JPH024887A - Adhesive composition - Google Patents
Adhesive compositionInfo
- Publication number
- JPH024887A JPH024887A JP15424088A JP15424088A JPH024887A JP H024887 A JPH024887 A JP H024887A JP 15424088 A JP15424088 A JP 15424088A JP 15424088 A JP15424088 A JP 15424088A JP H024887 A JPH024887 A JP H024887A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat resistance
- composition
- adhesive composition
- dicyandiamide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 36
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 36
- 239000000203 mixture Substances 0.000 title claims abstract description 22
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920003986 novolac Polymers 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 11
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 4
- 239000001257 hydrogen Substances 0.000 claims abstract description 4
- 239000011888 foil Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000011342 resin composition Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000009477 glass transition Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） この発明は、接着剤組成物に関するものである。[Detailed description of the invention] (Industrial application field) TECHNICAL FIELD This invention relates to adhesive compositions.
さらに詳しくは、この発明は耐熱性に優れているととも
に、高温時の接着力をも向上させることのできる積層板
金属箔接着用の接着剤組成物に関するものである。More specifically, the present invention relates to an adhesive composition for bonding metal foils to laminated plates, which has excellent heat resistance and can also improve adhesive strength at high temperatures.
（従来の技術）
近手、プリント配線板に用いる金属箔積層板について、
金属箔の高温接着性能の向上が要請されており、この接
着のための接着剤の耐熱性の向上のたｙ）に、エポキシ
樹脂を主剤としたものが広く用いられてきている。(Prior art) Regarding metal foil laminates used for printed wiring boards,
There is a demand for improvement in the high-temperature adhesion performance of metal foils, and in order to improve the heat resistance of adhesives for this adhesion, adhesives based on epoxy resins have been widely used.
このような接着剤として、たとえば、エポキシ樹脂に、
芳香族アミンまたはジアミン等の硬化剤や硬化助剤を配
合したものが知られている。Such adhesives, for example, epoxy resin,
Products containing curing agents and curing aids such as aromatic amines or diamines are known.
（発明が解決しようとする課題）
しかしながら、これらの従来のエポキシ樹脂を主剤とす
る金属箔接着用の接着剤の場合には、般に耐熱性の向上
の効果は不充分であり、高温時の金属箔接着力もビール
強度（１５０’Ｃ）でたかだか０．３〜０．４ ｋｇ
／ ｃＩｏ程度と満足できるものではなかった。しかも
これまでのものは室温（常態）での接着力も充分ではな
いという欠点があった。(Problems to be Solved by the Invention) However, in the case of these conventional adhesives for bonding metal foils based on epoxy resins, the effect of improving heat resistance is generally insufficient, and Metal foil adhesive strength is at most 0.3-0.4 kg at beer strength (150'C)
/ cIo, which was not satisfactory. Moreover, the conventional products had the disadvantage that the adhesive strength at room temperature (normal state) was not sufficient.
このため、このような欠点を早急に解決することが望ま
れていた。Therefore, it has been desired to solve these drawbacks as soon as possible.
この発明は、以上の通りの事情に鑑みてなされたもので
あり、従来の金属箔接着用の接着剤の欠点を解消し、耐
熱性に優れるとともに、高温時の金属箔の接着力をも向
上させることのできる新しい積１ａ板金属箔接着用の接
着剤組成物を提供することを目的としている。This invention was made in view of the above circumstances, and it eliminates the drawbacks of conventional adhesives for bonding metal foils, has excellent heat resistance, and improves the adhesive strength of metal foils at high temperatures. The object of the present invention is to provide a new adhesive composition for adhering laminated laminated metal foils.
（課題を解決するための手段）
この発明は、上記の課題を解決するために、ブチラール
樹脂とエポキシ樹脂を含有する樹脂組成物に、フェノー
ルノボラック樹脂オリゴマーおよびジシアンジアミドを
配合してなることを特徴とする積層板金属箔接着用の接
着剤組成物を提供するものである。(Means for Solving the Problems) In order to solve the above problems, the present invention is characterized in that a phenol novolak resin oligomer and dicyandiamide are blended into a resin composition containing a butyral resin and an epoxy resin. The present invention provides an adhesive composition for bonding metal foil laminates.
