JPH03106779U - - Google Patents

Info

Publication number
JPH03106779U
JPH03106779U JP1559590U JP1559590U JPH03106779U JP H03106779 U JPH03106779 U JP H03106779U JP 1559590 U JP1559590 U JP 1559590U JP 1559590 U JP1559590 U JP 1559590U JP H03106779 U JPH03106779 U JP H03106779U
Authority
JP
Japan
Prior art keywords
board
metal layer
hole
printed circuit
solder land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1559590U
Other languages
English (en)
Other versions
JP2510576Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990015595U priority Critical patent/JP2510576Y2/ja
Publication of JPH03106779U publication Critical patent/JPH03106779U/ja
Application granted granted Critical
Publication of JP2510576Y2 publication Critical patent/JP2510576Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は一実施例による本考案のプリント配線
基板の部分拡大平面図、第２図は第１図の−
線矢視断面図、第３図は第１図のＡ部を一途破断
して示した斜視図、第４図〜第５図は本考案のソ
ルダーランドの変形例を示す部分平面図、第６図
は従来のプリント配線基板の部分拡大平面図、第
７図は第６図の−線断面図である。 １……基板、２……金属層、４……マスキング
層、８，９……貫通穴、１０，１２……ソルダー
ランド、１８……切欠き部、２０……帯状部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板上の金属層を蝕刻して形成するプリント回
    路に、このプリント回路と前記基板外の回路とを
    結ぶ接続子をろう付けするソルダーランドを設け
    、このソルダーランドは、前記基板を貫通して前
    記接続子を挿通する貫通穴と、この貫通穴の周囲
    を囲み前記プリント回路に連通する金属層とから
    成り、この金属層に、前記貫通穴の縁に沿つて金
    属層を除去した切欠き部を設け、この切欠き部と
    、この切欠き部と前記ソルダーランドの外側とを
    結び帯状にマスキング層を形成したプリント配線
    基板。
JP1990015595U 1990-02-21 1990-02-21 プリント配線基板 Expired - Fee Related JP2510576Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990015595U JP2510576Y2 (ja) 1990-02-21 1990-02-21 プリント配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990015595U JP2510576Y2 (ja) 1990-02-21 1990-02-21 プリント配線基板

Publications (2)

Publication Number Publication Date
JPH03106779U true JPH03106779U (ja) 1991-11-05
JP2510576Y2 JP2510576Y2 (ja) 1996-09-11

Family

ID=31518893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990015595U Expired - Fee Related JP2510576Y2 (ja) 1990-02-21 1990-02-21 プリント配線基板

Country Status (1)

Country Link
JP (1) JP2510576Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54113050U (ja) * 1978-01-30 1979-08-08
JPS60141169U (ja) * 1984-02-28 1985-09-18 三洋電機株式会社 印刷配線基板
JPH0197579U (ja) * 1987-12-21 1989-06-29

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54113050U (ja) * 1978-01-30 1979-08-08
JPS60141169U (ja) * 1984-02-28 1985-09-18 三洋電機株式会社 印刷配線基板
JPH0197579U (ja) * 1987-12-21 1989-06-29

Also Published As

Publication number Publication date
JP2510576Y2 (ja) 1996-09-11

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees