-16 Dow Corning Siloxane-modified epoxy resin compositions
JPS52144099A (en) * 1976-05-26 1977-12-01 Hitachi Ltd Epoxy resin compositions
JPS607753B2 (ja) * 1980-04-22 1985-02-26 ト−レ・シリコ−ン株式会社 繊維処理剤
JPS57119973A (en) * 1981-01-16 1982-07-26 Asahi Denka Kogyo Kk Composition for forming non-fogging film
JPS6011973B2 (ja) * 1981-10-21 1985-03-29 ト−レ・シリコ−ン株式会社 成形用エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS6013841A (ja) 1985-01-24

Similar Documents

Publication Publication Date Title
JPH0236148B2 (fr)
US4518631A (en) Thixotropic curable coating compositions
JPS6011973B2 (ja) 成形用エポキシ樹脂組成物
EP0201176A2 (fr) Composition à base de résines thermodurcissables
JPS6312489B2 (fr)
JPS6355532B2 (fr)
JPH08157695A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
KR930003510B1 (ko) 에폭시 수지 조성물
JPH0747622B2 (ja) エポキシ樹脂組成物及びその硬化物
JPS6248968B2 (fr)
TWI425048B (zh) 可固化環氧樹脂組合物、其固化體及其用途
JPS63226951A (ja) 樹脂封止型半導体装置
JPH03411B2 (fr)
JPH0611840B2 (ja) 液状エポキシ樹脂組成物及びその硬化物
CN119318014A (zh) 液态树脂组合物和树脂密封功率模块
JPH0346486B2 (fr)
JP2642966B2 (ja) エポキシ樹脂組成物
JPH06256364A (ja) 有機ケイ素化合物、その製法及びそれを含有する樹脂組成物
JP2710921B2 (ja) 半導体装置
JPS62128162A (ja) 半導体装置
JPS6356515A (ja) 半導体封止用エポキシ樹脂組成物
JPH0621152B2 (ja) 封止用樹脂組成物
JPH0768328B2 (ja) 硬化性エポキシ樹脂組成物及びその製造方法
JP2987179B2 (ja) 硬化性エポキシ樹脂組成物
JPS6261215B2 (fr)