JPH0247040U - - Google Patents
Info
- Publication number
- JPH0247040U JPH0247040U JP1988125909U JP12590988U JPH0247040U JP H0247040 U JPH0247040 U JP H0247040U JP 1988125909 U JP1988125909 U JP 1988125909U JP 12590988 U JP12590988 U JP 12590988U JP H0247040 U JPH0247040 U JP H0247040U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- elastic spring
- wiring pattern
- electrode
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案による半導体素子の保持構造を
示す断面図であり、第２図は従来の半導体素子の
保持構造を示す断面図である。 １……配線基板、２……配線パターン、３……
樹脂、４……金属突起、５……電極パツド、６…
…半導体素子、９……銀ペースト、１０……絶縁
樹脂、１１……弾性バネ、２０……形状記憶合金
による弾性バネ、２１……開口部。
示す断面図であり、第２図は従来の半導体素子の
保持構造を示す断面図である。 １……配線基板、２……配線パターン、３……
樹脂、４……金属突起、５……電極パツド、６…
…半導体素子、９……銀ペースト、１０……絶縁
樹脂、１１……弾性バネ、２０……形状記憶合金
による弾性バネ、２１……開口部。
Claims (1)
- 電極上に金属突起を有する半導体素子と、前記
電極と相対する配線パターンを有する基板と、前
記半導体素子の前記金属突起形成面とは逆の面と
、前記基板の前記配線パターン形成面とは逆の面
とを挾持する弾性バネから成る半導体素子の保持
構造において、前記弾性バネは、形状記憶合金で
あることを特徴とする半導体素子の保持構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125909U JPH0247040U (ja) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125909U JPH0247040U (ja) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247040U true JPH0247040U (ja) | 1990-03-30 |
Family
ID=31376933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988125909U Pending JPH0247040U (ja) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247040U (ja) |
-
1988
- 1988-09-27 JP JP1988125909U patent/JPH0247040U/ja active Pending