JPH02759U - - Google Patents

Info

Publication number
JPH02759U
JPH02759U JP1988077211U JP7721188U JPH02759U JP H02759 U JPH02759 U JP H02759U JP 1988077211 U JP1988077211 U JP 1988077211U JP 7721188 U JP7721188 U JP 7721188U JP H02759 U JPH02759 U JP H02759U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor chip
stem
bonded
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988077211U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988077211U priority Critical patent/JPH02759U/ja
Publication of JPH02759U publication Critical patent/JPH02759U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5438—Dispositions of bond wires the bond wires having multiple connections on the same bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Description

【図面の簡単な説明】
第１図は本考案の半導体チツプの実装の一実施
例の正面図、第２図はその平面図、第３図は従来
の半導体チツプの実装構造の一例の正面図、第４
図はその平面図である。 図において、１はレーザダイオードチツプ、２
はヒートシンク、４はロウ材、１０はステム、１
１は凹部、１１ａ，１１ｂは斜面、を示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体チツプ１がヒートシンク２の上面に実装
    されてステム１０に接着された構造において、 上記ステム１０に上記ヒートシンクに対応した
    大きさの凹部１１を設け、 上記ヒートシンク２が上記凹部１１内に埋め込
    まれた状態でその底面２ａ及び側面２ｂ，２ｃ，
    ２ｄを接着されてなる構成の半導体チツプの実装
    構造。
JP1988077211U 1988-06-10 1988-06-10 Pending JPH02759U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988077211U JPH02759U (ja) 1988-06-10 1988-06-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988077211U JPH02759U (ja) 1988-06-10 1988-06-10

Publications (1)

Publication Number Publication Date
JPH02759U true JPH02759U (ja) 1990-01-05

Family

ID=31302206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988077211U Pending JPH02759U (ja) 1988-06-10 1988-06-10

Country Status (1)

Country Link
JP (1) JPH02759U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007048839A (ja) * 2005-08-08 2007-02-22 Mitsubishi Electric Corp 半導体素子

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149467B2 (ja) * 1978-01-30 1986-10-29 Nat House Ind

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6149467B2 (ja) * 1978-01-30 1986-10-29 Nat House Ind

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007048839A (ja) * 2005-08-08 2007-02-22 Mitsubishi Electric Corp 半導体素子

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