JPH0242419U - - Google Patents
Info
- Publication number
- JPH0242419U JPH0242419U JP12201288U JP12201288U JPH0242419U JP H0242419 U JPH0242419 U JP H0242419U JP 12201288 U JP12201288 U JP 12201288U JP 12201288 U JP12201288 U JP 12201288U JP H0242419 U JPH0242419 U JP H0242419U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- wiring board
- printed wiring
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図及び第２図ａ乃至第２図ｃは本考案の実
施例を示し第１図は側面図、第２図ａ及び第２図
ｂは動作状態を示す側面図、第２図ｃは要部の断
面図である。第３図ａ及び第３図ｂは従来例を示
し、第３図ａは側面図、第３図ｂは要部の断面図
である。
１……安定器、１ａ，１ｂ……リード、３ａ，
３ｂ……水平折曲部、５……プリント配線基板、
６ａ，６ｂ……リード挿通穴、８ａ，８ｂ……ラ
ンド部、９……半田。
1 and 2a to 2c show an embodiment of the present invention, FIG. 1 is a side view, FIGS. 2a and 2b are side views showing the operating state, and FIG. 2c is a side view. It is a sectional view of the main part. 3a and 3b show a conventional example, with FIG. 3a being a side view and FIG. 3b being a sectional view of the main part. 1... Ballast, 1a, 1b... Lead, 3a,
3b...Horizontal bent portion, 5...Printed wiring board,
6a, 6b...Lead insertion hole, 8a, 8b...Land part, 9...Solder.
Claims (1)
挿通穴の径よりも短い水平折曲部を各リードの先
端に且つ夫々の先端部が同一向きとされるように
形成すると共に、電子部品の下端面と前記水平折
曲片上辺との間隔を略プリント配線基板の厚さに
一致させてなる電子部品のリード構造。 A horizontal bent portion shorter than the diameter of the lead insertion hole of the printed wiring board on which the electronic component is mounted is formed at the tip of each lead so that the tip ends are in the same direction, and the bottom end surface of the electronic component and A lead structure for an electronic component, in which the distance between the horizontally bent piece and the upper side substantially matches the thickness of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12201288U JPH0242419U (en) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12201288U JPH0242419U (en) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242419U true JPH0242419U (en) | 1990-03-23 |
Family
ID=31369548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12201288U Pending JPH0242419U (en) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242419U (en) |
-
1988
- 1988-09-16 JP JP12201288U patent/JPH0242419U/ja active Pending