JPH0243746A - Manufacture of photoelectric conversion element molded with transparent resin - Google Patents
Manufacture of photoelectric conversion element molded with transparent resinInfo
- Publication number
- JPH0243746A JPH0243746A JP63194904A JP19490488A JPH0243746A JP H0243746 A JPH0243746 A JP H0243746A JP 63194904 A JP63194904 A JP 63194904A JP 19490488 A JP19490488 A JP 19490488A JP H0243746 A JPH0243746 A JP H0243746A
- Authority
- JP
- Japan
- Prior art keywords
- photoelectric conversion
- conversion element
- transparent resin
- protrusion
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ホトトランジスタ等の光電変換素子とその
周辺回路とから構成された半導体集積回路素子を透明樹
脂でモールドしてパンケージとするものに関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a pancage formed by molding a semiconductor integrated circuit element composed of a photoelectric conversion element such as a phototransistor and its peripheral circuit with a transparent resin. .
第２図は従来の技術例の断面図、第３図は異る従来の技
術例の断面図である。FIG. 2 is a sectional view of a conventional technique, and FIG. 3 is a sectional view of a different conventional technique.
これらの図面において、マウント部ｌと外部リード２と
からなるリードフレーム３のマウント部１には光電変換
素子とその周辺回路とからなる半導体集積回路素子４が
装着されている。この半導体集積回路素子４は金属線５
で外部リード２に接続され、全体が透明樹脂６でモール
ドされてパンケージとなる。矢印は光線を示し、センサ
部である光電変換素子が正面から受光すべき本来の光の
ほかに様々な方向からも受光する。In these drawings, a semiconductor integrated circuit element 4 comprising a photoelectric conversion element and its peripheral circuit is mounted on a mount part 1 of a lead frame 3 comprising a mount part 1 and an external lead 2. As shown in FIG. This semiconductor integrated circuit element 4 has a metal wire 5
It is connected to an external lead 2, and the whole is molded with transparent resin 6 to form a pan cage. The arrows indicate light rays, and the photoelectric conversion element, which is the sensor section, receives light from various directions in addition to the original light that should be received from the front.
後者の従来の技術例では図示するように透明樹脂６の裏
面に黒色被膜７を施して裏面からの無駄な受光をさえぎ
っている。In the latter conventional technique, as shown in the figure, a black film 7 is applied to the back surface of the transparent resin 6 to block unnecessary light reception from the back surface.
また特に図示しないが、半導体集積回路素子を透明樹脂
でモールドし、その外表面のうち、センサ部である光電
変換素子部分に対応する受光面のみを透明で平滑にし、
その他の表面を梨地加工するものもある。梨地加工した
表面から入射する光を減少させるためである。Although not particularly shown, the semiconductor integrated circuit element is molded with transparent resin, and only the light-receiving surface corresponding to the photoelectric conversion element part, which is the sensor part, is made transparent and smooth among its outer surfaces.
Others have a satin finish on the surface. This is to reduce the amount of light that enters from the satin finished surface.
前記の従来の技術において、センサ部である光電変換素
子が正面から受光すべき本来の光取外の光は、迷光又は
乱光ともいわれて光電変換作用の感度の低下や、誤動作
をもたらすことがある。これは光電変換素子の周辺にあ
る周辺回路に光が当る時にも生じることがある。従って
前記のようにパフケージを透明樹脂でモールドするもの
は、様々な方向からの迷光又は乱光が光電変換特性の低
下や、誤動作の原因となる。そして裏面に黒色被膜を施
しても、或は受光面を透明で平滑にして他の外面を梨地
加工しても大幅な改善にならない。In the above-mentioned conventional technology, the light that is supposed to be received from the front by the photoelectric conversion element, which is the sensor section, is also called stray light or scattered light, which may reduce the sensitivity of the photoelectric conversion effect or cause malfunctions. be. This may also occur when light hits peripheral circuits around the photoelectric conversion element. Therefore, in the case where the puff cage is molded with a transparent resin as described above, stray light or scattered light from various directions causes deterioration of photoelectric conversion characteristics and malfunction. Even if a black film is applied to the back surface, or the light-receiving surface is made transparent and smooth and the other outer surfaces are treated with a satin finish, no significant improvement is achieved.