ブチラール樹脂およびエポキシ樹脂については。For butyral and epoxy resins.
その種類に格別の限定はなく、従来公知のものをはじめ
として任意のものを使用することかできる。There is no particular limitation on the type, and any type can be used, including conventionally known types.
たとえばエポキシ樹脂としては、フェノール、クレゾー
ル、ビスフェノールＡ等のフェノール頚のノボラック型
のもの、特にタレゾールノホラックをのものを好適なも
のとして例示することができる。For example, suitable examples of epoxy resins include phenol-necked novolacs such as phenol, cresol, and bisphenol A, particularly talesol novolak.
ブチラール樹脂とエポキシ樹脂との配合割合は、広い範
囲のものとすることができるが、−船釣には、エポキシ
樹脂１００重量部に対して２０〜６０、特に３０〜５０
部用いるのか好ましい。あまり多すぎると高温時の接着
力は低下し、また少なずぎると常態での接着力が低下す
るので好ましくない。The blending ratio of butyral resin and epoxy resin can be within a wide range, but - for boat fishing, 20 to 60, especially 30 to 50
It is preferable to use part. If the amount is too large, the adhesive strength at high temperatures will decrease, and if it is too small, the adhesive strength at normal conditions will decrease, which is not preferable.
硬化剤成分として配合するフェノールノボラック樹脂オ
リゴマーとしては、その分７′量（Ｍｎ）が１０００〜
３０００、より好ましくは１５００〜２５００程度のも
のを用いる。The phenol novolak resin oligomer blended as a curing agent component has a 7' amount (Mn) of 1000 to
3,000, more preferably about 1,500 to 2,500.
これらのフェノールノボラック樹脂オリゴマーとジシア
ンジアミドの水酸基当量と活性水素当量との比は１７１
〜４／１、より好ましくは２７１〜３／１の範囲とし、
また、これらの全当量はエポキシ当量に対して１１０．
８〜１／１ とすることが好ましい。The ratio of the hydroxyl equivalent to the active hydrogen equivalent of these phenol novolac resin oligomers and dicyandiamide is 171.
-4/1, more preferably in the range of 271-3/1,
In addition, the total equivalent weight of these is 110% relative to the epoxy equivalent weight.
It is preferable to set it as 8-1/1.
もちろん、これらは特に限定的なものではなく、使用す
るオリゴマーの種類やエポキシ樹脂等によって適宜に変
更することができる。Of course, these are not particularly limited, and can be changed as appropriate depending on the type of oligomer used, epoxy resin, etc.
以上の成分を配合する接着剤組成物は、溶剤として所定
量のメチルエチルケトン、トルエン、メタノール等を用
いて樹脂液とする。この場合の樹脂液の粘度は、通常は
５００〜１５００ ｃｐｓ （２５°Ｃ）程度とするの
が好ましい。The adhesive composition containing the above components is made into a resin liquid using a predetermined amount of methyl ethyl ketone, toluene, methanol, etc. as a solvent. In this case, the viscosity of the resin liquid is usually preferably about 500 to 1500 cps (25°C).
積層板への金属箔の接着は、この樹脂液を、たとえは１
５〜４５μｍ程度の厚さで胴、アルミニウム、鉄等の金
属箔に塗布し、１４０〜１６０°Ｃの温度で２〜６分程
度乾燥させた後に行う、塗布樹脂凰は、一般に銅箔の場
合には２０〜５０ｇ／ｃｄ、より好ましくは３０〜４０
ｇ／−となるように調整する。To adhere the metal foil to the laminate, use this resin liquid, for example 1
Generally, when using copper foil, coating resin is applied to the body, aluminum, iron, or other metal foil to a thickness of about 5 to 45 μm, and is dried at a temperature of 140 to 160°C for about 2 to 6 minutes. 20 to 50 g/cd, more preferably 30 to 40
Adjust so that it becomes g/-.
