JPH03166934A - 積層板 - Google Patents

積層板

Info

Publication number
JPH03166934A
JPH03166934A JP1305186A JP30518689A JPH03166934A JP H03166934 A JPH03166934 A JP H03166934A JP 1305186 A JP1305186 A JP 1305186A JP 30518689 A JP30518689 A JP 30518689A JP H03166934 A JPH03166934 A JP H03166934A
Authority
JP
Japan
Prior art keywords
polyphenylene oxide
group
metal foil
coupling agent
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1305186A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0565344B2 (th
Inventor
Hideto Misawa
英人 三澤
Takayoshi Koseki
高好 小関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP1305186A priority Critical patent/JPH03166934A/ja
Publication of JPH03166934A publication Critical patent/JPH03166934A/ja
Publication of JPH0565344B2 publication Critical patent/JPH0565344B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP1305186A 1989-11-25 1989-11-25 積層板 Granted JPH03166934A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1305186A JPH03166934A (ja) 1989-11-25 1989-11-25 積層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1305186A JPH03166934A (ja) 1989-11-25 1989-11-25 積層板

Publications (2)

Publication Number Publication Date
JPH03166934A true JPH03166934A (ja) 1991-07-18
JPH0565344B2 JPH0565344B2 (th) 1993-09-17

Family

ID=17942090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1305186A Granted JPH03166934A (ja) 1989-11-25 1989-11-25 積層板

Country Status (1)

Country Link
JP (1) JPH03166934A (th)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020185795A (ja) * 2019-05-13 2020-11-19 大日本印刷株式会社 積層体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020185795A (ja) * 2019-05-13 2020-11-19 大日本印刷株式会社 積層体

Also Published As

Publication number Publication date
JPH0565344B2 (th) 1993-09-17

Similar Documents

Publication Publication Date Title
EP1508594B1 (en) Resin composition and prepreg for laminate and metal-clad laminate
US4886858A (en) Thermosetting resin and prepreg and laminate using the same
US20080004367A1 (en) Curable resin composition
EP0449292B1 (en) Multilayer printed circuit board and production thereof
JPH03275760A (ja) ポリフェニレンオキサイド系樹脂組成物
JPH04258658A (ja) 難燃性熱硬化性樹脂組成物
JP2563137B2 (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物
JPH03166934A (ja) 積層板
JPH03165596A (ja) 多層積層板
JPH0652716A (ja) 複合誘電体および回路用基板
JPH0577706B2 (th)
JP2965277B2 (ja) ポリフェニレンオキサイド系樹脂組成物とこれを用いた金属箔張積層板
JPH0565345B2 (th)
JPH07103163B2 (ja) 熱硬化性樹脂組成物とその金属張積層板
JPH04161454A (ja) ポリフェニレンオキサイド系樹脂組成物
JPH0564586B2 (th)
JP3077550B2 (ja) 積層板の製造方法
JPH0231743B2 (ja) Jushisoseibutsu
JP2866661B2 (ja) 熱硬化性樹脂組成物並びにそれを用いたプリプレグおよび積層板
JPH03166255A (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物
JP2007051225A (ja) 高誘電率樹脂組成物
JPS62121759A (ja) ポリフエニレンオキサイド系樹脂組成物およびこの樹脂組成物からなるシ−ト
JPH10120611A (ja) エーテル結合を有する不飽和化合物及びその製造方法、並びに該化合物を含む組成物
JPH01215851A (ja) 難燃化ポリフェニレンオキサイド系樹脂組成物とその金属張積層板
JPS62121758A (ja) ポリフエニレンオキサイド系樹脂組成物およびこの樹脂組成物からなるシ−ト

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080917

Year of fee payment: 15

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080917

Year of fee payment: 15

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090917

Year of fee payment: 16

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090917

Year of fee payment: 16

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090917

Year of fee payment: 16

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees