JPH028031U - - Google Patents
Info
- Publication number
- JPH028031U JPH028031U JP8374788U JP8374788U JPH028031U JP H028031 U JPH028031 U JP H028031U JP 8374788 U JP8374788 U JP 8374788U JP 8374788 U JP8374788 U JP 8374788U JP H028031 U JPH028031 U JP H028031U
- Authority
- JP
- Japan
- Prior art keywords
- section
- pulling
- transfer mechanism
- input section
- treatment tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 4
- 238000005187 foaming Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000008367 deionised water Substances 0.000 claims 3
- 229910021641 deionized water Inorganic materials 0.000 claims 3
- 235000012431 wafers Nutrition 0.000 claims 3
- 230000005587 bubbling Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
Description
第１図は、ウエツト処理装置内に配置された本
考案の洗浄装置の側断面概略図、第２図は、同平
断面概略図、第３図は、従来の洗浄装置を設けた
ウエツト処理装置の一部を示す概略構成図である
。
１……洗浄装置、２……純水処理槽、２ａ……
投入部、２ｂ……引上げ部、６……仕切板、９…
…移送機構、１０，１１……排水弁、１２，１３
……給水弁、１４……発泡治具、Ｃ……ウエハキ
ヤリヤ、Ｗ……半導体ウエハ。
Fig. 1 is a schematic side sectional view of the cleaning device of the present invention disposed in a wet processing device, Fig. 2 is a schematic horizontal sectional view of the same, and Fig. 3 is a wet processing device equipped with a conventional cleaning device. FIG. 2 is a schematic configuration diagram showing a part of. 1...Cleaning device, 2...Pure water treatment tank, 2a...
Input part, 2b... Pulling part, 6... Partition plate, 9...
... Transfer mechanism, 10, 11 ... Drain valve, 12, 13
...Water supply valve, 14...Foaming jig, C...Wafer carrier, W...Semiconductor wafer.
Claims (1)
げ部とを備えた純水処理槽の底部に移送機構を設
けて成り、前記投入部へ投入された半導体ウエハ
入りのウエハキヤリヤを、前記移送機構により純
水中を前記引上げ部へ移送する洗浄装置において
、 前記投入部と引上げ部とを仕切る仕切板を前記
純水処理槽に対して挿脱可能に設け、 前記投入部の底部に排水弁と発泡治具を設ける
とともに、該投入部の下部に給水弁を設け、 且つ前記引上げ部の底部に排水弁を設けるとと
もに、該引上げ部の下部に給水弁を設け、 前記仕切板により前記投入部と引上げ部とを仕
切つた状態で、該投入部へウエハキヤリヤを投入
して、該投入部で給水オーバーフロー、バブリン
グ、排水を繰返すことを特徴とするウエツト処理
装置における洗浄装置。[Claims for Utility Model Registration] A transfer mechanism is provided at the bottom of a deionized water treatment tank, which is disposed in a wet processing apparatus and is equipped with an input section and a lifting section, and a transfer mechanism is provided at the bottom of the deionized water treatment tank, which is provided with a transfer mechanism for transferring semiconductor wafers introduced into the input section. In the cleaning device for transferring pure water to the pulling section using the transfer mechanism of the wafer carrier, a partition plate that partitions the loading section and the pulling section is provided to be removably inserted into the deionized water treatment tank, and the loading section is connected to the loading section. a drain valve and a foaming jig are provided at the bottom of the partition, a water supply valve is provided at the bottom of the input section, a drain valve is provided at the bottom of the pulling section, and a water supply valve is provided at the bottom of the pulling section; A cleaning device for a wet processing apparatus, characterized in that a wafer carrier is introduced into the input section with the input section and the pulling section separated by a plate, and water supply overflow, bubbling, and drainage are repeated in the input section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8374788U JPH028031U (en) | 1988-06-24 | 1988-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8374788U JPH028031U (en) | 1988-06-24 | 1988-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028031U true JPH028031U (en) | 1990-01-18 |
Family
ID=31308458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8374788U Pending JPH028031U (en) | 1988-06-24 | 1988-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028031U (en) |
-
1988
- 1988-06-24 JP JP8374788U patent/JPH028031U/ja active Pending