これを通常の方法で、ガラスクロス、ガラスマント、紙
等の基材にフェノール樹脂、エポキシ樹脂、ポリアミド
樹脂、不飽和ポリエステル樹脂等の樹脂を含浸させた樹
脂含浸基材積層板に載せて加熱、加圧して接着する。通
常は１５０〜１８０℃程度の温度において、２０〜８０
ｋｇ／−の圧力で加バする。This is heated by placing it on a resin-impregnated base material laminate made by impregnating a base material such as glass cloth, glass cloak, or paper with a resin such as phenol resin, epoxy resin, polyamide resin, or unsaturated polyester resin using the usual method. Press and adhere. Usually at a temperature of about 150 to 180℃, 20 to 80℃
Apply pressure at kg/-.
（作 用）
この発明の接着剤組成物においては、ブチラール樹脂、
フェノールノボラック樹脂オリゴマーおよびジシアンジ
アミドを配合することにより、耐熱性（ハンダ耐熱性）
を、従来品の２５〜３５ｓｅｃを４０ｓｅｃ以上にまで
向上させ、また′Ｉ゛ も大幅に向上させる。(Function) In the adhesive composition of the present invention, butyral resin,
Heat resistance (soldering heat resistance) is achieved by blending phenol novolac resin oligomer and dicyandiamide.
It improves the time from 25 to 35 seconds of conventional products to more than 40 seconds, and also significantly improves 'I'.
：５温時の接着力も従来品の２倍以上に向上させ、しか
も常態での接着力も良好なものとする。: The adhesive strength at 5 temperatures is more than twice that of conventional products, and the adhesive strength under normal conditions is also good.
（実施例）
次に実施例を示し、さらに詳しくこの発明の接着剤組成
物について説明する。(Example) Next, Examples will be shown and the adhesive composition of the present invention will be explained in more detail.
実施例 １ 次の配合からなる接着剤組成物を作製した。Example 1 An adhesive composition having the following formulation was prepared.
（１）ブチラール樹脂
（電気化学工業社製： ６０００ｃ ） ４０（（＋
）（２）エポキシ樹脂 １００（タ
レゾールノボラック型：
京都化成社製：ＹＤＣＮ−７０４）
（３）フェノールノボラック
樹脂オリゴマー ３７．８
（三菱油化社製： Ｒｅ５ｉｎ −Ｘ ）（４）ジシア
ンジアミド ２，２溶剤を加えて粘度
７００ｃｐｓ （２５°Ｃ）とした樹脂液をｊＦｌ箔に
塗布し、１５０℃で３分間乾燥させた。塗布樹脂１に３
０ｇ／−で紙フェノールレジンベーノく−に載せて加熱
、加圧して銅張積層板を得た。(1) Butyral resin (manufactured by Denki Kagaku Kogyo Co., Ltd.: 6000c) 40 ((+
) (2) Epoxy resin 100 (Talesol novolak type: Kyoto Kasei Co., Ltd.: YDCN-704) (3) Phenol novolac resin oligomer 37.8 (Mitsubishi Yuka Co., Ltd.: Re5in-X) (4) Dicyandiamide 2,2 A resin solution made to a viscosity of 700 cps (25°C) by adding a solvent was applied to the jFl foil and dried at 150°C for 3 minutes. Coating resin 1 to 3
It was placed on a paper phenol resin tray at 0 g/- and heated and pressurized to obtain a copper-clad laminate.
