JPH0244519Y2 - - Google Patents

Info

Publication number
JPH0244519Y2
JPH0244519Y2 JP1986119349U JP11934986U JPH0244519Y2 JP H0244519 Y2 JPH0244519 Y2 JP H0244519Y2 JP 1986119349 U JP1986119349 U JP 1986119349U JP 11934986 U JP11934986 U JP 11934986U JP H0244519 Y2 JPH0244519 Y2 JP H0244519Y2
Authority
JP
Japan
Prior art keywords
bonding wire
bonding
spool
wire
comb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986119349U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6327041U (mo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986119349U priority Critical patent/JPH0244519Y2/ja
Publication of JPS6327041U publication Critical patent/JPS6327041U/ja
Application granted granted Critical
Publication of JPH0244519Y2 publication Critical patent/JPH0244519Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Unwinding Of Filamentary Materials (AREA)
  • Wire Bonding (AREA)
JP1986119349U 1986-08-05 1986-08-05 Expired JPH0244519Y2 (mo)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986119349U JPH0244519Y2 (mo) 1986-08-05 1986-08-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986119349U JPH0244519Y2 (mo) 1986-08-05 1986-08-05

Publications (2)

Publication Number Publication Date
JPS6327041U JPS6327041U (mo) 1988-02-22
JPH0244519Y2 true JPH0244519Y2 (mo) 1990-11-27

Family

ID=31006638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986119349U Expired JPH0244519Y2 (mo) 1986-08-05 1986-08-05

Country Status (1)

Country Link
JP (1) JPH0244519Y2 (mo)

Also Published As

Publication number Publication date
JPS6327041U (mo) 1988-02-22

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