JPH03104749U - - Google Patents

Info

Publication number
JPH03104749U
JPH03104749U JP1312790U JP1312790U JPH03104749U JP H03104749 U JPH03104749 U JP H03104749U JP 1312790 U JP1312790 U JP 1312790U JP 1312790 U JP1312790 U JP 1312790U JP H03104749 U JPH03104749 U JP H03104749U
Authority
JP
Japan
Prior art keywords
semiconductor element
resin
semiconductor device
sealed
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1312790U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1312790U priority Critical patent/JPH03104749U/ja
Publication of JPH03104749U publication Critical patent/JPH03104749U/ja
Pending legal-status Critical Current

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第1図は本考案の実施例を示す樹脂封止型半導
体装置の断面図、第2図は従来の樹脂封止型半導
体装置の断面図、第3図は他の従来の樹脂封止型
半導体装置の断面図、第4図は従来の樹脂封止型
半導体装置の水分浸入経路の説明図である。 1……COB基板、2……半導体素子、3……
電極、4……外部リード線、5……ボンデイング
線、6……ポツテイング樹脂、7……シール枠、
8……金属キヤツプ、9……水分トラツプ部。

Claims (1)

  1. 【実用新案登録請求の範囲】 基板上に搭載されダイボンデイングされた半導
    体素子と、該半導体素子の電極にワイヤボンデイ
    ングにより結ばれた外部リード線と、該半導体素
    子のボンデイング部分を封止したポツテイング樹
    脂を有する樹脂封止型半導体装置において、 基板の半導体素子搭載部周囲に半導体素子と接
    触して半導体素子高さより低い厚みで高分子製水
    吸収材からなる水分トラツプ部を設けたことを特
    徴とする樹脂封止型半導体装置。
JP1312790U 1990-02-15 1990-02-15 Pending JPH03104749U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1312790U JPH03104749U (ja) 1990-02-15 1990-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1312790U JPH03104749U (ja) 1990-02-15 1990-02-15

Publications (1)

Publication Number Publication Date
JPH03104749U true JPH03104749U (ja) 1991-10-30

Family

ID=31516561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1312790U Pending JPH03104749U (ja) 1990-02-15 1990-02-15

Country Status (1)

Country Link
JP (1) JPH03104749U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007209974A (ja) * 2006-01-13 2007-08-23 Sanwa Seisakusho:Kk 気体清浄器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007209974A (ja) * 2006-01-13 2007-08-23 Sanwa Seisakusho:Kk 気体清浄器

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