この積層板について耐熱性、接着力を評価した６その結
果を表１に示した。ハンダ耐熱性は４５〜４８ｓｅｃと
従来品（２５〜３５ｓｅｃ）を大きく上まわり、高温（
１５０℃）時の接着力も０．５３〜０．６４に！ｒ／
ａｎと従来の約２倍に向上している。Ｔ８も１１９℃と
、従来の７５〜９５°Ｃを大きく上まわっている。また
、常態での接着力も良好である。The heat resistance and adhesive strength of this laminate were evaluated6 and the results are shown in Table 1. The solder heat resistance is 45 to 48 seconds, which is much higher than conventional products (25 to 35 seconds), and it can withstand high temperatures (
Adhesion strength at 150℃) is also 0.53 to 0.64! r/
an, an improvement of about twice that of the conventional method. T8 is also 119°C, which is much higher than the conventional 75-95°C. Furthermore, the adhesive strength under normal conditions is also good.
実施例 ２
ブチラール樹脂の配合量を５０ｇとした以外は実施例１
と同様にして接着剤樹脂組成物を作製し、Ｍ：Ｉ箔の接
着に使用した。Example 2 Example 1 except that the amount of butyral resin was 50g.
An adhesive resin composition was prepared in the same manner as above and used for bonding M:I foil.
表１に示した通り、高温（１５０°Ｃ）時の接着力は０
．４２〜０．４６ｋＫ／ ａｎとなり、耐熱性は４７〜
５２ｓｅｃ 、’ｔ’ は１１０℃であった。As shown in Table 1, the adhesive strength at high temperature (150°C) is 0.
．． 42~0.46kK/an, heat resistance is 47~
52 sec, 't' was 110°C.
実施例 ３
フェノールノボラック樹脂オリゴマーの配合量を３３．
６ｇとした以外は実施例１と同様にしてｊＦＩ箔の接着
を行った。Example 3 The blending amount of phenol novolac resin oligomer was 33.
The jFI foil was bonded in the same manner as in Example 1 except that the weight was 6 g.
表１に示した通り高温（１５０°Ｃ）時の接着力は、０
．４９へ・０．５５ｂぎ／（２）であった。耐熱性は４
０〜４６ＳＱＣ，Ｔ は１１２°Ｃであった。As shown in Table 1, the adhesive strength at high temperature (150°C) is 0.
．． It was 0.55b/(2) to 49. Heat resistance is 4
0-46SQC, T was 112°C.
実施例 ４
ブチラール樹脂配合証を２０ｇとした以外は実施例１と
同様にして銅箔の接着を行った。この場合の性能につい
ても評価した。高温（１５０’Ｃ）時の接着力は０．５
５〜０．６７に７／ａＩｌであり、耐熱性も良好であっ
た。ただし、常態での接着力のわずかの低下が認められ
た。Example 4 Copper foil was bonded in the same manner as in Example 1 except that the amount of butyral resin was 20 g. Performance in this case was also evaluated. Adhesion strength at high temperature (150'C) is 0.5
It was 7/aIl in the range of 5 to 0.67, and the heat resistance was also good. However, a slight decrease in adhesive strength under normal conditions was observed.
比較例 １
ジシアンジアミドを配合しないで実施例２と同様にして
′Ｍ箔の接着を行った。この場合、高温（１５０℃）時
の接着力は０．２５〜０．３５ｈｇ／個と実施例のもの
をはるかに下まわり、耐熱性も３０〜３４ ｓｅｃと不
充分なものであった。Comparative Example 1 Adhesion of 'M foil was carried out in the same manner as in Example 2 without adding dicyandiamide. In this case, the adhesive strength at high temperature (150° C.) was 0.25 to 0.35 hg/piece, which was far lower than that of the example, and the heat resistance was also insufficient, at 30 to 34 sec.
表１
比Ｉ貯量 ２
フェノールノボラック樹脂オリゴマーを配合しないで実
施例２と同様にして銅箔の接着を行った。Table 1 Specific I storage amount 2 Copper foil was bonded in the same manner as in Example 2 without blending the phenol novolac resin oligomer.
耐熱性は３４〜４０ ｓｅｃであったが、高温時（１５
０°Ｃ）の接着力は０．２２〜０．３２ｋｇ ／ ＣＩ
＋にしかずぎなかった。The heat resistance was 34 to 40 seconds, but at high temperatures (15
Adhesion strength at 0°C is 0.22-0.32kg/CI
It was only ＋.
