JPH0252453U - - Google Patents
Info
- Publication number
- JPH0252453U JPH0252453U JP13293188U JP13293188U JPH0252453U JP H0252453 U JPH0252453 U JP H0252453U JP 13293188 U JP13293188 U JP 13293188U JP 13293188 U JP13293188 U JP 13293188U JP H0252453 U JPH0252453 U JP H0252453U
- Authority
- JP
- Japan
- Prior art keywords
- pad electrode
- tip
- container
- semiconductor device
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は本考案の半導体装置用パツケージの実装状態
を示す部分斜視図、第３図は従来の半導体装置用
のリードフレームを示す平面図である。
１……容器、２……パツド電極、３……金属配
線、４……リード、５……半導体チツプ、６……
内部配線、８……鈎ピン、９……アイランド、１
０……内部リード、１１……リードフレーム。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a partial perspective view showing the mounting state of the package for a semiconductor device of the present invention, and FIG. 3 is a plan view showing a conventional lead frame for a semiconductor device. 1... Container, 2... Pad electrode, 3... Metal wiring, 4... Lead, 5... Semiconductor chip, 6...
Internal wiring, 8...Hook pin, 9...Island, 1
0...Internal lead, 11...Lead frame.
Claims (1)
積を有する絶縁性容器と、前記容器の外側面に設
けたパツト電極と、前記パツド電極に接続して前
記容器の側面から上端に延在し且つ容器の上端か
ら内側へ向けてコイル状に巻いた先端を有する金
属配線と、前記パツド電極に内部リードの先端部
を接続したリードフレームとを有することを特徴
とする半導体装置用パツケージ。 an insulating container having a volume capable of accommodating just enough semiconductor chips inside; a pad electrode provided on the outer surface of the container; 1. A package for a semiconductor device, comprising: a metal wiring having a tip wound in a coil shape from the upper end toward the inside; and a lead frame having the tip of an internal lead connected to the pad electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13293188U JPH0252453U (en) | 1988-10-11 | 1988-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13293188U JPH0252453U (en) | 1988-10-11 | 1988-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252453U true JPH0252453U (en) | 1990-04-16 |
Family
ID=31390345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13293188U Pending JPH0252453U (en) | 1988-10-11 | 1988-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252453U (en) |
-
1988
- 1988-10-11 JP JP13293188U patent/JPH0252453U/ja active Pending