この発明の目的は、センサ部である光電変換素子の受光
面以外からの迷光や乱光を確実に防止し、光電変換特性
を向上させることにある。An object of the present invention is to reliably prevent stray light and scattered light from sources other than the light-receiving surface of a photoelectric conversion element, which is a sensor section, and to improve photoelectric conversion characteristics.
この発明は、マウント部に装着して外部リードに接続を
施した光電変換素子を透明樹脂でモールドするものにお
いて、前記光電変換素子の受光面に対応する部位の前記
透明樹脂に突起を設けてモールドし、この突起を含めて
前記透明樹脂を不透光性樹脂でモールドし、その後に前
記突起を覆う前記不透光性樹脂の部分を研削し除去して
開口部を形成するものである。In the present invention, a photoelectric conversion element mounted on a mount portion and connected to an external lead is molded with a transparent resin, in which a protrusion is provided on the transparent resin at a portion corresponding to the light receiving surface of the photoelectric conversion element. Then, the transparent resin including the protrusion is molded with an opaque resin, and then the portion of the opaque resin covering the protrusion is ground and removed to form an opening.
光電変換素子をモールドした透明樹脂６の受光面に対応
した部位は突起８を持つので、不透光性樹脂９の研削に
より容易にその部分９ａを除去して開口部ｌＯとするこ
とができ、透明樹脂６の他の部分は不透光性樹脂９で依
然層われて迷光・乱光の入射が確実に防止される。Since the portion of the transparent resin 6 molded with the photoelectric conversion element corresponding to the light-receiving surface has a protrusion 8, the portion 9a can be easily removed by grinding the non-transparent resin 9 to form the opening lO. The other parts of the transparent resin 6 are still covered with an opaque resin 9 to reliably prevent stray light and scattered light from entering.
第１図は実施例を示し、第２図と同一符号をイ・１した
ものはおよそ同一機能を持つ。すなわちマウント部１と
外部リード２とからなるリードフレーム３のマウント部
１には光′電変換素子とその周辺回路とからなる半導体
集積回路素子４が装着され、金属線５で接続後に透明樹
脂６でモールドされる。FIG. 1 shows an embodiment, and the same reference numerals as in FIG. 2 have approximately the same functions. That is, a semiconductor integrated circuit element 4 consisting of a photoelectric conversion element and its peripheral circuit is mounted on the mount part 1 of a lead frame 3 consisting of a mount part 1 and an external lead 2, and after connecting with a metal wire 5, a transparent resin 6 is attached. It is molded with.
なお、ハンプを持った素子をフレキシブルなテープにボ
ンディングするテーブアセンフ゛りの方ン去で装着する
など他の装着方法を用いてもよい。Note that other mounting methods may be used, such as mounting using a tape assembly method in which an element with a hump is bonded to a flexible tape.
さて、半導体集積回路素子４の表面は、例えばそのご（
一部が光電変換素子とされ、他の大部分が周辺回路とさ
れ、光電変換素子に対応する受光面にのみ光を照射する
ことが望ましい。そこで前記透明樹脂６の受光面に対応
する部位に突起８を形成しておき、全体を再び黒又は他
の色で着色した不透光性樹脂９でモー、ルドする。その
後に前記突起８を覆う部分の不透光性樹脂の部分９ａを
研摩又は研削して除去すると、突起８に対応した開口部
１０が形成される。Now, the surface of the semiconductor integrated circuit element 4 is, for example,
It is desirable that a part of the photoelectric conversion element be used as a photoelectric conversion element, and the other part be used as a peripheral circuit, so that light is irradiated only to the light receiving surface corresponding to the photoelectric conversion element. Therefore, a protrusion 8 is formed in a portion of the transparent resin 6 corresponding to the light-receiving surface, and the whole is molded again with an opaque resin 9 colored black or another color. Thereafter, when the portion 9a of the non-transparent resin covering the projection 8 is removed by polishing or grinding, an opening 10 corresponding to the projection 8 is formed.