比較例 ３
ジシアンジアミドを添加せずに５．２ｇのジアミノジフ
ェニルメタンを配合し、実施例２と同様にしてｊ’ＰＩ
箔の接着を行ったところ、窩温（１５０°Ｃ）時の接着
力は、０．２１〜０．２（ｉｋｇ／ａｍにしかすぎなか
った。またハンダ耐熱性（２６０°Ｃ）は３０〜３８Ｓ
Ｑｃテ１’）、Ｔ４１８７°Ｃであった。Comparative Example 3 j'PI was prepared in the same manner as in Example 2 by blending 5.2 g of diaminodiphenylmethane without adding dicyandiamide.
When the foil was bonded, the adhesive strength at the cavity temperature (150°C) was only 0.21-0.2 (ikg/am).The solder heat resistance (260°C) was 30-0. 38S
QcTe1'), T4187°C.
（発明の効果）
この発明により、耐熱性が４０〜５０ｓｅｃ（ハンダ耐
熱性：２６０°Ｃ）と優れ、′ｒ は従来の７５〜９５
°Ｃを上まわり、かつ高温度の接着力が、たとえば０．
６〜０．８ｋｇ／■（１５０℃；銅箔ピール強囃）とｆ
ｔ来品の２ｆ＆以上に向上する金属箔接着用の接着剤組
成物か得られる。また、この組成物は、室温
（常Ｂ）
での接着力も良好である。(Effect of the invention) This invention has excellent heat resistance of 40 to 50 seconds (soldering heat resistance: 260°C), and 'r is 75 to 95
If the adhesion force at high temperatures is above °C, for example 0.
6 to 0.8 kg/■ (150℃; copper foil peel strength) and f
An adhesive composition for adhering metal foil is obtained which has an improved adhesiveness of 2F& or higher than that of conventional products. This composition also has good adhesive strength at room temperature (normal B).
Claims (4)
成物にフェノールノボラック樹脂オリゴマーおよびジシ
アンジアミドを配合してなることを特徴とする積層板金
属箔接着用の接着剤組成物。(1) An adhesive composition for bonding metal foils to laminated plates, which is made by blending a phenol novolac resin oligomer and dicyandiamide into a resin composition containing a butyral resin and an epoxy resin.
脂３０〜５０部を含有する請求項（１）記載の接着剤組
成物。(2) The adhesive composition according to claim 1, which contains 30 to 50 parts of butyral resin per 100 parts by weight of epoxy resin.
ジアミドを、水酸基当量と活性水素当量の比が２／１〜
３／１で配合する請求項（１）記載の接着剤組成物。(3) The phenol novolak resin oligomer and dicyandiamide have a ratio of hydroxyl group equivalent to active hydrogen equivalent of 2/1 to
The adhesive composition according to claim (1), which is blended at a ratio of 3/1.
して１／０．８〜１／１で配合する請求項（１）記載の
接着剤組成物。(4) The adhesive composition according to claim 1, wherein the hydroxyl equivalent and the active hydrogen equivalent are blended in a ratio of 1/0.8 to 1/1 to the epoxy equivalent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63154240A JP2594323B2 (en) | 1988-06-22 | 1988-06-22 | Adhesive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63154240A JP2594323B2 (en) | 1988-06-22 | 1988-06-22 | Adhesive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH024887A true JPH024887A (en) | 1990-01-09 |
| JP2594323B2 JP2594323B2 (en) | 1997-03-26 |
Family
ID=15579904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63154240A Expired - Lifetime JP2594323B2 (en) | 1988-06-22 | 1988-06-22 | Adhesive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2594323B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5173596A (en) * | 1991-03-07 | 1992-12-22 | General Instrument Corporation | Paper card reader/validator |
-
1988
- 1988-06-22 JP JP63154240A patent/JP2594323B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5173596A (en) * | 1991-03-07 | 1992-12-22 | General Instrument Corporation | Paper card reader/validator |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2594323B2 (en) | 1997-03-26 |
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