JPH03150392A - 金属被覆ポリイミド複合物の調製方法 - Google Patents

金属被覆ポリイミド複合物の調製方法

Info

Publication number
JPH03150392A
JPH03150392A JP2233473A JP23347390A JPH03150392A JP H03150392 A JPH03150392 A JP H03150392A JP 2233473 A JP2233473 A JP 2233473A JP 23347390 A JP23347390 A JP 23347390A JP H03150392 A JPH03150392 A JP H03150392A
Authority
JP
Japan
Prior art keywords
polyimide
metal layer
metal
organic
per liter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2233473A
Other languages
English (en)
Japanese (ja)
Inventor
Donald Franklin Foust
ドナルド・フランクリン・フォースト
Lewis Andrew Bernstein
ルイス・アンドリュー・バーンスタイン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPH03150392A publication Critical patent/JPH03150392A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP2233473A 1989-09-05 1990-09-05 金属被覆ポリイミド複合物の調製方法 Pending JPH03150392A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40237289A 1989-09-05 1989-09-05
US402,372 1989-09-05

Publications (1)

Publication Number Publication Date
JPH03150392A true JPH03150392A (ja) 1991-06-26

Family

ID=23591610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2233473A Pending JPH03150392A (ja) 1989-09-05 1990-09-05 金属被覆ポリイミド複合物の調製方法

Country Status (4)

Country Link
EP (1) EP0419845A3 (fr)
JP (1) JPH03150392A (fr)
KR (1) KR910006008A (fr)
BR (1) BR9004392A (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002050868A (ja) * 1999-08-06 2002-02-15 Ibiden Co Ltd 多層プリント配線板の製造方法
US6537411B1 (en) 1999-06-29 2003-03-25 The National University Of Singapore Method for low temperature lamination of metals to polyimides
JP2005154864A (ja) * 2003-11-27 2005-06-16 Kakihara Kogyo Kk 樹脂製筐体の高剛性・高硬度めっき方法
US7812262B2 (en) 1999-08-06 2010-10-12 Ibiden Co., Ltd. Multilayer printed circuit board
JP2013159784A (ja) * 2012-02-01 2013-08-19 Toyota Motor Corp めっき処理材の製造方法およびめっき処理材

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19624071A1 (de) * 1996-06-17 1997-12-18 Bayer Ag Verfahren zur Herstellung von bahnförmigen metallbeschichteten Folien
EP1069210A1 (fr) * 1999-07-12 2001-01-17 Applied Materials, Inc. Procédé pour le dépot électrochimique de structures ayant un rapport de forme élevé
US6406609B1 (en) * 2000-02-25 2002-06-18 Agere Systems Guardian Corp. Method of fabricating an integrated circuit
US20020112964A1 (en) * 2000-07-12 2002-08-22 Applied Materials, Inc. Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
US7147767B2 (en) * 2002-12-16 2006-12-12 3M Innovative Properties Company Plating solutions for electrochemical or chemical deposition of copper interconnects and methods therefor
US6884338B2 (en) 2002-12-16 2005-04-26 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
US6858124B2 (en) 2002-12-16 2005-02-22 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
KR100845534B1 (ko) * 2004-12-31 2008-07-10 엘지전자 주식회사 전도성 금속 도금 폴리이미드 기판 및 그 제조 방법
EP2568063A1 (fr) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Procédé d'électrodéposition de cuivre à faible contrainte interne
CN114107965A (zh) * 2021-10-29 2022-03-01 北京卫星制造厂有限公司 一种聚酰亚胺表面金属层制备方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4972139A (fr) * 1972-11-13 1974-07-12
JPS50104143A (fr) * 1974-01-23 1975-08-16
JPS5654076A (en) * 1979-10-09 1981-05-13 Toshiba Corp Detector for semiconductor radioactive ray
JPS57188693A (en) * 1981-03-26 1982-11-19 Hooker Chemicals Plastics Corp Electrodeposition of gloss copper
JPS58136794A (ja) * 1982-02-10 1983-08-13 Nippon Mining Co Ltd 酸性銅めつき液
JPS6133077A (ja) * 1984-07-26 1986-02-15 Hitachi Ltd 高圧安定化回路
JPS63195292A (ja) * 1987-02-10 1988-08-12 Kureha Chem Ind Co Ltd 含フツ素オレフイン樹脂成形物に厚い金属皮膜を形成する方法
JPS63286580A (ja) * 1987-02-24 1988-11-24 ポリオニクス・コーポレイション 表面模様付きのポリイミドフィルムから作製された金属被覆積層製品
JPH01123093A (ja) * 1987-11-05 1989-05-16 Seiko Epson Corp プラスチックへのメッキ方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4832799A (en) * 1987-02-24 1989-05-23 Polyonics Corporation Process for coating at least one surface of a polyimide sheet with copper
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4972139A (fr) * 1972-11-13 1974-07-12
JPS50104143A (fr) * 1974-01-23 1975-08-16
JPS5654076A (en) * 1979-10-09 1981-05-13 Toshiba Corp Detector for semiconductor radioactive ray
JPS57188693A (en) * 1981-03-26 1982-11-19 Hooker Chemicals Plastics Corp Electrodeposition of gloss copper
JPS58136794A (ja) * 1982-02-10 1983-08-13 Nippon Mining Co Ltd 酸性銅めつき液
JPS6133077A (ja) * 1984-07-26 1986-02-15 Hitachi Ltd 高圧安定化回路
JPS63195292A (ja) * 1987-02-10 1988-08-12 Kureha Chem Ind Co Ltd 含フツ素オレフイン樹脂成形物に厚い金属皮膜を形成する方法
JPS63286580A (ja) * 1987-02-24 1988-11-24 ポリオニクス・コーポレイション 表面模様付きのポリイミドフィルムから作製された金属被覆積層製品
JPH01123093A (ja) * 1987-11-05 1989-05-16 Seiko Epson Corp プラスチックへのメッキ方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6537411B1 (en) 1999-06-29 2003-03-25 The National University Of Singapore Method for low temperature lamination of metals to polyimides
JP2002050868A (ja) * 1999-08-06 2002-02-15 Ibiden Co Ltd 多層プリント配線板の製造方法
US7812262B2 (en) 1999-08-06 2010-10-12 Ibiden Co., Ltd. Multilayer printed circuit board
US7993510B2 (en) 1999-08-06 2011-08-09 Ibiden Co., Ltd. Electroplating solution, method for manufacturing multilayer printed circuit board using the same solution, and multilayer printed circuit board
JP2005154864A (ja) * 2003-11-27 2005-06-16 Kakihara Kogyo Kk 樹脂製筐体の高剛性・高硬度めっき方法
JP2013159784A (ja) * 2012-02-01 2013-08-19 Toyota Motor Corp めっき処理材の製造方法およびめっき処理材

Also Published As

Publication number Publication date
BR9004392A (pt) 1991-09-10
EP0419845A3 (en) 1991-11-13
KR910006008A (ko) 1991-04-27
EP0419845A2 (fr) 1991-04-03

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