この発明は、マウント部に装着して外部リードに接続を
施した光電変換素子を透明樹脂でモールドするものにお
いて、前記光電変換素子の受光面に対応する部位の前記
透明樹脂に突起を設けてモールドし、この突起を含めて
前記透明樹脂を不透光性樹脂でモールドし、その後に前
記突起を覆う前記不透光性樹脂の部分を研削し除去して
開口部を形成するようにしたので、半導体集積回路素子
は周辺回路を除くセンサ部である光電変換素子に対応し
た受光面のみから受光して、迷光又は乱光の入射が確実
に防止されるという効果があり、経済的な工程によって
感度の低下や誤動作が阻止されて光電変換特性が向上す
るという効果がある。In the present invention, a photoelectric conversion element mounted on a mount portion and connected to an external lead is molded with a transparent resin, in which a protrusion is provided on the transparent resin at a portion corresponding to the light receiving surface of the photoelectric conversion element. However, the transparent resin including the protrusion is molded with an opaque resin, and then the portion of the opaque resin covering the protrusion is ground and removed to form an opening. Semiconductor integrated circuit elements receive light only from the light-receiving surface corresponding to the photoelectric conversion element, which is the sensor part, excluding peripheral circuits, and have the effect of reliably preventing stray light or scattered light from entering. This has the effect of preventing deterioration in performance and malfunction, thereby improving photoelectric conversion characteristics.
第１図は実施例の断面図、第２図は従来の技術例の断面
図、第３図は異る従来の技術例の断面図である。
■・・・マウント部、３・・・リードフレーム、４・・
・半導体集積回路素子、６・・・透明樹脂、８・・・突
起、９・・・不透光性樹脂、１０・・・開口部。FIG. 1 is a sectional view of an embodiment, FIG. 2 is a sectional view of a conventional technique, and FIG. 3 is a sectional view of a different conventional technique. ■...Mount part, 3...Lead frame, 4...
- Semiconductor integrated circuit element, 6... Transparent resin, 8... Protrusion, 9... Opaque resin, 10... Opening.
Claims (1)
電変換素子を透明樹脂でモールドするものにおいて、前
記光電変換素子の受光面に対応する部位の前記透明樹脂
に突起を設けてモールドし、この突起を含めて前記透明
樹脂を不透光性樹脂でモールドし、その後に前記突起を
覆う前記不透光性樹脂の部分を研削し除去して開口部を
形成することを特徴とする透明樹脂でモールドした光電
変換素子の製造方法。1) In a device in which a photoelectric conversion element mounted on a mount part and connected to an external lead is molded with a transparent resin, a protrusion is provided on the transparent resin at a portion corresponding to the light receiving surface of the photoelectric conversion element and molded, A transparent resin characterized in that the transparent resin including the protrusion is molded with an opaque resin, and then a portion of the opaque resin that covers the protrusion is ground and removed to form an opening. A method for manufacturing a photoelectric conversion element molded with
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63194904A JPH0243746A (en) | 1988-08-04 | 1988-08-04 | Manufacture of photoelectric conversion element molded with transparent resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63194904A JPH0243746A (en) | 1988-08-04 | 1988-08-04 | Manufacture of photoelectric conversion element molded with transparent resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0243746A true JPH0243746A (en) | 1990-02-14 |
Family
ID=16332270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63194904A Pending JPH0243746A (en) | 1988-08-04 | 1988-08-04 | Manufacture of photoelectric conversion element molded with transparent resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0243746A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5459460A (en) * | 1992-12-11 | 1995-10-17 | Kansei Corporation | Collision warning system |
| JP2015026798A (en) * | 2013-07-25 | 2015-02-05 | 菱生精密工業股▲分▼有限公司 | Package for optical module and method for manufacturing the same |
| JP2017130585A (en) * | 2016-01-21 | 2017-07-27 | 浜松ホトニクス株式会社 | Light receiving module and optical module manufacturing method |
| JP2018511069A (en) * | 2015-02-10 | 2018-04-19 | ローベルト ボッシュ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Image recording system and automobile |
-
1988
- 1988-08-04 JP JP63194904A patent/JPH0243746A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5459460A (en) * | 1992-12-11 | 1995-10-17 | Kansei Corporation | Collision warning system |
| JP2015026798A (en) * | 2013-07-25 | 2015-02-05 | 菱生精密工業股▲分▼有限公司 | Package for optical module and method for manufacturing the same |
| JP2018511069A (en) * | 2015-02-10 | 2018-04-19 | ローベルト ボッシュ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Image recording system and automobile |
| US10321034B2 (en) | 2015-02-10 | 2019-06-11 | Robert Bosch Gmbh | Image recording system and a motor vehicle |
| JP2017130585A (en) * | 2016-01-21 | 2017-07-27 | 浜松ホトニクス株式会社 | Light receiving module and optical module manufacturing method |
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